AMD (NASDAQ: AMD) today again made technology history with the
announcement of high-performance 7nm-based computing and graphics
products that are expected to deliver new levels of performance,
features and experiences for PC gamers, enthusiasts and content
creators. During the first-ever Computex opening keynote, AMD
President and CEO Dr. Lisa Su announced:
- The new “Zen 2” core widely outperforms the historical
generational performance improvement industry trend, up to 15%
estimated instructions per clock (IPC)2 uplift over the predecessor
“Zen” architecture. The “Zen 2” CPU core powering the
next-generation AMD Ryzen and EPYC™ processors also includes
significant design improvements including lager cache sizes and a
redesigned floating point engine.
- The 3rd Gen AMD Ryzen desktop processor family, including the
new 12-core Ryzen 9 processor, offers leadership performance.1
- The AMD X570 chipset for socket AM4, the world’s first PCIe 4.0
supported chipset with more than 50 new motherboards at
launch.
- RDNA gaming architecture designed to drive the future of PC
gaming, console, and cloud, anticipated to deliver incredible
performance, power, and memory efficiency in a smaller
package.
- The 7nm AMD Radeon RX 5700-series gaming graphics card family
featuring high-speed GDDR6 memory and support for the PCIe 4.0
interface.
Dr. Su was joined by fellow technology leaders Microsoft
Corporate Vice President of OS Platforms Roanne Sones, Asus Chief
Operating Officer Joe Hsieh, Acer Co-Chief Operating Officer Jerry
Kao and a host of other significant industry players to showcase
the breadth and depth of the AMD high-performance computing and
graphics ecosystem.
“2019 is off to an incredible start for AMD as we celebrate 50
years of innovation by delivering leadership products to push the
limits of what is possible with computing and graphics technology,”
said Dr. Su. “We made significant strategic investments in
next-generation cores, a breakthrough chiplet design approach, and
advanced process technologies to deliver leadership 7nm products to
our high-performance computing ecosystem. We are extremely excited
to kick-off Computex 2019 together with our industry partners as we
prepare to bring our next generation of Ryzen desktop and EPYC
server processors and Radeon RX gaming graphics cards to
market.”
AMD High-Performance Desktop Updates
Continuing its path of PC leadership and industry firsts, AMD
announced the 3rd Gen AMD Ryzen desktop processor, the most
advanced desktop processor in the world3 with ground-breaking
performance across gaming, productivity, and content creation
applications. Based on the new “Zen 2” core architecture with AMD
chiplet design approach, 3rd Gen AMD Ryzen desktop processors are
expected to offer more performance-critical on-die cache than ever
before to unleash elite gaming performance. Additionally, all 3rd
Gen Ryzen desktop processors are supported by the world’s first
PCIe 4.0 PC readiness for the most advanced motherboards, graphics,
and storage technologies available, setting a new standard of
performance and providing the ultimate consumer experience.
With the 3rd Gen AMD Ryzen desktop processor family, AMD
introduced a new category of Ryzen 9 desktop processor with the
flagship 12 core/24 thread Ryzen 9 3900X. Pushing the
high-performance envelope for socket AM4 by offering leadership
performance1, the family is rounded out with 8 core Ryzen 7 models
and 6 core Ryzen 5 models.
During the keynote, Dr. Su showed various live demonstrations
highlighting leadership performance of the 3rd Gen Ryzen desktop
processors versus competitive production parts:
- Ryzen™ 7 3700X vs. i7-9700K with real-time rendering: The Ryzen
7 3700X offered 1% more single-threaded, and 30% more in
multi-threaded performance.4
- Ryzen™ 7 3800X vs. i9-9900K with PlayerUnknown’s Battlegrounds
gameplay: The Ryzen 7 3800X matched the performance of the
i9-9900K.5
- Ryzen™ 9 3900X vs. i9-9920X with Blender Render: The Ryzen 9
3900X beat the Intel i9 9920X by more than 16%.6
3rd Gen AMD Ryzen Desktop Processor Line-up and
Availability
Model |
Cores/ Threads |
TDP7 (Watts) |
Boost/Base Freq. (GHz) |
Total Cache (MB) |
PCIe 4.0 Lanes (processor+AMD X570) |
SEP8 (USD) |
Expected Availability |
Ryzen™ 9 3900X CPU |
12/24 |
105W |
4.6/3.8 |
70 |
40 |
$ |
499 |
July 7, 2019 |
Ryzen™ 7 3800X CPU |
8/16 |
105W |
4.5/3.9 |
36 |
40 |
$ |
399 |
July 7, 2019 |
Ryzen™ 7 3700X CPU |
8/16 |
65W |
4.4/3.6 |
36 |
40 |
$ |
329 |
July 7, 2019 |
Ryzen™ 5 3600X CPU |
6/12 |
95W |
4.4/3.8 |
35 |
40 |
$ |
249 |
July 7, 2019 |
Ryzen™ 5 3600 CPU |
6/12 |
65W |
4.2/3.6 |
35 |
40 |
$ |
199 |
July 7, 2019 |
AMD also introduced a new X570 chipset for socket AM4,
supporting the world’s first PCIe 4.0 readiness, which exhibited
42% faster storage performance than PCIe 3.09, enabling
high-performance graphics card, networking devices, NVMe drives,
and more. With PCIe 4.0 doubling the bandwidth for motherboards
with the X570 chipset over PCIe 3.0, PC enthusiasts can gain more
performance and flexibility when building custom systems. The X570
offers the broadest ecosystem readiness in AMD history, with over
50 new motherboard models anticipated from ASRock, Asus, Colorful,
Gigabyte, MSI, as well as PCIe 4.0 storage solutions from partners
including Galaxy, Gigabyte, and Phison. The 3rd Gen AMD Ryzen
desktop processors are expected to be available for purchase
globally on July 7, 2019.
In addition, major OEMs and System Integrators, including Acer,
Asus, CyberPowerPC, HP, Lenovo, and MAINGEAR reinforced strong
ecosystem support for the new platforms by announcing plans to
offer 3rd Gen AMD Ryzen processor-based gaming desktop systems over
the coming months.
AMD High-Performance Gaming Updates
AMD unveiled RDNA, the next foundational gaming architecture
that was designed to drive the future of PC gaming, console, and
cloud for years to come. With a new compute unit10 design, RDNA is
expected to deliver incredible performance, power and memory
efficiency in a smaller package compared to the previous generation
Graphics Core Next (GCN) architecture. It is projected to provide
up to 1.25X higher performance-per-clock11 and up to 1.5X higher
performance-per-watt over GCN12, enabling better gaming performance
at lower power and reduced latency.
RDNA will power the upcoming 7nm AMD Radeon RX 5700-series
graphics cards which feature high-speed GDDR6 memory and support
for the PCIe 4.0 interface.
During the keynote, Dr. Su showcased the power of RDNA and one
of the new AMD Radeon RX 5700-series graphics cards in a
head-to-head comparison with a RTX 2070 card running a Strange
Brigade gameplay demo, beating the competition delivering
incredible ~100 FPS gaming.13
AMD Radeon RX 5700-series graphics cards are expected to be
available in July 2019. Learn more at the AMD E3 livestream event
on June 10, 2019 at 3 pm PT.
AMD Datacenter Updates
The AMD datacenter business continues to gain traction with
customers, winning in application workloads from the biggest cloud
environments to exascale supercomputing, and capitalizing on the
massive market opportunity for both AMD EPYC and AMD Radeon
Instinct™ processors.
During the keynote, Dr. Su continued the anticipation around the
next-generation AMD EPYC processors with the first public
competitive demonstration of a 2nd Gen AMD EPYC server platform.
The demonstration showed a 2P 2nd Gen AMD EPYC based server vs. a
2P Intel Xeon® 8280-based server running a NAMD Apo1 v2.12
benchmark test. The preproduction 2nd Gen AMD EPYC processor
powered server outperformed the Intel Xeon powered servers by more
than 2x on the NAMD benchmark.14
Finally, Microsoft Azure announced the achievement of previously
unobtainable levels of performance for computational fluid dynamics
(CFD) using an Azure HB cloud instance running on an 1st Gen AMD
EPYC-processor based system. Leveraging the exceptional memory
bandwidth of AMD EPYC, Azure HB scaled Siemens Star -CCM+
application across over 11,500 cores using a Le Mans 100 Million
Cell simulation, well beyond the never before achieved 10,000 cores
goal. “HB-series VMs on Azure are a game changer for HPC in the
cloud. For the first time, HPC customers can scale their MPI
workloads to tens of thousands of cores with the agility of the
cloud and performance and economics that rival on-premise cluster,”
said Navneet Joneja, head of product for Azure Virtual
Machines, Microsoft Corp. “We look forward to this
new Azure offering doing great things for HPC-driven innovation and
productivity.”
The 2nd Gen AMD EPYC server processor family is projected to
deliver up to 2X the performance-per socket15 and up to 4X the
floating performance-per-socket16 over the previous generation.
The 2nd Gen AMD EPYC server processor family is expected to
launch in Q3 2019.
Supporting Resources
- Visit the AMD Computex webpage for a full replay of the
keynote, videos and product details
- Become a fan of AMD on Facebook
- Follow AMD on Twitter
About AMD
For 50 years AMD has driven innovation in high-performance
computing, graphics and visualization technologies ― the building
blocks for gaming, immersive platforms and the datacenter. Hundreds
of millions of consumers, leading Fortune 500 businesses and
cutting-edge scientific research facilities around the world rely
on AMD technology daily to improve how they live, work and play.
AMD employees around the world are focused on building great
products that push the boundaries of what is possible. For more
information about how AMD is enabling today and inspiring tomorrow,
visit the AMD
(NASDAQ:AMD) website, blog, Facebook and Twitter pages.
Cautionary Statement
This press release contains forward-looking statements
concerning Advanced Micro Devices, Inc. (AMD) including the
features, functionality, availability, timing, deployment and
expectations of AMD’s future products, including 3rd Gen AMD Ryzen
desktop processors, 7nm AMD Radeon RX 5700-series graphics cards
and the 2nd Gen AMD EPYC server processor family, which are made
pursuant to the Safe Harbor provisions of the Private Securities
Litigation Reform Act of 1995. Forward-looking statements are
commonly identified by words such as "would," "intends,"
"believes," "expects," "may," "will," "should," "seeks," "intends,"
"plans," "pro forma," "estimates," "anticipates," or the negative
of these words and phrases, other variations of these words and
phrases or comparable terminology. Investors are cautioned that the
forward-looking statements in this document are based on current
beliefs, assumptions and expectations, speak only as of the date of
this document and involve risks and uncertainties that could cause
actual results to differ materially from current expectations. Such
statements are subject to certain known and unknown risks and
uncertainties, many of which are difficult to predict and generally
beyond AMD's control, that could cause actual results and other
future events to differ materially from those expressed in, or
implied or projected by, the forward-looking information and
statements. Material factors that could cause actual results to
differ materially from current expectations include, without
limitation, the following: Intel Corporation’s dominance of the
microprocessor market and its aggressive business practices may
limit AMD’s ability to compete effectively; AMD has a wafer supply
agreement with GLOBALFOUNDRIES Inc. (GF) with obligations to
purchase all of its microprocessor and APU product requirements,
and a certain portion of its GPU product requirements, manufactured
at process nodes larger than 7 nanometer from GF with limited
exceptions. If GF is not able to satisfy AMD’s manufacturing
requirements, AMD’s business could be adversely impacted; AMD
relies on third parties to manufacture its products, and if they
are unable to do so on a timely basis in sufficient quantities and
using competitive technologies, AMD’s business could be materially
adversely affected; failure to achieve expected manufacturing
yields for AMD’s products could negatively impact its financial
results; the success of AMD’s business is dependent upon its
ability to introduce products on a timely basis with features and
performance levels that provide value to its customers while
supporting and coinciding with significant industry transitions; if
AMD cannot generate sufficient revenue and operating cash flow or
obtain external financing, it may face a cash shortfall and be
unable to make all of its planned investments in research and
development or other strategic investments; the loss of a
significant customer may have a material adverse effect on AMD;
AMD’s receipt of revenue from its semi-custom SoC products is
dependent upon its technology being designed into third-party
products and the success of those products; global economic and
market uncertainty may adversely impact AMD’s business and
operating results; AMD’s products may be subject to security
vulnerabilities that could have a material adverse effect on AMD;
IT outages, data loss, data breaches and cyber-attacks could
compromise AMD’s intellectual property or other sensitive
information, be costly to remediate and cause significant damage to
its business, reputation and operations; AMD’s operating results
are subject to quarterly and seasonal sales patterns; AMD may not
be able to generate sufficient cash to service its debt obligations
or meet its working capital requirements; AMD has a large amount of
indebtedness which could adversely affect its financial position
and prevent it from implementing its strategy or fulfilling its
contractual obligations; the agreements governing AMD’s notes and
the Secured Revolving Line of Credit impose restrictions on AMD
that may adversely affect AMD’s ability to operate its business;
the markets in which AMD’s products are sold are highly
competitive; AMD’s worldwide operations are subject to political,
legal and economic risks and natural disasters, which could have a
material adverse effect on it; the conversion of the 2.125%
Convertible Senior Notes due 2026 may dilute the ownership interest
of AMD’s existing stockholders, or may otherwise depress the price
of its common stock; uncertainties involving the ordering and
shipment of AMD’s products could materially adversely affect it;
the demand for AMD’s products depends in part on the market
conditions in the industries into which they are sold. Fluctuations
in demand for AMD’s products or a market decline in any of these
industries could have a material adverse effect on its results of
operations; AMD’s ability to design and introduce new products in a
timely manner is dependent upon third-party intellectual property;
AMD depends on third-party companies for the design, manufacture
and supply of motherboards, software and other computer platform
components to support its business; if AMD loses Microsoft
Corporation’s support for its products or other software vendors do
not design and develop software to run on AMD’s products, its
ability to sell its products could be materially adversely
affected; and AMD’s reliance on third-party distributors and
add-in-board partners subjects it to certain risks. Investors are
urged to review in detail the risks and uncertainties in AMD's
Securities and Exchange Commission filings, including but not
limited to AMD's Quarterly Report on Form 10-Q for the quarter
ended March 30, 2019.
AMD, the AMD Arrow logo, EPYC, Ryzen, Radeon and
combinations thereof, are trademarks of Advanced Micro Devices,
Inc. Other names are for informational purposes only and may be
trademarks of their respective owners.
1 Testing by AMD Performance Labs as of 05/26/2019 utilizing the
Ryzen 9 3900X vs. Core i9-9920X in Cinebench R20 nT. Results may
vary. RZ3-13
2 Testing by AMD Performance Labs as of 5/23.2918 AMD “Zen2”
CPU-based system scored an estimated 15% higher than previous
generation AMD “Zen” based system using estimated
SPECint®_rate_base2006 results. SPEC and SPECint are registered
trademarks of the Standard Performance Evaluation Corporation.
See www.spec.org. GD-141
3 “Advanced” defined as superior process technology in a smaller
node and unique support for PCIe® Gen 4 in the gaming market as of
05/26/2019. RZ3-14
4 Testing by AMD Performance Labs as of 05/26/2019 utilizing the
Ryzen 7 3700X vs. Core i7-9700K in Cinebench R20 1T and nT. Results
may vary. RZ3-15
5 Testing by AMD Performance Labs as of 05/26/2019 utilizing the
Ryzen 7 3800X and Core i9-9900K in PUBG. Results may vary.
RZ3-16
6 Testing by AMD Performance Labs as of 05/26/2019 utilizing the
Ryzen 9 3900X vs. Core i9-9920X in Cinebench R20 nT. Results may
vary. RZ3-17
7 Though both are often measured in watts, it is important to
distinguish between thermal and electrical watts. Thermal wattage
for processors is conveyed via thermal design power (TDP). TDP is a
calculated value that conveys an appropriate thermal solution to
achieve the intended operation of a processor. Electrical watts are
not a variable in the TDP calculation. By design, electrical watts
can vary from workload to workload and may exceed thermal watts.
GD-109
8 Suggest online retailer price in US dollars as of
5/23/2019.
9 Testing as of 05/20/2019 by AMD Performance Labs using a 3rd
Gen AMD Ryzen™ Processor in Crystal DiskMark 6.0.2. Results may
vary with configuration. RZ3-12
10 AMD APUs and GPUs based on the Graphics Core Next and RDNA
architectures contain GPU Cores comprised of compute units, which
are defined as 64 shaders (or stream processors) working together.
GD-142
11 Testing done by AMD performance labs 5/23/19, showing a
geomean of 1.25x per/clock across 30 different games @ 4K Ultra,
4xAA settings. Performance may vary based on use of latest drivers.
RX-327
12 Testing done by AMD performance labs 5/23/19, using the
Division 2 @ 25x14 Ultra settings. Performance may vary based on
use of latest drivers. RX-325
13 Testing done by AMD performance labs 5/23/19, using the
Strange Brigade @ 25x14 Ultra settings. Performance may vary based
on use of latest drivers. RX-328
14 Preproduction 7nm 2nd Generation EPYC™ powered server CPU in
a 2P server configuration outperformed 2P Intel Xeon 8280 powered
server by an average of up to 2X on the NAMD benchmark. AMD
internal testing as of May 21, 2019. Production silicon results may
vary. ROM-05
15 Testing performed by AMD Engineering as of October 2018 using
AMD reference system with a preproduction “Rome” engineering
sample, where “Rome” scored approximately 2x higher compared to
“Naples” System. Actual results with production silicon may vary.
ROM-03
16 Estimated generational increase based upon AMD internal
design specifications for “Zen 2” compared to “Zen 1”. “Zen 2” has
2X the core density of “Zen 1”, and when multiplied by 2X peak
FLOPs per core, at the same frequency, results in 4X the FLOPs in
throughput. Actual results with production silicon may vary.
ROM-04
Contact:Deb
Nations AMD Communications(512)
602-1025deb.nations@amd.com
Laura GravesAMD Investor
Relations(408) 749-5467laura.graves@amd.com
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