IRVINE, Calif., May 18, 2021 /PRNewswire/ -- Interlink
Electronics, Inc. (NASDAQ: LINK), a world-leading trusted
technology partner in the rapidly advancing world of human-machine
interface (HMI) devices, sensors, and other cutting-edge
technologies, is proud to announce the official opening of its new
world-class materials science and research & development lab in
Camarillo, Calif. The culmination
of more than six months of buildout, the new facility will provide
Interlink with the physical resources necessary to develop new
products and technologies.
Previously based in Singapore,
Interlink's R&D and materials science center is being brought
to the United States to facilitate
greater communication and collaboration as Interlink executes upon
its plans to expand its product offerings. Housed within a 10,000
sq ft complex, the new facility is outfitted with state-of-the-art
material characterization, printing, prototyping, and testing
equipment for advanced research into novel sensing materials,
devices, and applications. It will also give Interlink a greater
range of technological options when developing custom solutions
in-house and reducing time to market. The opening coincides with
the appointment of Gene Chen as VP
of engineering and advanced materials, who will direct Interlink's
team of global engineers and scientists.
"Interlink is a company deeply rooted in innovation, having been
formed in 1985 to introduce Force Sensing Resistor (FSR) technology
to the world and commercialize printed electronics," said
Steven N. Bronson, chairman,
president, and CEO of Interlink Electronics. "Our new facility will
give us much needed capability to expand our product offering,
develop new sensor technology, carry out privately or government
funded development projects, and maintain Interlink's leadership in
the HMI industry."
About Interlink Electronics
Interlink Electronics is a
world-leading trusted provider of HMI, sensor, and IoT solutions.
In addition to standard product offerings, Interlink utilizes its
expertise in materials science, manufacturing, firmware, and
software to produce in-house system solutions for custom
applications. For 35 years, Interlink has led the printed
electronics industry in the commercialization of its patented Force
Sensing Resistor® technology and has supplied some of
the world's top electronics manufacturers with intuitive sensor and
interface technologies like the VersaPad and the new VersaPad Plus,
which boasts the largest active surface area of any resistive
touchpad. It also has a proven track record of supplying
technological solutions for mission-critical applications in a
diverse range of markets—including medical, automotive,
consumer electronics, telecommunications, and industrial
control—providing standard and custom-designed sensors that give
engineers the flexibility and functionally they seek in today's
sophisticated electronic devices. Interlink serves an international
customer base from its headquarters in Irvine, Calif., and world-class materials
science lab and R&D center in Camarillo, Calif. They are supported by
strategic global locations covering manufacturing, distribution,
and sales support. For more information, please visit
InterlinkElectronics.com.
Forward Looking Statements
This release contains
forward-looking statements. Forward-looking statements include, but
are not limited to, the company's views on future product
development and innovation, and are generally identified by phrases
such as "thinks," "anticipates," "believes," "estimates,"
"expects," "intends," "plans," and similar words. Forward-looking
statements are not guarantees of future performance and are
inherently subject to uncertainties and other factors which could
cause actual results to differ materially from the forward-looking
statement. These statements are based upon, among other things,
assumptions made by, and information currently available to,
management, including management's own knowledge and assessment of
the company's industry, R&D initiatives, competition and
capital requirements. Other factors and uncertainties that could
affect the company's forward-looking statements include, among
other things, the following: our success in predicting new markets
and the acceptance of our new products; efficient management of our
infrastructure; the pace of technological developments and industry
standards evolution and their effect on our target product and
market choices; the effect of outsourcing technology development;
changes in the ordering patterns of our customers; a decrease in
the quality and/or reliability of our products; protection of our
proprietary intellectual property; competition by alternative
sophisticated as well as generic products; continued availability
of raw materials for our products at competitive prices;
disruptions in our manufacturing facilities; risks of international
sales and operations including fluctuations in exchange rates;
compliance with regulatory requirements applicable to our
manufacturing operations; and customer concentrations. Additional
factors that could cause actual results to differ materially from
those anticipated by our forward-looking statements are under the
captions "Risk Factors" and "Management's Discussion and Analysis
of Financial Condition and Results of Operations" in our most
recent Annual Report (Form 10-K) or Quarterly Report (Form 10-Q)
filed with the Securities and Exchange Commission. Forward-looking
statements are made as of the date of this release, and we
expressly disclaim any obligation to publicly update or revise any
forward-looking statements, whether as a result of new information,
future events or otherwise.
Investor Relations:
Steven N. Bronson, CEO &
President
IR@iefsr.com
805-617-4419
View original content to download
multimedia:http://www.prnewswire.com/news-releases/interlink-electronics-cuts-the-ribbon-on-its-new-materials-science-and-rd-center-301293595.html
SOURCE Interlink Electronics