Kulicke & Soffa to Participate at SEMICON Korea 2018
January 29 2018 - 9:05AM
Business Wire
Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke
& Soffa”, “K&S” or the “Company”), announced today that it
will be exhibiting at the SEMICON Korea trade show in Seoul, South
Korea, from January 31 through February 2, 2018.
Kulicke & Soffa will be at the SEMICON Korea trade show
booth C400 Hall C, showcasing its latest equipment.
- RAPID™ Pro – the first in the latest
GEN-S high performance wire bonders series, RAPID™
Pro delivers advanced process capabilities, real-time
monitoring, diagnostics and traceability to ensure the highest
quality and efficient assembly of automotive as well as other high
performance semiconductor packages.
- AsterionTM – built on an architecture
with enhanced capabilities addresses the industry's growing and
evolving power control and storage needs. A single platform handles
a multitude of interconnect materials such as large aluminum
wire, PowerRibbon™ and interconnects for battery
cells.
- Hybrid Wafer Feeder – an innovative
solution that enables the combination of ultra-high-speed passive
and active placement with high-accuracy flip-chip bonding directly
from wafer is ideal for high-volume System-in-Package (SiP),
flip-chip, die-attach and wafer-level-package manufacturing.
Placement accuracy up to 7µm @ 3 sigma, provides a compelling
alternative to existing commercial solutions.
“The latest Rapid™ Pro is the first GEN-S Series of bonder with
the capabilities to deliver high yield and enable
machine-to-machine communication. Kulicke & Soffa continues
driving research and development investments delivering value-added
features supporting the smart-manufacturing technology and
improving the operational efficiency of customers,” said Nelson
Wong, Kulicke & Soffa’s Senior Vice President, Ball Bonder
Business Unit.
K&S consumable products including Quantis™ QFN and TeraCap™
capillaries, as well as FCC™ Plus and OptoTM Plus dicing blades,
will also be featured at the trade show.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of
semiconductor packaging and electronic assembly solutions
supporting the global automotive, consumer, communications,
computing and industrial segments. As a pioneer in the
semiconductor space, K&S has provided customers with market
leading packaging solutions for decades. In recent years, K&S
has expanded its product offerings through strategic acquisitions
and organic development, adding advanced packaging, electronics
assembly, wedge bonding and a broader range of expendable tools to
its core offerings. Combined with its extensive expertise in
process technology and focus on development, K&S is well
positioned to help customers meet the challenges of packaging and
assembling the next-generation of electronic devices.
(www.kns.com)
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version on businesswire.com: http://www.businesswire.com/news/home/20180129005065/en/
Kulicke & Soffa Industries, Inc.Marilyn SimPublic
RelationsP: +65-6880-9309F: +65-6880-9580msim@kns.comorJoseph
ElgindyInvestor Relations & Strategic InitiativesP:
+1-215-784-7500F: +1-215-784-6180investor@kns.com
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