Addresses the Speed and Reach Limitations of
Passive, Direct-attached Copper (DAC) Cables
SANTA
CLARA, Calif., Dec. 10,
2024 /PRNewswire/ -- Marvell Technology, Inc.
(NASDAQ: MRVL), a leader in data infrastructure semiconductor
solutions, today announced the general availability of a 200G per
lane optimized transimpedance amplifier (TIA) and laser
driver chipset, enabling 800 Gbps and 1.6 Tbps linear-drive
pluggable optics (LPO). Designed to address next-generation
short-reach, scale-up compute fabric connectivity requirements, LPO
modules enabled by the chipset overcome the reach limitations of
passive, DAC cable interconnects. The LPO chipset expands the
industry-leading interconnect portfolio from Marvell, which
includes PAM4 optical DSPs, coherent DSPs, data center
interconnects, Alaska® A active electrical cable (AEC)
DSPs and Alaska P PCIe retimers, delivering an optimized
optical solution for short-reach compute fabric connections,
delivering an optimized optical solution for short-reach compute
fabric connections.
As artificial intelligence (AI) technologies advance, the demand
for higher-bandwidth interconnects in data center networks is
accelerating rapidly. This is particularly evident in compute
fabric networks, which connect XPUs within and across racks. The
next generation of XPU compute fabric networks will transition to
data rates of 200 Gbps per lane, where passive DACs fall short of
meeting speed and distance requirements.
To address this, cloud data centers will transition to a new
type of interconnect that meets their specific requirements.
Marvell introduced Alaska A for customers looking to extend copper
capabilities using AECs, while others can leverage specialized LPO
modules featuring the Marvell TIA and driver chipset. Designed for
short and predictable host channels, these LPO modules enable
longer reach, higher bandwidth and improved performance compared to
copper interconnects.
"Marvell 1.6 Tbps LPO TIA and laser driver chipset is designed
to address the growing demand for short-reach, high-bandwidth
interconnect solutions, where passive copper cables are hitting a
wall," said Xi Wang, vice president
of product marketing for Optical Connectivity at Marvell. "As
AI-driven data centers continue to scale, optimizing interconnect
solutions across each layer of the network is becoming increasingly
critical. The new LPO chipset complements and expands our
industry-leading 1.6 Tbps connectivity portfolio, to address the
growing spectrum of interconnects that cloud operators are seeking
to optimize."
"LPO has been a technology in search of the right solution. By
optimizing chipsets for short, inside-the-rack connections, Marvell
brings clarity and focus to LPO, delivering it in a more
compelling and scalable manner," said Alan
Weckel, co-founder of 650 Group. "Marvell's innovative
approach to achieving performance gains helps drive better AI
cluster TCO and highlights the industry's direction in optimizing
networking links."
The 1.6 Tbps LPO chipset, one of the latest additions to the
Marvell interconnect portfolio, is optimized for specific use cases
to help data centers maximize infrastructure utilization and
performance while reducing overall cost and power per bit. This
extensive portfolio spanning optical and copper interconnects
includes Ara, the industry's first 3nm PAM4 interconnect platform;
Aquila, the industry's first O-band-optimized coherent-lite DSP
platform; Nova family of PAM4 DSPs featuring 200 Gbps electrical
and optical interfaces; and Alaska A PAM4 DSP for
active electrical cables.
LPO Chipset Key Features
- TIA provides best-in-class linearity, power and BER for AI
applications.
- Laser driver to improve module performance margin while
reducing overall transceiver module design complexity, power
consumption, and TCO.
- TIA and laser driver chipset provide adjustable equalization to
compensate for channel loss.
About Marvell
To deliver the data infrastructure
technology that connects the world, we're building solutions on the
most powerful foundation: our partnerships with our customers.
Trusted by the world's leading technology companies for over 25
years, we move, store, process and secure the world's data with
semiconductor solutions designed for our customers' current needs
and future ambitions. Through a process of deep collaboration and
transparency, we're ultimately changing the way tomorrow's
enterprise, cloud, automotive, and carrier architectures
transform—for the better.
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limitation, any statement that may predict, forecast, indicate or
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For further information, contact:
Kim Markle
pr@marvell.com
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