Rudolph Receives Multi-System Order for Over $11 Million From a Leading OSAT for Fan-out Wafer Level Packing Inspection
June 28 2016 - 6:30AM
Business Wire
Rudolph Inspection, Metrology and Analysis
selected for large-scale ramp of Fan-out Wafer Level Package
Production (FOWLP).
Rudolph Technologies, Inc. (NYSE:RTEC), a leader in the design,
development, manufacture and support of defect inspection,
lithography, metrology, and process control software used by
semiconductor and advanced packaging device manufacturers
worldwide, announced today that a leading OSAT in Asia has placed
an order for over $11 million USD for an integrated solution
consisting of multiple process control inspection systems and yield
management software suite. The solutions will be deployed into
multiple applications including whole wafer inspection, 3D bump
metrology and post-saw die inspection. The systems will begin
shipping in Q2 2016, with the majority of the order shipping the
second half of 2016.
“We are pleased with this order and the confirmation of Rudolph
Technologies’ fan-out wafer level packaging (FOWLP) solution
portfolio,” said Mike Goodrich, vice president and general manager
of Rudolph’s Process Control Group Business Unit. “Key factors of
this win were the systems’ unique FOWLP process control
capabilities including superior defect capture and identification
rate, combination 2D+3D metrology and flexible wafer automation
solutions. All systems will be equipped with
Rudolph’s Discover® Yield Management Software and
TrueADC® Classification software that enhances the user’s process
analysis capability, enabling our customers to make targeted
data-driven decisions increasing the total productivity of the
overall fab.”
“FOWLP is growing rapidly, and to facilitate that growth Rudolph
has focused on integrating technologies into solutions for
monitoring and characterizing manufacturing lines particularly in
the areas of bump processing as well as die singulation quality
control,” said Mike Plisinski, chief executive officer of Rudolph.
“This continued investment by a leader in FOWLP underscores the
importance of our solutions and the compelling value they provide.
This investment is further confirmation of the advanced packaging
sector’s growth rate as our industry continues the transition
towards cost effective, high performance packaging solutions.”
The NSX® Series inspection system product family is the market
leader for automated macro defect inspection and metrology for
advanced packaging manufacturing. The NSX 330 Series is a proven
enabler of advanced packaging processes, by directly improving the
cost-of-ownership with its capability to address multiple process
steps in a single platform. The NSX 330 Series boasts flexible
handling and sensor options, that when combined with advanced
process management software capabilities, provides users with an
unprecedented level of process control solutions.
Discover YMS Software is Rudolph’s in-line defect, metrology and
data management system designed to enhance Rudolph’s process
analysis capability in real-time and post inspection analysis.
While inspection and metrology systems provide a snapshot of the
wafer or lots, limiting process correlation to a single event,
Discover software collects individual tool results and provides an
advanced statistical analysis of those results, allowing users to
drill down into the data to reveal defect and metrology trends,
wafer-level signatures, defect source analysis and metrology
correlations. Discover software offers full characterization of
inspection data, resulting in high productivity and demonstrable
quality improvements.
TrueADC software is Rudolph’s automatic defect classification
software designed to automatically categorize defects detected by
the NSX systems according to the defect’s attributes, enabling
quick, consistent, and accurate classification without assistance
from human operators. Accurate classification of the defect type is
critical for users to identify root causes of process
excursions.
For more information about Rudolph’s NSX systems, Discover
software, and TrueADC software, please
visit http://www.rudolphtech.com
About Rudolph Technologies
Rudolph Technologies, Inc. is a leader in the design,
development, manufacture and support of defect inspection,
lithography, process control metrology, and process control
software used by semiconductor and advanced packaging device
manufacturers worldwide. Rudolph delivers comprehensive solutions
throughout the fab with its families of proprietary products that
provide critical yield-enhancing information, enabling
microelectronic device manufacturers to drive down costs and time
to market of their devices. Headquartered in Wilmington,
Massachusetts, Rudolph supports its customers with a worldwide
sales and service organization. Additional information can be found
on the Company’s website at www.rudolphtech.com.
Safe Harbor Statement
This press release contains forward-looking statements within
the meaning of the Private Securities Litigation Reform Act of 1995
(the “Act”) which include the benefit to customers of Rudolph’s
products and customer service, Rudolph’s ability to deliver
products and services consistent with our customer’s demands and
expectations and Rudolph’s ability to strengthen our market
position as well as other matters that are not purely historical
data. Rudolph wishes to take advantage of the “safe harbor”
provided for by the Act and cautions that actual results may differ
materially from those projected as a result of various factors,
including risks and uncertainties, many of which are beyond
Rudolph’s control. Such factors include, but are not limited to,
the challenges presented by the new product development and
marketing, Rudolph’s ability to develop, deliver and support a
broad range of products, expand its markets and develop new
markets, offered design enhancements may not necessarily translate
into significant revenue and fluctuations in customer capital
spending. Additional information and considerations regarding the
risks faced by Rudolph are available in Rudolph’s Form 10-K report
for the year ended December 31, 2015 and other filings with the
Securities and Exchange Commission. As the forward-looking
statements are based on Rudolph’s current expectations, the company
cannot guarantee any related future results, levels of activity,
performance or achievements. Rudolph does not assume any obligation
to update the forward-looking information contained in this press
release.
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version on businesswire.com: http://www.businesswire.com/news/home/20160628005536/en/
Investors:Rudolph Technologies, Inc.Steven R. Roth,
973-448-4302steven.roth@rudolphtech.comorGuerrant AssociatesLaura
Guerrant-Oiye, 808-882-1467Principallguerrant@guerrantir.comorTrade
Press:MindWrite Communications, Inc.Sandy Fewkes,
408-224-4024sandy@mind-write.com
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