PITTSBURGH, May 30, 2019 /PRNewswire/
-- eSilicon is pioneering complex system-in-package
designs with significantly increased speed, efficiency and
production-proven accuracy thanks to ANSYS (NASDAQ: ANSS).
eSilicon leverages ANSYS' industry-leading multiphysics simulation
solutions to ensure silicon to system success — driving
time-to-market acceleration for its high-bandwidth networking,
high-performance computing, artificial intelligence (AI) and 5G
infrastructure customers.
Chip, package, board and system designers manage numerous
multiphysics challenges that increase the risk of failure for
advanced 2.5D packaging designs. Issues such as power integrity,
signal integrity, reliability, electromagnetic cross-talk, thermal
effects and thermal-induced mechanical stress pose significant
hurdles for design closure and contribute to skyrocketing chip
design costs.
ANSYS' industry-leading multiphysics simulation tools enable
eSilicon to affordably model, verify and validate the physical,
electrical and electromagnetic behavior of advanced FinFET chip,
2.5D package and board designs. Effectively performing these
chip-aware system and system-aware chip analyses tames the
complexity of system-in-package designs and drives silicon to
system success.
"Analyzing power integrity, signal integrity, reliability, and
on-chip/off-chip electromagnetic effects are critical for ensuring
product success," said Tony
Mastroianni, senior director, packaging design at eSilicon.
"With ANSYS multiphysics simulations we can comprehensively tackle
these tough challenges to drive innovation for our networking, data
center, AI and 5G infrastructure customers."
"ANSYS' suite of multiphysics solutions are integral — and
the only validation methodology available — to
cost-effectively achieving power, performance, area and reliability
goals for complex 2.5D designs," said John
Lee, ANSYS vice president and general manager. "ANSYS
delivers a complete multiphysics solution for eSilicon, providing
detailed modeling with unmatched accuracy to ensure first-time
silicon to system success, greatly mitigating their chip design
expense and significantly expediting their products' path to
market."
About ANSYS, Inc.
If you've ever seen a rocket launch, flown on an airplane,
driven a car, used a computer, touched a mobile device, crossed a
bridge or put on wearable technology, chances are you've used a
product where ANSYS software played a critical role in its
creation. ANSYS is the global leader in engineering
simulation. Through our strategy of Pervasive Engineering
Simulation, we help the world's most innovative companies deliver
radically better products to their customers. By offering the best
and broadest portfolio of engineering simulation software, we help
them solve the most complex design challenges and create products
limited only by imagination. Founded in 1970, ANSYS is
headquartered south of Pittsburgh,
Pennsylvania, U.S.A. Visit www.ansys.com for more
information.
ANSYS and any and all ANSYS, Inc. brand, product, service and
feature names, logos and slogans are registered trademarks or
trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries
Contact
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Media
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Mary Kate
Joyce
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724.820.4368
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marykate.joyce@ansys.com
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Investors
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Annette N. Arribas,
IRC
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724.820.3700
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annette.arribas@ansys.com
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ANSS-G
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SOURCE ANSYS, Inc.