Methode Electronics Power Solutions Group to Exhibit at Applied Power Electronics Conference February 5 to 9
January 17 2012 - 8:00AM
Marketwired
Methode Electronics Power Solutions Group, a
division of Methode Electronics, Inc. (NYSE: MEI), today announced
it will exhibit at the upcoming Applied Power Electronics
Conference (APEC) held February 5 to 9, 2012, in Orlando, Florida.
APEC focuses on practical and applied aspects of the power
electronics business and includes manufacturing, design,
development, marketing and compliance information and products from
leaders in the industry.
Methode Power Solutions Group will have a significant presence
at APEC this year with an emphasis on its industry leading power
technologies, products and a global manufacturing footprint. With
in-house capabilities that include powder coating, plating,
machining, forming, assembly, manufacture and testing, the group
offers customers across a wide range of industries a single vendor
to meet all their power requirements with the highest level of
quality.
Highlighted in the exhibit booth this year will be four primary
product and technology exhibits including interactive demonstration
areas.
Components and sub-systems:
- Laminated, machined, powder coated and plated bus bars
- Extremely flexible high current power cable and assemblies
- High current low mV drop, low insertion force power contacts
and connectors
- Thermal management (liquid chill plates, heat sinks)
- PowerRail™ - modular, pluggable high current carrying
interconnect system
- J1772 SAE Level 1,2; UL approved charge connector and cable
harness
Power Electronics Systems
- High voltage power and control electronics design, development
and manufacturing
- On-Board Charger Modules (OBCM) from 5kW through 50kW
- Inverger®- Integrated, Bi-Directional Inverter Charger,
7.2kW
- Battery Disconnect (BDU) and Power Distribution (PDU)
units
- Battery management systems; hardware and software
communications
- Stationary storage systems: Lithium Ion cell technology
Strategic Partner Capabilities
- UPE heavy and extreme heavy copper PCB's, integrated signal and
power electronic circuits
- SBE Power Ring Film Capacitors™, which provide the highest
possible ripple current per capacitance for DC link
applications.
- Product integration design and manufacturing
- Complete power systems for charging to and from grid or home
and auxiliary equipment
- Power storage systems using latest Lithium Ion cell
technology
- Integrated bus bar, capacitor and IGBT modules for next
generation inverter topologies
Visit the Methode Power Solutions Group booths 301,303,305, 400,
402,404 at APEC 2012, Walt Disney World Resort, February 5 to 9,
2012. For more information about the conference, please visit
http://www.apec-conf.org/.
About Methode Electronics, Inc. Methode
Electronics, Inc. (NYSE: MEI) is a global developer of custom
engineered and application specific products and solutions with
manufacturing, design and testing facilities in China, Germany,
India, Lebanon, Malta, Mexico, the Philippines, Singapore,
Switzerland, the United Kingdom and the United States. We design,
manufacture and market devices employing electrical, electronic,
wireless, safety radio remote control, sensing and optical
technologies to control and convey signals through sensors,
interconnections and controls. Our business is managed on a segment
basis, with those segments being Automotive, Interconnect, Power
Products and Other. Our components are in the primary end markets
of the automobile, computer, information processing and networking
equipment, voice and data communication systems, consumer
electronics, appliances, aerospace vehicles and industrial
equipment industries. Further information can be found on Methode's
Web site www.methode.com.
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Contact: Cecilia Ostberg 708-856-6711
costberg@methode.com
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