Advantest’s New Massively Parallel Test Fixture Extends the T6391 System’s Capabilities to Include Chip-on-Film Testing o...
July 24 2017 - 3:05AM
Leading semiconductor test equipment supplier Advantest Corporation
(TSE:6857) has introduced the RND440 Type 3 fixture, an optional
enhancement on its T6391 display driver IC (DDI) tester that makes
the system capable of massively parallel testing of chip-on-film
(CoF) packages for the latest generation of smart phone screens.
The unit is designed to handle the growing number of pins on DDIs,
the increasing speeds of interfaces and the highly integrated
functions that enable high-resolution displays.
Mobile devices have evolved from using
traditional chip-on-glass (CoG) ICs to more advanced CoF devices
for several reasons. For example, today’s smart phones have
begun to incorporate OLED screens with rounded edges, which require
CoF packaging.
Along with CoF packaging, other developments are
driving the need for better test solutions. These include the
increasing number of output lines for DDIs used in smart phones,
tablet computers, notebooks and other products with LCD screens as
well as the growing use of touch embedded display driver ICs
(TDDI).
The new RND440 Type 3 fixture can perform both
high-pin-count, high-speed wafer testing and CoF testing, also
called tape testing. It can test all of the electrical
components within a CoF package, which include an IC mounted on a
base film, several passive elements and signal-input circuitry for
receiving and transmitting data. The fixture works with
substrates as large as 440 mm and its massively parallel testing
capability doubles the throughput of single-device systems on the
market.
“The T6391 system is the only highly parallel
package testing system for DDIs and TDDIs,” said Satoru Nagumo,
executive vice president of the ADS Business Group at Advantest
Corporation. “Our test solution provides users with a huge
productivity advantage and the lowest available cost of test for
DDIs and TDDIs in either production or engineering
environments.”
Advantest’s T6391 system uses the same
engineering environment model and TDL programming language as other
members of the T6300 product series while providing faster data
transfer and calculation. It is the only platform capable of
testing touch-sensor functions and power-management IC (PMIC)
functions integrated in DDIs. It can accommodate high-resolution
DDIs with up to 3,584 pins, sufficient for testing LCDs used in
full high-definition (HD), WXGA and HD720 displays.
A stand-alone T6391 can handle I/O pin
frequencies up to 1.6 gigabits per second (Gbps) while the addition
of a separate measurement module allows it to test interfaces up to
6.5 Gbps, which will be used in the DDIs for ultra-high-definition
televisions including the 4K (2160p) generation.
The RND440 Type 3 fixture has already begun
shipping to customers earlier this calendar year.
About Advantest CorporationA world-class
technology company, Advantest is the leading producer of automatic
test equipment (ATE) for the semiconductor industry and a premier
manufacturer of measuring instruments used in the design and
production of electronic instruments and systems. Its
leading-edge systems and products are integrated into the most
advanced semiconductor production lines in the world. The
company also focuses on R&D for emerging markets that benefit
from advancements in nanotech and terahertz technologies, and has
introduced multi-vision metrology scanning electron microscopes
essential to photomask manufacturing, as well as groundbreaking 3D
imaging and analysis tools. Founded in Tokyo in 1954, Advantest
established its first subsidiary in 1982, in the USA, and now has
subsidiaries worldwide. More information is available at
www.advantest.com.
ADVANTEST CORPORATION
3061 Zanker Road
San Jose, CA 95134, USA
Judy Davies
Judy.davies@advantest.com