Aehr Test Systems to Participate in the Craig-Hallum Alpha Select Conference in New York on November 15, 2018
November 05 2018 - 4:05PM
Aehr Test Systems (
NASDAQ: AEHR),
a worldwide supplier of semiconductor test and burn-in equipment,
today announced it has been invited to participate in the Ninth
Annual Craig-Hallum Alpha Select Conference being held on November
15, 2018 at the Sheraton Times Square Hotel in New York City.
Aehr Test President and CEO Gayn Erickson and CFO Ken Spink will
hold one-on-one and small group meetings with institutional
investors throughout the day.
To schedule a meeting, please contact either your Craig-Hallum
representative, or the MKR Group, Aehr Test’s investor relations
firm, at aehr@mkr-group.com.
About Aehr Test Systems Headquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in and testing logic, optical and memory
integrated circuits and has over 2,500 systems installed worldwide.
Increased quality and reliability needs of the Automotive and
Mobility integrated circuit markets are driving additional test
requirements, incremental capacity needs, and new opportunities for
Aehr Test products in package, wafer level, and singulated
die/module level test. Aehr Test has developed and introduced
several innovative products, including the ABTS™ and FOX-P™
families of test and burn-in systems and FOX WaferPak™ Aligner,
FOX-XP WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak
Loader. The ABTS system is used in production and qualification
testing of packaged parts for both lower power and higher power
logic devices as well as all common types of memory devices. The
FOX-XP system is a full wafer contact and singulated die/module
test and burn-in system used for burn-in and functional test of
complex devices, such as leading-edge memories, digital signal
processors, microprocessors, microcontrollers, systems-on-a-chip,
and integrated optical devices. The WaferPak contactor contains a
unique full wafer probe card capable of testing wafers up to 300mm
that enables IC manufacturers to perform test and burn-in of full
wafers on Aehr Test FOX systems. The DiePak Carrier is a reusable,
temporary package that enables IC manufacturers to perform
cost-effective final test and burn-in of both bare die and modules.
For more information, please visit Aehr Test Systems’ website at
www.aehr.com.
Contacts:
Aehr Test Systems
Ken
Spink
Chief Financial Officer
(510) 623-9400
x309
MKR Group Inc.Todd Kehrli or
Jim ByersAnalyst/Investor Contact (323)
468-2300aehr@mkr-group.com
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