Aehr Test Systems to Announce First Quarter Fiscal 2018 Financial Results on September 28, 2017
September 18 2017 - 7:00AM
Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of
semiconductor test and burn-in equipment, today announced that it
will report financial results for its first quarter of fiscal 2018
ended August 31, 2017 on Thursday, September 28, 2017 following the
close of the market. The Company will host a conference call and
webcast at 5:00 p.m. Eastern time to discuss the results.
What: |
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Aehr Test Systems first
quarter fiscal 2018 financial results conference call |
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When: |
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Thursday, September
28th at 5:00 p.m. Eastern Time (2:00 p.m. PT) |
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Dial in Number: |
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To access the live
call, dial 877-852-6576 (US and Canada) or
719-325-2315 (International) and give the
participant passcode 4262658. |
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Webcast: |
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To access the live
webcast, please visit the investor relations section at
www.aehr.com. |
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Call
Replay: |
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A phone replay of the
call will be available approximately two hours following the end of
the call through 8:00 p.m. ET on Thursday, October 5, 2017. To
access the replay dial-in information, please click here. |
About Aehr Test SystemsHeadquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in and testing logic, optical and memory
integrated circuits and has an installed base of more than 2,500
systems worldwide. Increased quality and reliability needs of the
Automotive and Mobility integrated circuit markets are driving
additional test requirements, incremental capacity needs, and new
opportunities for Aehr Test products in package, wafer level, and
singulated die/module level test. Aehr Test has developed and
introduced several innovative products, including the ABTSTM and
FOX-PTM families of test and burn-in systems and FOX WaferPak
Aligner, FOX-XP WaferPak Contactor, and FOX DiePak® Carrier. The
ABTS system is used in production and qualification testing of
packaged parts for lower power and higher power logic devices as
well as all common types of memory devices. The FOX-XP system is a
full wafer contact and singulated die/module test and burn-in
system used for burn-in and functional test of complex devices,
such as leading-edge memories, digital signal processors,
microprocessors, microcontrollers, systems-on-a-chip, and
integrated optical devices. The WaferPak contactor contains a
unique full wafer probe card capable of testing wafers up to 300mm
that enables IC manufacturers to perform test and burn-in of full
wafers on Aehr Test FOX systems. The DiePak Carrier is a reusable,
temporary package that enables IC manufacturers to perform
cost-effective final test and burn-in of both bare die and modules.
For more information, please visit Aehr Test System’s website at
www.aehr.com.
Contacts:Aehr Test
Systems
Ken Spink
Chief Financial Officer
(510) 623-9400
x309
Investor Relations
Contact:Todd Kehrli or Jim ByersMKR Group, Inc.(323)
468-2300aehr@mkr-group.com
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