Cabot Microelectronics Corporation (Nasdaq:CCMP) today announced it has entered into an agreement with International Business Machines Corp. (IBM) to jointly develop chemical mechanical planarization (CMP) technology for next-generation integrated circuit (IC) devices. Under the agreement, Cabot Microelectronics will utilize its industry-leading CMP experience and resources to collaboratively address IBM�s 32 and 22 nanometer technology challenges and develop effective CMP solutions for a variety of applications, including new materials. "For almost twenty years, since the early days of CMP technology, we have had a productive and collaborative relationship with IBM as an important customer, and we believe that this joint development program reflects and furthers this positive relationship and our ability to bring value to IBM and its customers," stated William P. Noglows, Cabot Microelectronics' Chairman and Chief Executive Officer. "IBM is excited to be collaborating with Cabot Microelectronics in order to deliver leading edge CMP solutions," said Paul Farrar, Vice President SRDC Process Development for IBM. "The fast pace of development makes it critical for materials suppliers and device makers to work together closely early in the research and development cycle in order to advance process technology." The research for this joint development program will take place in conjunction with IBM Research at Albany Nano-Tech, Albany NY, and at Cabot Microelectronics� research and development center in Aurora, IL. ABOUT CABOT MICROELECTRONICS CORPORATION Cabot Microelectronics Corporation, headquartered in Aurora, Illinois, is the world's leading supplier of CMP slurries used in semiconductor and data storage manufacturing. The company's products play a critical role in the production of the most advanced semiconductor devices, enabling the manufacture of smaller, faster and more complex devices by its customers. Since becoming an independent public company in 2000, the company has grown to approximately 750 employees on a global basis. The company's vision is to become the world leader in shaping, enabling and enhancing the performance of surfaces, so the company is leveraging its expertise in CMP slurry formulation, materials and polishing techniques developed for the semiconductor industry and applying it to demanding surface modification applications in other industries where shaping, enabling and enhancing the performance of surfaces is critical to success. For more information about Cabot Microelectronics Corporation, visit www.cabotcmp.com or contact Amy Ford, Director of Investor Relations at (630) 499-2600. SAFE HARBOR STATEMENT This news release may include statements that constitute "forward looking statements" within the meaning of federal securities regulations. These forward-looking statements include statements related to: future sales and operating results; company and industry growth or trends; growth of the markets in which the company participates; international events; product performance; the generation, protection and acquisition of intellectual property, and litigation related to such intellectual property; new product introductions; development of new products, technologies and markets; the acquisition of or investment in other entities; uses of the company�s cash balance; and the construction facilities by Cabot Microelectronics Corporation. These forward-looking statements involve a number of risks, uncertainties, and other factors, including those described from time to time in Cabot Microelectronics' filings with the Securities and Exchange Commission (SEC), that could cause actual results to differ materially from those described by these forward-looking statements. In particular, see "Risk Factors" in the company�s annual report on Form 10-K for the fiscal year ended September 30, 2007, filed with the SEC. Cabot Microelectronics assumes no obligation to update this forward-looking information.
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