InvenSense® Announces UltraPrint™ Mass-Manufacturable Ultrasound Fingerprint Touch Sensor Solution
October 28 2015 - 9:07AM
Business Wire
InvenSense, Inc. (NYSE:INVN), the leading provider of MEMS
sensor platforms, today announced it has released for OEM review
UltraPrint™, its ultrasonic fingerprint imaging solution,
manufactured on the proprietary InvenSense CMOS-MEMS Platform
(ICMP), offering ramp to production in calendar year 2017. As the
world’s largest fabless MEMS SOC innovator and source for the
eutectically bonded ICMP, InvenSense ships, on average, over twelve
million motion or audio sensor SOCs each week to leading global
mobile and IoT OEMs.
By adding aluminum nitride-based piezoelectric capacity to its
platform, InvenSense is enabling, for the first time, mass
manufacture of unique piezoelectric Micromachined Ultrasonic
Transducers (pMUT) and transducer arrays, with each transducer
element individually controllable through direct wafer-level
interconnect to the CMOS ASIC.
This dramatic advancement in acoustic imaging technology will
allow manufacturers to seamlessly integrate, on a platform proven
capable of accommodating exceptionally high volumes, detailed
fingerprint images from the epidermal to dermal layers, and to do
so directly through glass or metal, even in the presence of oil,
lotions, perspiration or other moisture, and other common
contaminants that can easily undermine legacy capacitive solutions.
These critical factors enhance live finger authentication and guard
against spoofing, thereby increasing security.
Fari Assaderaghi, InvenSense’s Vice President Advanced
Technology, commented: “Our proprietary UltraPrint technology is
expected to enable, for the first time, deployment of ultrasonic
fingerprint solutions under glass, as well as a myriad of other
surfaces. This flexibility in sensor placement without cutting a
hole in display glass, aluminum, steel or plastic case material is
highly valued by mobile and other OEMs. Our innovative team is
excited to work with equally motivated partners to quickly bring
this new technology to market.”
Mo Maghsoudnia, InvenSense’s Vice President Worldwide
Manufacturing, added: “As a leading innovator in MEMS and sensor
technology globally, and the world’s only fabless MEMS SOC vendor
selling hundreds of millions of motion and audio sensors each year,
we have a proven track record of rapidly ramping up innovative new
MEMS solutions into mass production. We’re excited to extend the
InvenSense CMOS-MEMS Platform to pMUT devices and enable a
breakthrough authentication solution for leading mobile and IoT
products.”
For additional information about UltraPrint™ ultrasonic
fingerprint imaging solution, please contact InvenSense Marketing
at marketing@invensense.com.
Forward-Looking Statements
This press release contains forward-looking statements within
the meaning of Section 27A of the Securities Act of 1933 and
Section 21E of the Securities Exchange Act of 1934, including
statements regarding the features and benefits of InvenSense’s
products and the anticipated impact of its new products to advance
acoustic imaging technology and deployment of ultrasonic
fingerprint solutions on a global scale. Actual results may vary
materially due to a number of factors including, but not limited
to, the risk that InvenSense’s products do not operate as intended
or do not receive market acceptance, the loss of a key customer,
claims of technology infringement, general economic conditions and
other risks detailed from time to time in InvenSense’s Quarterly
Report on Form 10-Q for the quarter ended June 28, 2015 and other
SEC reports, which can be found at www.sec.gov. Readers are
cautioned not to place undue reliance on these forward-looking
statements, which speak only as of the date hereof. InvenSense
undertakes no obligation to publicly release or otherwise disclose
the result of any revision to these forward-looking statements that
may be made as a result of events or circumstances after the date
hereof or to reflect the occurrence of unanticipated events.
About InvenSense
InvenSense, Inc. (NYSE:INVN) is the world’s leading provider of
MEMS sensor platforms. The company’s patented InvenSense
Fabrication Platform and MotionFusion® technology address the
emerging needs of many mass-market consumer applications via
improved performance, accuracy, and intuitive motion-, gesture- and
sound-based interfaces. InvenSense technology can be found in
Mobile, Wearables, Smart Home, Industrial, and Automotive products.
InvenSense is headquartered in San Jose, California and has offices
in Boston, China, Taiwan, Korea, Japan, France, Canada, Slovakia
and Italy. More information can be found at www.invensense.com or
follow us on Twitter at @InvenSense.
©2015 InvenSense, Inc. All rights reserved. InvenSense, Sensing
Everything, UltraPrint, FireFly, MotionTracking, MotionProcessing,
MotionProcessor, MotionFusion, MotionApps, InvenSenseTV, DMP, AAR,
and the InvenSense logo are trademarks of InvenSense, Inc. Other
company and product names may be trademarks of the respective
companies with which they are associated.
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version on businesswire.com: http://www.businesswire.com/news/home/20151028005518/en/
InvenSense, Inc.David Almoslino, 408-501-2278Senior
DirectorCorporate Marketingpr@invensense.com
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