NEW
YORK, June 19, 2024 /PRNewswire/ -- The global
fan-out wafer level packaging market size is estimated to
grow by USD 5.52 billion from
2024-2028, according to Technavio. The market is estimated to grow
at a CAGR of over 23.77% during the forecast
period. Increased demand for compactly designed
electronics is driving market growth, with a trend
towards increasing adoption of semiconductor ics in
automobiles. However, increased production costs because of
warpage poses a challenge. Key market players include Amkor
Technology Inc., ASE Technology Holding Co. Ltd., Deca Technologies
Inc., Infineon Technologies AG, Jiangsu Changdian Technology Co.
Ltd., nepes Corp., Nordson Corp., NXP Semiconductors NV, Onto
Innovation Inc., Panasonic Holdings Corp., Powertech Technology
Inc., Renesas Electronics Corp., Singapore Semiconductor Industry
Association, SUSS MICROTEC SE, Taiwan Semiconductor Manufacturing
Co. Ltd., Unisem M Berhad, UTAC Holdings Ltd., Winbond Electronics
Corp., Yield Engineering Systems, and Yole Developpement SA.
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Forecast
period
|
2024-2028
|
Base Year
|
2023
|
Historic
Data
|
2018 - 2022
|
Segment
Covered
|
Technology (High
density and Standard density), Type (200 mm, 300 mm, and Panel),
and Geography (APAC, North America, Europe, South America, and
Middle East and Africa)
|
Region
Covered
|
APAC, North America,
Europe, South America, and Middle East and Africa
|
Key companies
profiled
|
Amkor Technology Inc.,
ASE Technology Holding Co. Ltd., Deca Technologies Inc., Infineon
Technologies AG, Jiangsu Changdian Technology Co. Ltd., nepes
Corp., Nordson Corp., NXP Semiconductors NV, Onto Innovation Inc.,
Panasonic Holdings Corp., Powertech Technology Inc., Renesas
Electronics Corp., Singapore Semiconductor Industry Association,
SUSS MICROTEC SE, Taiwan Semiconductor Manufacturing Co. Ltd.,
Unisem M Berhad, UTAC Holdings Ltd., Winbond Electronics Corp.,
Yield Engineering Systems, and Yole Developpement SA
|
Key Market Trends Fueling Growth
The automotive industry's shift from mechanical and hydraulic
systems to electronic or hybrid alternatives, driven by the rise of
autonomous cars, is fueling the demand for semiconductor ICs and
sensors. This trend is leading to the increased adoption of FOWLP
(Fan-Out Wafer Level Packaging) technology in the automotive
sector. Major car manufacturers like Audi, General Motors, and
Tesla are investing in ICs and sensors for advanced driver
assistance systems (ADAS) and autonomous vehicles. FOWLP offers
high material density, greater I/O points, and improved
reliability, making it the preferred packaging solution for
automotive ICs. Safety regulations and the need for smart
automotive solutions are also driving the demand for MEMS sensors,
further boosting the FOWLP market.
The Fan-Out Wafer Level Packaging (FO-WLP) market is
experiencing significant growth, driven by the increasing demand
for smaller, more efficient semiconductor devices. Memory and logic
semiconductors are the primary applications for FO-WLP technology.
The use of FO-WLP in power management and sensor applications is
also on the rise. The trend towards higher integration and
miniaturization in electronics is fueling the adoption of FO-WLP.
The technology offers several advantages, including reduced power
consumption, improved reliability, and increased design
flexibility. The future looks bright for FO-WLP, with continued
innovation and advancements expected in this dynamic
market.
Research report provides comprehensive data on
impact of trend. For more details- Download a Sample
Report
Market Challenges
- The FOWLP market faces challenges due to warpage issues, which
increase production costs. Warpage is a distortion in the molded
part's surface, leading to wafer deformation and wastage.
Differential shrinkage, thermal expansion mismatches, and
post-processing steps are common causes. These issues result in
higher manufacturing and packaging costs for ICs, potentially
hindering market growth.
- The Fan-Out Wafer Level Packaging (FO-WLP) market faces several
challenges. One challenge is the complexity of the technology,
which requires precise chip placement and interconnect design.
Another challenge is the high cost of FO-WLP compared to
traditional packaging methods. Additionally, the need for high
yield and reliability in FO-WLP is crucial for mass production.
Furthermore, the integration of different materials and processes
in FO-WLP can be difficult, requiring advanced manufacturing
techniques. Lastly, the increasing demand for smaller form factors
and higher performance in electronic devices puts pressure on the
FO-WLP industry to continuously innovate and improve.
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challenges - Download a Sample Report
Segment Overview
This fan-out wafer level packaging market report extensively
covers market segmentation by
- Technology
- 1.1 High density
- 1.2 Standard density
- Type
- 2.1 200 mm
- 2.2 300 mm
- 2.3 Panel
- Geography
- 3.1 APAC
- 3.2 North America
- 3.3 Europe
- 3.4 South America
- 3.5 Middle East and
Africa
1.1 High density- The Fan-Out Wafer Level Packaging
(FO-WLP) market is experiencing significant growth due to the
increasing demand for miniaturization and higher integration in
semiconductor devices. FO-WLP technology enables the direct
connection of dies to the substrate, reducing the number of
interconnects and improving overall performance. Companies such as
Samsung, Micron, and SK Hynix are leading the market with their
innovative FO-WLP solutions. This technology is particularly
beneficial for memory and logic applications, leading to its
widespread adoption in the consumer electronics and automotive
industries.
For more information on market segmentation with
geographical analysis including forecast (2024-2028) and historic
data (2018 - 2022) - Download a Sample Report
Research Analysis
The Fan-Out Wafer Level Packaging (FO-WLP) market is
experiencing significant growth in various sectors, including
consumer electronics and advanced electronics. FO-WLP is a
semiconductor-based technology that enables footprint-sensitive
devices, such as smartphones, smartwatches, and laptops, to
incorporate high-performing ICs with minimal increase in size and
weight. This technology utilizes advanced packaging methods, such
as PoP (Package-on-Package) and memory-on-logic solutions, to
enhance the functionality of consumer electronics. FO-WLP also
addresses thermal issues by employing wafer-level packaging and
wafer-level processes. The IC packaging technology reduces
manufacturing costs and enables heterogeneous integration and panel
level technology in ultra-thin portable devices. FO-WLP is
revolutionizing the consumer electronics sector by enabling the
production of high-performing, compact devices.
Market Research Overview
The Fan-Out Wafer Level Packaging (FO-WLP) market refers to the
technology and process of integrating various semiconductor devices
onto a single wafer using wafer-level packaging techniques. This
packaging method offers several advantages such as reduced
interconnect resistance, improved reliability, and enhanced system
performance. The FO-WLP market caters to various applications
including memory, logic, and sensor technologies. The technology is
gaining popularity due to the increasing demand for
miniaturization, higher integration density, and the need for
advanced packaging solutions in the electronics industry. The
market is expected to grow significantly in the coming years due to
the increasing adoption of FO-WLP in advanced semiconductor
applications. The process involves various techniques such as
redistribution layer (RDL) formation, wafer bonding, and final
packaging. The market is driven by factors such as the increasing
demand for high-performance and power-efficient semiconductor
devices, the miniaturization trend in the electronics industry, and
the growing adoption of advanced packaging solutions.
Table of Contents:
1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation
- Technology
-
- High Density
- Standard Density
- Type
-
- Geography
-
- APAC
- North America
- Europe
- South America
- Middle East And Africa
7 Customer Landscape
8 Geographic Landscape
9 Drivers, Challenges, and Trends
10 Company Landscape
11 Company Analysis
12 Appendix
About Technavio
Technavio is a leading global technology research and advisory
company. Their research and analysis focuses on emerging market
trends and provides actionable insights to help businesses identify
market opportunities and develop effective strategies to optimize
their market positions.
With over 500 specialized analysts, Technavio's report library
consists of more than 17,000 reports and counting, covering 800
technologies, spanning across 50 countries. Their client base
consists of enterprises of all sizes, including more than 100
Fortune 500 companies. This growing client base relies on
Technavio's comprehensive coverage, extensive research, and
actionable market insights to identify opportunities in existing
and potential markets and assess their competitive positions within
changing market scenarios.
Contacts
Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/
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SOURCE Technavio