ASML ships first-generation multibeam inspection system ‘eScan1000’
May 28 2020 - 10:00AM
ASML ships first-generation multibeam inspection system
‘eScan1000’The system supports semiconductor technology
development by delivering significantly improved throughput for
physical defect inspection and voltage contrast inspection at the
most advanced technology nodes.
San Jose, California, May 28, 2020 – ASML Holding NV (ASML)
today announced that it has completed system integration and
testing of its first-generation HMI multibeam inspection (MBI)
system for 5 nm nodes and beyond. The HMI eScan1000 demonstrated
successful multibeam operation, simultaneously scanning nine beams
on a number of test wafers. With nine beams, the eScan1000 will
increase throughput up to 600% compared to single e-beam inspection
tools for targeted in-line defect inspection applications.
The new MBI system includes an electron optics system capable of
creating and controlling multiple primary electron beamlets and
then collecting and processing the resulting secondary electron
beams, limiting beam-to-beam crosstalk to less than 2% and
delivering consistent imaging quality. It also features a
high-speed stage to increase the system’s overall throughput and a
high-speed computational architecture to process the streams of
data from the multiple beamlets in real time.
“As critical dimensions continue to shrink with each new
technology, ‘killer’ defects are becoming smaller and smaller,
reaching the point where many are no longer detectable with optical
inspection,” says Gary Zhang, vice president of HMI Product
Marketing at ASML. “Our new multibeam inspection system is able to
detect these smaller defects, while addressing previous e-beam
throughput constraints to make it more suitable for high-volume
manufacturing environments.”
By offering a range of beam currents, the eScan1000 is suitable
for both physical defect inspection and voltage contrast
inspection. This allows customers to target a wide range of defect
types both in R&D for process development and high-volume
manufacturing for excursion monitoring.
Additionally, its proprietary Supernova die-to-database defect
detection capability enables chipmakers to monitor for defects on
EUV masks using wafer print checks. It detects defects overlooked
by optical inspection systems in a fraction of the time that it
takes single e-beam solutions for high-volume manufacturing to do
so.
The first multibeam inspection system has shipped to a customer
this week for qualification. ASML plans to increase the number of
beams and beam resolution for future generations to align with
chipmakers’ product roadmap requirements.
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About ASMLASML is one of the world’s leading
manufacturers of chip-making equipment. Our vision is a world in
which semiconductor technology is everywhere and helps to tackle
society’s toughest challenges. We contribute to this goal by
creating products and services that let chipmakers define the
patterns that integrated circuits are made of. We continuously
raise the capabilities of our products, enabling our customers to
increase the value and reduce the cost of chips. By helping to make
chips cheaper and more powerful, we help to make semiconductor
technology more attractive for a larger range of products and
services, which in turn enables progress in fields such as
healthcare, energy, mobility and entertainment. ASML is a
multinational company with offices in more than 60 cities in 16
countries, headquartered in Veldhoven, the Netherlands. We employ
more than 25,300 people on payroll and flexible contracts
(expressed in full time equivalents). ASML is traded on Euronext
Amsterdam and NASDAQ under the symbol ASML. More information about
ASML, our products and technology, and career opportunities is
available on www.asml.com.
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