Skyworks' Front-End Technology Supports Qualcomm's CDMA2000 and HSDPA Architectures
May 29 2008 - 7:00AM
Business Wire
Skyworks Solutions, Inc. (NASDAQ: SWKS), an innovator of high
performance analog and mixed signal semiconductors enabling mobile
connectivity, today announced several new front-end solutions
supporting Qualcomm�s newest code division multiple access (CDMA)
and HSDPA enhanced data for GSM evolution (HEDGE) reference
platforms: The SKY77166 � a 450 megahertz (MHz) power amplifier
(PA) for CDMA handsets and wireless local loop (WLL) applications
in a 4 x 4 mm package � the smallest in the industry for
applications in this frequency range. Skyworks is also working on
defining a next-generation product that would drastically improve
talk times in this growing market and will be designed to support
certain Qualcomm chipsets. The SKY77183 (3 x 3 mm PA for the
cellular band) and the SKY77184 (3 x 6 mm dual-band PA for cellular
and PCS bands with integrated coupler) � Skyworks� first PAs with
full bypass mode. Routing the input signal directly from input to
output bypasses the PA at low powers, enabling optimal operation at
low output power levels and eliminating the need to supply current
to the amplifier stages, resulting in significant savings in
average battery current. The SKY77336 PAM � designed in a compact 5
x 5 mm form factor for quad-band cellular handsets for GSM, GPRS
and EDGE. At a higher level, this is the first time Skyworks is
working directly with Qualcomm on handset platforms targeted for
next-generation multimode handset manufacturers. �We are delighted
to be working with Qualcomm on several exciting and upcoming
handset platforms, particularly given their innovative radio
architectures and technology leadership position,� said David J.
Aldrich, president and chief executive officer of Skyworks. �When
combined with our core front-end capabilities, together we plan to
deliver feature rich, best-in-class solutions to a number of the
world�s leading handset OEMs and smartphone suppliers.� The
chipsets will support multiple wireless platform customers. The
companies will manufacture these solutions, with mobile devices
incorporating these designs available as early as later this year.
About HSDPA High-speed downlink packet access (HSDPA) is a third
generation (3G) mobile telephony communications protocol in the
high-speed packet access (HSPA) family, which allows networks based
on universal mobile telecommunications system (UMTS) to have higher
data transfer speeds and capacity. Current HSDPA deployments
support downlink speeds of 1.8, 3.6, 7.2 and 14.4 megabits (Mbit),
with further speed increases planned in the near future. About
Skyworks Skyworks Solutions, Inc. is an innovator of high
performance analog and mixed signal semiconductors enabling mobile
connectivity. The company's power amplifiers, front-end modules and
direct conversion radios are at the heart of many of today's
leading-edge multimedia handsets. Leveraging core technologies,
Skyworks also offers a diverse portfolio of linear products that
support automotive, broadband, cellular infrastructure, industrial
and medical applications. Headquartered in Woburn, Mass., Skyworks
is worldwide with engineering, manufacturing, sales and service
facilities throughout Asia, Europe and North America. For more
information, please visit Skyworks� Web site at:
www.skyworksinc.com. Safe Harbor Statement This news release
includes "forward-looking statements" intended to qualify for the
safe harbor from liability established by the Private Securities
Litigation Reform Act of 1995. These forward-looking statements
include information relating to future results and expectations of
Skyworks (including certain projections and business trends).
Forward-looking statements can often be identified by words such as
"anticipates," "expects," "intends," "believes," "plans," "may,"
"will," "continue," similar expressions, and variations or
negatives of these words. All such statements are subject to
certain risks and uncertainties that could cause actual results to
differ materially and adversely from those projected, and may
affect our future operating results, financial position and cash
flows. These risks and uncertainties include, but are not limited
to: global economic and market conditions, such as the cyclical
nature of the semiconductor industry and the markets addressed by
our, and our customers', products; our ability to develop,
manufacture and market innovative products in a highly price
competitive and rapidly changing technological environment;
fluctuations in our manufacturing yields due to our complex and
specialized manufacturing processes; our reliance on several key
customers for a large percentage of our sales; fluctuations in the
manufacturing yields of our third party semiconductor foundries and
other problems or delays in the fabrication, assembly, testing or
delivery of our products; the availability and pricing of third
party semiconductor foundry, assembly and test capacity and raw
materials; our ability to timely and accurately predict market
requirements and evolving industry standards, and to identify
opportunities in new markets; losses or curtailments of purchases
or payments from key customers, or the timing of customer inventory
adjustments; our ability to rapidly develop new products and avoid
product obsolescence; our ability to retain, recruit and hire key
executives, technical personnel and other employees in the
positions and numbers, with the experience and capabilities, and at
the compensation levels needed to implement our business and
product plans; lengthy product development cycles that impact the
timing of new product introductions; the timing, rescheduling or
cancellation of significant customer orders and our ability, as
well as the ability of our customers, to manage inventory;
unfavorable changes in product mix; the quality of our products and
any remediation costs; shorter than expected product life cycles;
problems or delays that we may face in shifting our products to
smaller geometry process technologies and in achieving higher
levels of design integration; economic, social and political
conditions in the countries in which we, our customers or our
suppliers operate, including security and health risks, possible
disruptions in transportation networks and fluctuations in foreign
currency exchange rates; our ability to continue to grow and
maintain an intellectual property portfolio and obtain needed
licenses from third parties; and the uncertainties of litigation,
including disputes over intellectual property, as well as other
risks and uncertainties, including but not limited to those
detailed from time to time in our filings with the Securities and
Exchange Commission. These forward-looking statements are made only
as of the date hereof, and we undertake no obligation to update or
revise the forward-looking statements, whether as a result of new
information, future events or otherwise. Note to Editors: Skyworks
and Skyworks Solutions are trademarks or registered trademarks of
Skyworks Solutions, Inc. or its subsidiaries in the United States
and in other countries. Qualcomm is a registered trademark of
Qualcomm Incorporated. CDMA2000 is a registered trademark of the
Telecommunications Industry Association (TIA USA). All other brands
and names listed are trademarks of their respective companies.
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