Rambus to Speak at the 2015 Design Automation Conference (DAC)
June 04 2015 - 5:00PM
Business Wire
Rambus Inc.:
Who:
Rambus, Inc. (NASDAQ: RMBS)
Where:
DAC 2015 Moscone Convention Center San Francisco, CA Rambus
participating in the ARM Connected Community booth #2414
When:
June 7 – 11, 2015
At the Design Automation Conference (DAC) 2015, the premier
event for design and automation of electronic systems, Rambus will
take part in multiple talks discussing low-power, high-performance
memory and serial link solutions for mobile, consumer and
enterprise applications. Rambus will also lead a session covering
the unique requirements in designing secure chips. In addition,
Rambus will be showcasing its high-performance, low-power solutions
within the ARM Connected Community Pavilion. For additional
details, visit www.rambus.com.
Rambus Participation at DAC:
Dates: Monday, June 8, 2015, 3:45 p.m. PDT and Tuesday,
June 9, 2015, 10:45 a.m. PDTTitle: The Next Wave of
Low-Power, High-Performance Mobile MemoryFocus: The increase
in image capture, display resolution and frame rates continue to
drive the need for more memory bandwidth and density in mobile
devices. The latest high-end smartphones include LPDDR4 DRAM to
deliver increased performance with reduced power consumption. This
presentation will discuss advanced memory subsystems including the
Rambus memory PHY with low-cost packaging, and its interface to the
CoreLink DMC Memory Controller.Speaker: Ajay Jain, director
of product marketing, RambusLocation: ARM connected
Community Theater, booth# 2414
Dates: Tuesday, June 9, 2015, 2:30 p.m. PDTTitle:
High-speed, Low-power Memory and Serial Links for Today’s Consumer
and Networking ApplicationsFocus: Increasing demands for
mobile and cloud applications continue to drive the need for higher
performance and improved power efficiency. Rambus has partnered
with Samsung foundry to deliver best-in-class industry standard
interfaces implemented in high-volume process technologies,
providing robust solutions for a new generation of consumer and
networking devices. This presentation will discuss how these market
trends translate into requirements for high-speed memory and serial
link interfaces and how the combination of Rambus IP and Samsung
process offers considerable power and performance advantages to our
mutual customers.Speaker: Frank Ferro, senior director of
product marketing, RambusLocation: Samsung Electronics
Booth, booth#933
Dates: Thursday, June 11, 2015, 4 p.m. PDTTitle:
Special Session 69: The Lifecycle of Secure Chip
DesignFocus: This session collects three talks that, taken
together, describe the design lifecycle of a cryptographic chip.
They highlight the unique requirements when designing secure chips
that are subject to physical and logical threats, in particular
when those chips may be physically reverse
engineered.Speaker: Megan Wachs, ASIC design engineering,
Rambus Cryptography Research DivisionLocation: Room #300
Follow RambusCompany website: rambus.comRambus
blog: rambusblog.comTwitter: @rambusincLinkedIn: www.linkedin.com/company/rambusFacebook: www.facebook.com/RambusInc
About Rambus Inc.
Rambus brings invention to market. Our customizable IP cores,
architecture licenses, tools, services, and training improve the
competitive advantage of our customer’s products while accelerating
their time-to-market. Rambus products and innovations capture,
secure and move data. For more information, visit rambus.com.
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version on businesswire.com: http://www.businesswire.com/news/home/20150604006461/en/
For RambusSimone Souza,
408-462-8859ssouza@rambus.comorFor Racepoint GlobalHilary
Costa, 415-694-6705hcosta@racepointglobal.com
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