Lab4MEMS Project Recognized With Important European Innovation Award
November 28 2016 - 9:10AM
The Electronic Components and Systems
for European Leadership (ECSEL) Joint Undertaking
announced the
Lab4MEMS project as the winner of
its 2016 Innovation Award during the European Nanoelectronics
Forum, in Rome, Italy.
At its launch in January 2014, Lab4MEMS was identified as a Key
Enabling Technology Pilot-Line project for next-generation
Micro-Electro-Mechanical Systems (MEMS) devices augmented with
advanced technologies such as piezoelectric or magnetic materials
and 3D packaging to enhance the next generation of smart sensors,
actuators, micro-pumps, and energy harvesters. These technologies
were recognized as important contributors to future data-storage,
printing, healthcare, automotive, industrial-control, and
smart-building applications, as well as consumer applications such
as smartphones and navigation devices.
In accepting the award, Roberto Zafalon, General Project
Coordinator of Lab4MEMS and the European Programs Manager in
R&D and Public Affairs for STMicroelectronics Italy said, "The
ECSEL Innovation Award highlights the excellent results the
Lab4MEMS team achieved through the project's execution and the high
impact of its successes. In particular, Lab4MEMS developed
innovative MEMS solutions with advanced piezoelectric and magnetic
materials, including advanced 3D Packaging technologies."
In coordinating the €28m[1], 36-month Lab4MEMS project, ST led
the team of twenty partners, which included universities, research
institutions, and technology businesses across ten European
countries. ST's MEMS facilities in Italy and Malta contributed
their complete set of manufacturing competencies for
next-generation devices, spanning design and fabrication to test
and packaging to the project.
Lab4MEMS' devices, technologies, and application
improvements emphasized:
- Micro-actuators, micro-pumps, sensors, and energy scavengers
integrated on silicon-based MEMS using piezoelectric thin-films
(PZT), for applications in Data Storage, Printing, Health Care,
Automotive, Energy Scavenging, and Autofocus Lenses.
- Magnetic-field sensors, for applications in consumer
applications such as GPS positioning, indoor navigation, and mobile
phones.
- Advanced packaging technologies and vertical interconnections,
including flip chip, Through Silicon Via (TSV) or Through Mold Via
(TMV) for full 3D integration, which could be used in Consumer and
Healthcare applications such as body-area sensors and remote
monitoring.
All of these successes contributed to the Lab4MEMS project and
are available to benefit the contributors. These participants were
Politecnico di Torino (Italy); Fondazione Istituto Italiano di
Tecnologia (Italy); Politecnico di Milano (Italy); Consorzio
Nazionale Interuniversitario per la Nanoelettronica (Italy);
Commissariat à l'Energie Atomique et aux énergies
alternatives (France); SERMA Technologies SA (France);
STMicroelectronics Ltd. (Malta); Universita ta Malta (Malta);
Solmates BV (Netherlands); Cavendish Kinetics BV (Netherlands);
Okmetic OYJ (Finland); VTT (Finland); Picosun OY (Finland);
KLA-Tencor ICOS (Belgium); Universitatea Politehnica din Bucuresti
(Romania); Instytut Technologii Elektronowej (Poland); Stiftelsen
SINTEF (Norway); Sonitor Technologies AS (Norway); BESI GmbH
(Austria).
Press Information Contact for the Project
Coordinator:
STMicroelectronics Michael Markowitz Director of Technical Media
Relations +1 781 591 0354
michael.markowitz@st.com
[1] The total cost of the project - € 28.2 million - was
supported in part by funding from the ECSEL Joint Undertaking and
by contributions from each of the respective National agencies:
Italy, France, Malta, The Netherlands, Finland, Belgium, Poland,
Norway, Austria, Romania.
Attachments:
http://www.globenewswire.com/NewsRoom/AttachmentNg/3528fc98-9526-43e9-9fc7-552845234a49
Attachments:
A photo accompanying this announcement is available at
http://www.globenewswire.com/NewsRoom/AttachmentNg/58bc7ac2-94f2-4219-b124-e313a3235239
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