MIGDAL HAEMEK, Israel,
June 22, 2016 /PRNewswire/ --
Camtek Ltd. (NASDAQ: CAMT; TASE: CAMT), today announced the
launch of an innovative inspection method for Fan-Out Wafer Level
Packaging (FOWLP). This new inspection method compares the image
acquisition of the dies on the reconstructed wafer with the
computer-aided design (CAD) data used in fabricating the wafer.
Ramy Langer, Vice President
and Head of Camtek's Semiconductor Division, commented, "Camtek
has more than 25 years of experience working with CAD data in our
Automated Optical Inspection (AOI) systems for the PCB industry.
The development of this new method for the inspection of Fan-Out
applications is based on this experience and accumulated
know-how."
Continued Mr. Langer: "Industry experts expect Fan-out
wafer level packaging technology to grow in excess of 30% annually
over the coming years. The Fan-out packaging process imposes many
inspection challenges, especially due to alignment issues. We
believe that using the CAD as a reference for detecting the
reconstructed wafers will make our Eagle product the tool of choice
for Fan-out applications."
ABOUT CAMTEK LTD.
Camtek Ltd. provides automated and technologically advanced
solutions dedicated to enhancing production processes, increasing
products yield and reliability, enabling and supporting customer's
latest technologies in the Semiconductors, Printed Circuit Boards
(PCB) and IC Substrates industries.
Camtek addresses the specific needs of these interconnected
industries with dedicated solutions based on a wide and advanced
platform of technologies including intelligent imaging, image
processing and functional 3D inkjet printing.
This press release is available at http://www.camtek.com
This press release may contain projections or other
forward-looking statements regarding future events or the future
performance of the Company. These statements are only predictions
and may change as time passes. We do not assume any obligation to
update that information. Actual events or results may differ
materially from those projected, including as a result of changing
industry and market trends, reduced demand for our products, the
timely development of our new products and their adoption by the
market, increased competition in the industry, intellectual
property litigation, price reductions as well as due to risks
identified in the documents filed by the Company with the
SEC.
CAMTEK LTD.
Moshe Eisenberg, CFO
Tel: +972 4 604 8308
Mobile: +972-54-900-7100
moshee@camtek.com
INTERNATIONAL INVESTOR RELATIONS
GK Investor Relations
Ehud Helft
Tel: (US) +1-646-201-9246
camtek@gkir.com
SOURCE Camtek Ltd