Aehr to Present and Exhibit at the TestConX Workshop in Mesa, AZ March 3-6, 2019
February 26 2019 - 7:30AM
Aehr Test Systems (NASDAQ: AEHR), a worldwide
supplier of semiconductor test and reliability qualification
equipment, today announced it will be exhibiting in Booth 24 at the
TestConX 2019 Workshop taking place March 3-6 in Mesa, Arizona at
the Hilton Phoenix East/Mesa Hotel.
In addition, Aehr Test FOX Product Director Carl Kasinski will
be presenting at the conference on the challenges and solutions for
performing reliability testing on devices in panel or strip form
over a wide temperature range. New packages are emerging for
multi-die and multi-technology devices that are fabricated in panel
form with large numbers of very small devices. The challenges of
testing these devices are magnified and different than the
customary challenges of contacting and managing the temperature of
individually packaged singulated devices.
Aehr will be showcasing its ABTSTM family of packaged part
burn-in and test systems as well as its next generation solutions
for functional test and early failure rate (EFR) test, including
its FOX-XPTM system for high volume production, its new FOX-NPTM
low-cost entry-level system, and its new FOX-CPTM low-cost
single-wafer compact test and reliability verification solution for
logic, memory and photonic devices.
Gayn Erickson, President and CEO of Aehr Test Systems,
commented, “Aehr Test supplies complete test and burn-in solutions
for reliability screening and production of the latest technology
devices to ensure that the devices meet their reliability targets,
which is the core of this conference. As more new product designs
challenge traditional test and reliability screening methodologies,
Aehr’s wafer-level and singulated die/module production test and
burn-in capabilities offer a cost-effective solution for high
volume production of wafers and the latest small packaging methods
for modules that integrate multiple device
technologies. Reliability-critical applications include
automotive vehicle control and sensor systems, sensors and security
devices in mobile smartphones and tablets, 5G communications, and
an entirely new need for reliability and assurance of operation in
wearable biosensors.”
TestConX (formerly Burn-in and Test Strategies Workshop) is the
world’s premier workshop dedicated to the advancement of test and
burn-in socketing and related technologies. TestConX draws an
international who's-who participation from all parts of the
semiconductor world with a focus on sockets, contactors, printed
circuit boards (PCBs), materials, handlers, contact technologies,
burn-in systems, and related technologies, systems, and services.
Additional information on the conference can be found on the
TestConX website at www.bitsworkshop.org.
Solutions that Aehr will be showcasing at TestConX
2019
- The ABTS family of packaged part burn-in and test systems,
which is based on a state-of-the-art hardware and software platform
that is designed to address not only today’s devices, but also
future devices for many years to come. This system can test and
burn-in high pin-count devices and there are also configurations
for both high-power and low-power applications.
- The FOX-PTM family of products, which includes multi-wafer test
solutions that are capable of functional test and burn-in/cycling
of flash memories, microcontrollers, photonics and other leading
edge ICs in wafer form before they are assembled into multi-die
stacked packages. The FOX-P systems utilize Aehr Test's FOX
WaferPakTM contactors or DiePak® carriers, which provide a cost
effective solution for making electrical and thermal contact with a
full wafer, panel, singulated die or module in a parallel test and
burn-in environment. The members of the FOX-P family today include
the FOX-XP, FOX-NP and FOX-CP systems.
- The FOX-XP system, the company’s next-generation multi-wafer
and now singulated die/module test solution that is capable of
functional test and burn-in/cycling of integrated photonics
devices, flash memories, microcontrollers, sensors, and other
leading-edge ICs in wafer form before they are assembled into
single or multi-die stacked packages. The FOX-XP system is
designed for high-volume production and can be configured with up
to 18 blades to burn in up to 18 wafers simultaneously.
- The new highly integrated FOX-NP system, which offers the same
test and burn-in capabilities as the FOX-XP system, but in a
2-blade version, which has a small footprint and is more
cost-effective for reliability labs, device qualification, and
small-lot production.
- The new FOX-CP single-wafer system, which is a low-cost
solution including an integrated wafer prober and performs
wafer-level testing and reliability screening. It offers over
2,000 Universal Channels with a cost-effective WaferPak interface
for wafer testing.
About Aehr Test SystemsHeadquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in and testing logic, optical and memory
integrated circuits and has over 2,500 systems installed worldwide.
Increased quality and reliability needs of the Automotive and
Mobility integrated circuit markets are driving additional test
requirements, incremental capacity needs, and new opportunities for
Aehr products in package, wafer level, and singulated die/module
level test. Aehr has developed and introduced several innovative
products, including the ABTSTM and FOX-PTM families of test and
burn-in systems and FOX WaferPakTM Aligner, FOX-XP WaferPak
Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The ABTS
system is used in production and qualification testing of packaged
parts for both lower power and higher power logic devices as well
as all common types of memory devices. The FOX-XP system is a full
wafer contact and singulated die/module test and burn-in system
used for burn-in and functional test of complex devices, such as
leading-edge memories, digital signal processors, microprocessors,
microcontrollers, systems-on-a-chip, and integrated optical
devices. The WaferPak contactor contains a unique full wafer probe
card capable of testing wafers up to 300mm that enables IC
manufacturers to perform test and burn-in of full wafers on Aehr
FOX systems. The DiePak Carrier is a reusable, temporary package
that enables IC manufacturers to perform cost-effective final test
and burn-in of both bare die and modules. For more information,
please visit Aehr’s website at www.aehr.com.
Safe Harbor Statement This press release
contains certain forward-looking statements based on current
expectations, forecasts and assumptions that involve risks and
uncertainties. These statements are based on information available
to Aehr as of the date hereof and actual results could differ
materially from those stated or implied due to risks and
uncertainties. Forward-looking statements include statements
regarding Aehr’s expectations, beliefs, intentions or strategies
regarding its products, including statements regarding future
market opportunities and conditions, expected product shipment
dates and customer orders or commitments. These risks and
uncertainties include, without limitation, customer demand and
acceptance of Aehr’s products, the ability of new products to meet
customer needs or perform as described, as well as general market
conditions and Aehr’s ability to execute on its business strategy.
See Aehr’s recent 10-K, 10-Q and other reports from time to time
filed with the Securities and Exchange Commission for a more
detailed description of the risks facing Aehr’s business. Aehr
disclaims any obligation to update information contained in any
forward-looking statement to reflect events or circumstances
occurring after the date of this press release.
Contacts:
Aehr Test Systems |
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MKR Group Inc. |
Carl Buck |
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Todd Kehrli or Jim Byers |
V.P. of Marketing |
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Analyst/Investor Contact |
(510) 623-9400 x381 |
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(323) 468-2300 |
cbuck@aehr.com |
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aehr@mkr-group.com |
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