Himax Announces 5.5MP UltraSenseIR™ BSI Image Sensor with 2X Higher Near Infrared Sensitivity for Computer Vision and NIR I...
December 27 2016 - 5:00AM
Himax Imaging, Inc., a subsidiary of Himax Technologies, Inc.
(Nasdaq:HIMX) (“Himax” or the “Company”), a leading global supplier
and fabless manufacturer of display drivers and other semiconductor
products, today announced the HM5530 UltraSenseIR™ product, a low
power and low noise 5.5 Megapixel Back Side Illuminated (“BSI”)
CMOS Image Sensor (“CIS”) with more than 40% quantum efficiency in
the Near Infrared (“NIR”) spectrum enabling the next generation of
embedded computer vision applications such as 3D camera, autonomous
navigation, event and pattern recognition and human-machine
interaction.
“Computer and machine vision devices operate
unnoticed to human perception by using Near Infrared light sources
and sensors because NIR is not visible to the human eye. Silicon
based image sensor, which is the dominant technology for visual
imaging applications due to advantages in cost, power and
scalability, is not sensitive to the Near Infrared spectrum and
needs to be compensated by using relatively large pixel sizes to
confine the resolution of the sensor that can fit in an embedded
device,” said Amit Mittra, CTO of Himax Imaging. “With our
breakthrough UltraSenseIR™ technology, Himax combines the
advantages of our highly integrated, low power and low noise BSI
sensor technologies with NIR and visible sensitivity in a very
small 2.0-micron pixel size to enable high resolution computer
vision and NIR imaging applications.”
The HM5530 consumes less than 140mW at 5.5
Megapixel operating at 30 frames per second over industry compliant
MIPI CSI2 interface. The sensor timing supports frame
synchronization to an external LED or Laser Diode light source, and
can be programmed using a standard two wire serial interface. With
engineering samples ready, Himax Imaging Inc. is collaborating with
platform providers to provide integrated solution for computer
vision.
About Himax Technologies, Inc.
Himax Technologies, Inc. (NASDAQ:HIMX) is a
fabless semiconductor solution provider dedicated to display
imaging processing technologies. Himax is a worldwide market leader
in display driver ICs and timing controllers used in TVs, laptops,
monitors, mobile phones, tablets, digital cameras, car navigation,
virtual reality (VR) devices and many other consumer electronics
devices. Additionally, Himax designs and provides controllers for
touch sensor displays, in-cell Touch and Display Driver Integration
(TDDI) single-chip solutions, LED driver ICs, power management ICs,
scaler products for monitors and projectors, tailor-made video
processing IC solutions, silicon IPs and LCOS micro-displays for
augmented reality (AR) devices and heads-up displays (HUD) for
automotive. The Company also offers digital camera solutions,
including CMOS image sensors and wafer level optics, which are used
in a wide variety of applications such as mobile phone, tablet,
laptop, TV, PC camera, automobile, security, medical devices and
Internet of Things. Founded in 2001 and headquartered in Tainan,
Taiwan, Himax currently employs around 2,100 people from three
Taiwan-based offices in Tainan, Hsinchu and Taipei and country
offices in China, Korea, Japan and the US. Himax has 2,911 patents
granted and 458 patents pending approval worldwide as of September
30th, 2016. Himax has retained its position as the leading display
imaging processing semiconductor solution provider to consumer
electronics brands worldwide.
http://www.himax.com.tw
About Himax Imagining (A subsidiary of Himax
Technologies)
Himax Imaging is a fabless semiconductor company
that develops CMOS Image Sensors (CIS), system-on-chip (SOC) and
wafer level camera solutions for next generation camera, video
communication and sensing applications. As a relative newcomer in
the CIS industry, Himax Imaging has quickly developed a broad
portfolio of products and technologies that have been adopted by
leading mobile computing and communication device manufacturers.
For more information, please visit: http://himaximaging.com/.
Forward Looking Statements
Factors that could cause actual events or
results to differ materially include, but not limited to, general
business and economic conditions and the state of the semiconductor
industry; market acceptance and competitiveness of the driver and
non-driver products developed by the Company; demand for end-use
applications products; reliance on a small group of principal
customers; the uncertainty of continued success in technological
innovations; our ability to develop and protect our intellectual
property; pricing pressures including declines in average selling
prices; changes in customer order patterns; changes in estimated
full-year effective tax rate; shortages in supply of key
components; changes in environmental laws and regulations; exchange
rate fluctuations; regulatory approvals for further investments in
our subsidiaries; our ability to collect accounts receivable and
manage inventory and other risks described from time to time in the
Company's SEC filings, including those risks identified in the
section entitled "Risk Factors" in its Form 20-F for the year ended
December 31, 2015 filed with the SEC, as may be amended.
Company Contacts: Jackie Chang,
CFOHimax Technologies, Inc.Tel: +886-2-2370-3999 Ext.22300
OrUS Tel: +1-949-585-9838 Ext.252Fax: +886-2-2314-0877Email:
jackie_chang@himax.com.twwww.himax.com.tw
Penny Lin, Investor RelationsHimax
Technologies, Inc.Tel: +886-2-2370-3999 Ext.22320Fax:
+886-2-2314-0877 Email: penny_lin@himax.com.twwww.himax.com.tw
Investor Relations - US RepresentativeGreg
Falesnik, Managing DirectorMZ North AmericaTel:
+1-212-301-7130Email: greg.falesnik@mzgroup.us www.mzgroup.us
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