TTM Technologies, Inc. Announces Upcoming Conference Participation
May 05 2016 - 9:00AM
TTM Technologies, Inc. (NASDAQ:TTMI), a leading global printed
circuit board (PCB) manufacturer, today announced that members of
its management team will present at the following investor
conferences:
- The Stifel Technology, Internet & Media Conference in San
Francisco at The Fairmont Hotel on Monday, June 6, 2016 at 4:45 PM
Pacific Time; and
- The Barclays High Yield Bond & Syndicated Loan Conference
in Colorado Springs at The Broadmoor on Thursday, June 9, 2016 at
10:10 AM Mountain Time.
The Company is also hosting an Analyst Day in New York at The
Westin New York Grand Central on Tuesday, May 17, 2016 from 10:00
AM Eastern Time to 1:00 PM Eastern Time.
All presentations will be webcast live on the company’s website,
www.ttm.com, and a replay will be accessible for a limited time
following the events.
About TTMTTM Technologies, Inc. is a leading
global printed circuit board manufacturer, focusing on quick-turn
and technologically advanced PCBs, backplane assemblies and
electro-mechanical solutions. TTM stands for time-to-market,
representing how TTM's time-critical, one-stop manufacturing
services enable customers to shorten the time required to develop
new products and bring them to market. Additional information can
be found at www.ttm.com.
Contact:
Sameer Desai,
Senior Director, Corporate Development & Investor Relations
sameer.desai@ttmtech.com
714-327-3050
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