Applied Materials Enables Cost-Effective Vertical Integration of 3D Chips
May 28 2014 - 7:30AM
- Endura®
Ventura(TM) PVD system allows high aspect
ratio through-silicon via (TSV) structures for copper interconnects
while reducing cost of ownership by up to 50 percent
- Industry's first
high-volume manufacturing PVD titanium barrier solution for
improved TSV reliability
SANTA CLARA, Calif., May 28, 2014 - Applied
Materials, Inc. today introduced the Endura® Ventura(TM) PVD system
that helps customers reduce the cost of fabricating smaller, lower
power, high-performance integrated 3D chips. The system
incorporates Applied's latest innovations to its industry-leading
PVD* technology that enables the deposition of thin, continuous
barrier and seed layers in through-silicon-vias (TSVs).
Demonstrating Applied's precision materials engineering expertise,
the Ventura system also uniquely supports the use of titanium in
volume production as an alternate barrier material for lower cost.
With the launch of the Ventura system, Applied is expanding its
comprehensive toolset for wafer level packaging (WLP) applications,
including TSVs, redistribution layer (RDL) and Bump*.
TSVs are a critical technology for vertically
fabricating smaller and lower power future mobile and
high-bandwidth devices. Vias are short vertical interconnects that
pass through the silicon wafer, connecting the active side of the
device to the back side of the die, providing the shortest
interconnect path between multiple chips. Integrating 3D stacked
devices requires greater than 10:1 aspect ratio TSV interconnect
structures to be metallized with copper. The new Ventura tool
solves this challenge with innovations in materials and deposition
technology to manufacture TSVs more cost-effectively than previous
industry solutions.
"Building on 15 years of leadership in copper
interconnect technology, the Ventura system enables fabrication of
robust high-aspect ratio TSVs, with up to 50 percent barrier seed
cost savings compared to copper interconnect PVD systems," said Dr.
Sundar Ramamurthy, vice president and general manager of Metal
Deposition Products at Applied Materials. "These innovations
deliver a higher-performance and more functional, yet, compact chip
package with less power consumption to meet leading-edge computing
needs. Customers are realizing the benefits of this new PVD system
and are qualifying it for volume manufacturing."
Supporting the manufacture of high-yielding 3D
chips, the Ventura system introduces advances in ionized PVD
technology that assure the integrity of the barrier and seed layers
that are critical to superior gap-fill and interconnect
reliability. These developments significantly improve ion
directionality to enable the deposition of thin, continuous and
uniform metal layers deep into the vias to achieve the void-free
fill necessary for robust TSVs. With the improvement in
directionality, higher deposition rates can be achieved, while the
amount of barrier and seed material needed can be reduced. These
attributes of the Ventura system and the adoption of titanium as an
alternate barrier are expected to improve device reliability and
reduce the overall cost of ownership for TSV metallization.
Applied Materials, Inc. (Nasdaq:AMAT) is the
global leader in providing innovative equipment, services and
software to enable the manufacture of advanced semiconductor, flat
panel display and solar photovoltaic products. Our technologies
help make innovations like smartphones, flat screen TVs and solar
panels more affordable and accessible to consumers and businesses
around the world. Learn more at www.appliedmaterials.com.
*PVD = physical vapor deposition
*Under Bump Metallization = used to connect the die to
substrate
# # #
Contact:
Connie Duncan (editorial/media) 408.563.6209
Michael Sullivan (financial community) 408.986.7977
PHOTO: Applied Materials Endura®
Ventura™ PVD system
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Source: Applied Materials via Globenewswire
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