TowerJazz Announces the Availability of its Newly Released Advanced Stacked BSI Hybrid Bonding Technology
September 25 2019 - 5:00AM
NEWS ANNOUNCEMENT
FOR IMMEDIATE
RELEASE
New offering enables outstanding pixel
performance and significant competitive advantages for leading
growing markets including automotive, event-driven sensors and
high-end photography among others
MIGDAL HAEMEK, Israel, September 25,
2019 – TowerJazz (NASDAQ/TASE: TSEM), the global specialty
foundry leader, today announced the release of its highly advanced
65nm stacked BSI hybrid bonding technology manufactured in
Company’s 300mm facility in Uozu, Japan. This new offering,
implemented in pixel level, enables a significantly reduced pixel
size along with enhanced performance by splitting the pixel IC
functionality between two wafers. With a pitch smaller than 4µm,
sensors manufactured with this technology provide higher data rate,
lower power consumption, better performance, and smaller form
factor, accurately meeting the innovative requirements of
world-leading growing markets and applications including
automotive, high-end photography, event-driven sensors and Time of
Flight (ToF), among others.
“We are very pleased to announce this new and
highly advanced offering, providing our customers with extensive
technological solutions which enable them to competitively lead in
their markets,” said Dr. Avi Strum, senior vice president and
general manager of the Sensor Business Unit at TowerJazz. “As
always, we are greatly committed to bring to market the most
advanced technology and state-of-the-art pixel performance
providing strategic, value-add development opportunities and
roadmap”.
With pixel functionality split between wafers,
TowerJazz hybrid BSI stacking, electrically connects each of the
Photo Diodes (PD) in the imaging top wafer to the pixel circuit in
the bottom wafer. This new offering is an
expansion of the Company’s well-established and reputable CIS
technology which includes stitching with 1D and 2D for large format
sensors in the high-end photography, industrial and medical X-Ray
markets, as well as highly advanced SPAD technology profoundly used
in the rapidly growing automotive market with silicon proven pixels
that can be customized to customer specifications.
In addition, TowerJazz has recently expanded its
non-imaging sensor (NIS) technology platform portfolio serving
diversified market segments. The silicon based sensors are embedded
on the Company’s mature and well-established 180nm CMOS
manufacturing process and now include full system-on-chip, and
unique environmental sensor technology for gas, temperature and
time-to-temperature sensing, radiation and magnetic sensing, in
addition to a GaN based platform for high-temperature sensing
applications. TowerJazz NIS platform offers complimentary design
IPs and PDKs enabling design support and fast time-to-market.
Dr. Avi Strum will give a keynote presentation
at the upcoming MEMS & Imaging Sensor Summit to be held in
Grenoble, France on Sept. 25-27, 2019. The presentation, titled:
Considerations of Optical Fingerprint and 3D Face
Recognition Sensors for Cellular Security Applications, is
scheduled for Sept. 25th 5:30pm-6:00pm as part of the summit’s
opening session.For more information and details about the summit
please visit here.
For additional information about TowerJazz CIS
technology, please click here.For additional information about
TowerJazz non-imaging sensor technology, please click here.
About TowerJazz
Tower Semiconductor Ltd. (NASDAQ: TSEM, TASE:
TSEM) and its subsidiaries operate collectively under the brand
name TowerJazz, the global specialty foundry leader. TowerJazz
manufactures next-generation integrated circuits (ICs) in growing
markets such as consumer, industrial, automotive, medical and
aerospace and defense. TowerJazz’s advanced technology is comprised
of a broad range of customizable process platforms such as SiGe,
BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensor, integrated
power management (BCD and 700V), and MEMS. TowerJazz also provides
world-class design enablement for a quick and accurate design cycle
as well as Transfer Optimization and development Process Services
(TOPS) to IDMs and fabless companies that need to expand capacity.
To provide multi-fab sourcing and extended capacity for its
customers, TowerJazz operates two manufacturing facilities in
Israel (150mm and 200mm), two in the U.S. (200mm) and three
facilities in Japan (two 200mm and one 300mm) through its
partnership with Panasonic Semiconductor Solutions Co. LTD. For
more information, please visit www.towerjazz.com.
Safe Harbor Regarding Forward-Looking
StatementsThis press release includes forward-looking
statements, which are subject to risks and uncertainties. Actual
results may vary from those projected or implied by such
forward-looking statements. A complete discussion of risks and
uncertainties that may affect the accuracy of forward-looking
statements included in this press release or which may otherwise
affect TowerJazz’s business is included under the heading "Risk
Factors" in Tower’s most recent filings on Forms 20-F, F-3, F-4 and
6-K, as were filed with the Securities and Exchange Commission (the
“SEC”) and the Israel Securities Authority and Jazz’s most recent
filings on Forms 10-K and 10-Q, as were filed with the SEC,
respectively. Tower and Jazz do not intend to update, and expressly
disclaim any obligation to update, the information contained in
this release.
###
TowerJazz Company Contact: Orit
Shahar | +972-74-7377440 | oritsha@towersemi.comTowerJazz
Investor Relations Contact: Noit Levi | +972-4-604-7066 |
noit.levi@towerjazz.com
- TowerJazz's Newly Released Advanced Stacked BSI Hybrid Bonding
Technology
- CIS Stacked BSI Hybrid and Sensor Summit_FINAL
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