Kulicke & Soffa to Participate at Productronica 2017
November 13 2017 - 9:05AM
Business Wire
Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke
& Soffa”, “K&S” or the “Company”), announced today that it
will be exhibiting at the Productronica trade show, from November
14 through November 17, 2017.
Kulicke & Soffa will introduce its new Automotive focused
solution, Rapid Pro™, and showcase several other assembly
offerings.
- Rapid Pro™ – the first in the
new GEN-S performance wire bonder series, Rapid Pro™
delivers advanced process capabilities to further drive factory
efficiency. Real-time monitoring and diagnostics ensure high
quality and efficient assembly for automotive and other
high-performance, high-reliability semiconductor applications. The
GEN-S series also provides smart factory capabilities to further
enhance operational efficiencies.
- Asterion™– is built on a new
architecture with enhanced capabilities addressing the industry’s
growing and evolving power control and storage needs. A single
platform handles a multitude of interconnect materials such as
large aluminum wire, PowerRibbon™ and interconnects for
battery cells.
- APAMA™ DA (Die Attach) – is a
next generation platform that delivers high throughput and yields
by leveraging unique advances in functionality which includes
parallel processing, post pick alignment and inspection as well as
patented dynamic calibration technology.
- iFLEX – With a new placement
head design, it could achieve placement up to 50mm parts on a panel
with 50mm pre-mount. This allows the full automation of the pick
and place process, eliminating the manual operation. The iFLEX
offers high flexibility, fast changeovers for inline and end of
line placements as well as the lowest defect rates.
- Hybrid Wafer Feeder – an
innovative solution that enables the combination of
ultra-high-speed passive and active placement with high-accuracy
flip-chip bonding directly from wafer, ideal for high-volume
System-in-Package (SiP), flip-chip, die-attach and
wafer-level-package manufacturing. Placement accuracy up to 7µm @ 3
sigma, provides a compelling alternative to existing commercial
solutions.
The Company will be demonstrating these products at Messe
München, Hall A2, booth number 139.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of
semiconductor packaging and electronic assembly solutions
supporting the global automotive, consumer, communications,
computing and industrial segments. As a pioneer in the
semiconductor space, K&S has provided customers with market
leading packaging solutions for decades. In recent years, K&S
has expanded its product offerings through strategic acquisitions
and organic development, adding advanced packaging, electronics
assembly, wedge bonding and a broader range of expendable tools to
its core offerings. Combined with its extensive expertise in
process technology and focus on development, K&S is well
positioned to help customers meet the challenges of packaging and
assembling the next-generation of electronic devices.
(www.kns.com)
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version on businesswire.com: http://www.businesswire.com/news/home/20171113005478/en/
Kulicke & Soffa Industries, Inc.Marilyn SimPublic
RelationsP: +65-6880-9309F: +65-6880-9580msim@kns.comorKulicke
& Soffa Industries, Inc.Joseph ElgindyInvestor Relations
& Strategic InitiativesP: +1-215-784-7500F:
+1-215-784-6180investor@kns.com
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