Mattson Technology Introduces Helios XP(TM) and Extends RTP Leadership Into Logic and Foundry Market
August 31 2009 - 8:30AM
Marketwired
Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of
advanced process equipment used to manufacture semiconductors,
today announced the release of the Helios XP™ system, the company's
latest innovation targeted to meet the stringent requirements of
advanced rapid thermal processing (RTP) for 45nm node and below.
The third generation of 300-millimeter RTP tools strengthens
Mattson's RTP market leadership for advanced chip manufacturing,
extending its strong memory market position into logic and foundry
segments. The company noted that its Helios XP system has been in
qualification at a major IC manufacturer and it recently shipped a
system to a leading foundry customer for advanced anneal
processing.
Senior Vice President and General Manager of Mattson
Technology's Thermal Products Group, Andreas Toennis, noted, "We
are extremely pleased with the Helios XP's performance against
leading customers' most advanced anneal application requirements.
Helios XP offers the industry's first RTP processing capabilities
at temperatures down to 220 degrees Celsius and below, enabling the
advancement of future technology node development including the
formation of advanced silicides. In addition, temperature and
ambient controls have greatly improved for exceptional within-wafer
uniformity and wafer-to-wafer repeatability required for 45nm and
below technology nodes."
Toennis continued, "Our customers continue to demand technology
solutions required to advance to the next technology node while
maintaining the lowest possible cost performance. We listened to
those challenges and acted. Even during the industry's worst
downturn we invested in advancing the RTP technology providing
unique and enabling solutions to the industry. With the
introduction of Helios XP, Mattson's RTP position is stronger than
ever. Helios XP delivers the advanced capabilities our customers
require at the lowest cost-of-ownership, and the shipment of the
system to a leading foundry customer is a testament of the traction
we are gaining in the leading-edge logic segment. We look forward
to working closely with the customer and continue to validate their
confidence in Mattson and our capabilities in meeting their
advanced process requirements."
About Helios XP(TM)
Helios XP combines Mattson Technology's production proven Helios
system with advanced process capabilities needed for 45nm
technology node and below. The system features an advanced
temperature control for increased within-wafer uniformity and
wafer-to-wafer repeatability. Helios XP incorporates proprietary
design features, including dual-sided wafer heating to improve
device yield by reducing pattern-related temperature effect. Helios
XP offers the industry's most advanced low temperature thermal
processing capability, as well as high temperature for spike anneal
and wafer manufacturing thermal applications. Complete with
superior ambient control and new process gas arrangement, Helios XP
offers the most advanced thermal processing solution for the
industry.
About Mattson Technology, Inc.
Mattson Technology, Inc. designs, manufactures and markets
semiconductor wafer processing equipment used in the fabrication of
integrated circuits. We are a leading supplier of plasma and rapid
thermal processing equipment to the global semiconductor industry.
Through manufacturing and design innovation, we have produced
technologically advanced systems that provide productive and cost
effective solutions for customers fabricating current- and
next-generation semiconductor devices. For more information, please
contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont,
CA, 94538. Telephone: (800) MATTSON/(510) 657-5900. Internet:
www.mattson.com
"Safe Harbor" Statement Under the Private Securities Litigation
Reform Act of 1995: This news release contains forward-looking
statements. Forward-looking statements address matters that are
subject to a number of risks and uncertainties that can cause
actual results to differ materially. Such risks and uncertainties
include, but are not limited to: end-user demand for
semiconductors; customer demand for semiconductor manufacturing
equipment; the timing of significant customer orders for the
Company's products; customer acceptance of delivered products and
the Company's ability to collect amounts due upon shipment and upon
acceptance; the Company's ability to timely manufacture, deliver
and support ordered products; the Company's ability to bring new
products to market and to gain market share with such products;
customer rate of adoption of new technologies; risks inherent in
the development of complex technology; the timing and
competitiveness of new product releases by the Company's
competitors; the Company's ability to align its cost structure with
market conditions; and other risks and uncertainties described in
the Company's Forms 10-K, 10-Q and other filings with the
Securities and Exchange Commission. The Company assumes no
obligation to update the information provided in this news
release.
Mattson Technology Contact Jay Chun Mattson Technology, Inc. tel
(510) 492-6190 fax (510) 492-5930 Jay.Chun@mattson.com Investor
& Media Contact Laura Guerrant-Oiye Guerrant Associates tel
808-882-1467 lguerrant@guerrantir.com
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