Kulicke & Soffa to Participate at SEMICON China 2017
March 10 2017 - 9:05AM
Business Wire
Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke
& Soffa”, “K&S” or the “Company”), announced today that it
will be exhibiting at the SEMICON China 2017 trade show in
Shanghai, China, from March 14 to 16, 2017.
Kulicke & Soffa will be launching its new assembly and
packaging solutions at Shanghai New International Expo Centre, Hall
W4, Booth Number 4451.
- ConnXPS
ELITETM, latest high speed wire bonder for discrete
and low pin count packages. Its enhanced motion control systems and
Quick SuiteTM processes deliver maximum productivity and simplified
process optimization.
- AsterionTM EVC
(Extended Version C), an extended version of the Asterion wedge
bonder, with a bondable area of 300mm X 860mm, is built on a
reengineered architecture with enhanced capability to handle a
multitude of interconnect materials. The enlarged bondable area
enhances flexibility and productivity for Battery Bonding, directly
benefiting cost of ownership.
- AsterionTM C, a
hybrid wedge bonder with enhanced capabilities that includes an
expanded bond area, new robust pattern recognition capabilities and
extremely tight process controls. If offers a large bondable area
of 300mm X 300mm which reduces indexing time while improving MTBA
(Mean-Time-Between-Assists). These advanced features deliver
heightened productivity, bonding quality and reliability.
- APAMATM DA (Die
Attach), latest high performance and productivity die attach
bonder for single or stack die bonding. This next generation
platform delivers industry leading throughput and best-in-class
yields by leveraging on the unique advances in functionality.
- FCC™ Plus, latest hub blades
designed to fulfill the growing process requirement in the advanced
packaging, flip chip and WLP wafer dicing markets. With the add-on
features such as vibration control for high RPM application and
anti-corrosion for acidic coolant environment, it delivers superior
cut quality and useful life to drive accuracy reducing cost of
ownership.
- OptoTM Plus,
enhanced blades for LED package singulation, with new features such
as vibration control for high RPM application, optional small hub
design to reduce blade loading, and special slit option to enhance
blade cooling and facilitate debris removal.
Other leading packaging solutions such as the
IConnPS MEM PLUSTM high performance
bonder for memory devices, Hybrid multi-application
equipment for advanced packaging and iFlex T2
multifunction equipment which is ideal for an Electronics Assembly
production line will also be featured at the K&S booth.
“The semiconductor market continues to evolve rapidly, with
increasing demand in solutions to meet the assembly and packaging
technologies. K&S looks forward to showcasing and sharing our
latest leading packaging solutions to meet the industry’s growing
demand and challenges,” said Yih-Neng Lee, Kulicke & Soffa’s
Senior Vice President of Global Sales and Services.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of
semiconductor packaging and electronic assembly solutions
supporting the global automotive, consumer, communications,
computing and industrial segments. As a pioneer in the
semiconductor space, K&S has provided customers with market
leading packaging solutions for decades. In recent years, K&S
has expanded its product offerings through strategic acquisitions
and organic development, adding advanced packaging, electronics
assembly, wedge bonding and a broader range of expendable tools to
its core offerings. Combined with its extensive expertise in
process technology and focus on development, K&S is well
positioned to help customers meet the challenges of packaging and
assembling the next-generation of electronic devices.
(www.kns.com)
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version on businesswire.com: http://www.businesswire.com/news/home/20170310005033/en/
Kulicke & Soffa Industries, Inc.Marilyn SimPublic
RelationsP: +65-6880-9309F: +65-6880-9580msim@kns.comorKulicke
& Soffa Industries, Inc.Joseph ElgindyInvestor Relations
& Strategic InitiativesP: +1-215-784-7500F:
+1-215-784-6180investor@kns.com
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