NEWS HIGHLIGHTS
- Companies to collaborate on the development of a 12-nanometer
process platform targeting high-growth markets.
- Collaboration builds on Intel’s commitment to partnering with
innovative companies in Taiwan to help the company better serve
global customers and expand its mature process capabilities for
foundry customers.
- Deal broadens customer access to a geographically diverse
semiconductor supply chain.
- Collaboration provides UMC with additional capacity,
accelerates its development roadmap and demonstrates its leading
process technology R&D.
Intel Corp. (Nasdaq: INTC) and United Microelectronics
Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global
semiconductor foundry, today announced that they will collaborate
on the development of a 12-nanometer semiconductor process platform
to address high-growth markets such as mobile, communication
infrastructure and networking. The long-term agreement brings
together Intel’s at-scale U.S. manufacturing capacity and UMC’s
extensive foundry experience on mature nodes to enable an expanded
process portfolio. It also offers global customers greater choice
in their sourcing decisions with access to a more geographically
diversified and resilient supply chain.
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Intel Corp. and United Microelectronics
Corp. announce that they will collaborate on the development of a
12-nanometer semiconductor process platform to address high-growth
markets. (Credit: Intel Corporation)
“Taiwan has been a critical part of the Asian and global
semiconductor and broader technology ecosystem for decades, and
Intel is committed to collaborating with innovative companies in
Taiwan, such as UMC, to help better serve global customers,” said
Stuart Pann, Intel senior vice president and general manager of
Intel Foundry Services (IFS). “Intel’s strategic collaboration with
UMC further demonstrates our commitment to delivering technology
and manufacturing innovation across the global semiconductor supply
chain and is another important step toward our goal of becoming the
world’s second-largest foundry by 2030.”
Jason Wang, UMC co-president, said, “Our collaboration with
Intel on a U.S.-manufactured 12 nm process with FinFET capabilities
is a step forward in advancing our strategy of pursuing
cost-efficient capacity expansion and technology node advancement
in continuing our commitment to customers. This effort will enable
our customers to smoothly migrate to this critical new node, and
also benefit from the resiliency of an added Western footprint. We
are excited for this strategic collaboration with Intel, which
broadens our addressable market and significantly accelerates our
development roadmap leveraging the complementary strengths of both
companies.”
The 12 nm node will utilize Intel’s U.S. based high-volume
manufacturing capacity and experience in FinFET transistor design,
offering a strong combination of maturity, performance and power
efficiency. The production will markedly benefit from UMC’s decades
of process leadership and history of providing customers with
Process Design Kit (PDK) and design assistance for effectively
providing foundry services. The new process node will be developed
and manufactured in Fabs 12, 22 and 32 at Intel’s Ocotillo
Technology Fabrication site in Arizona. Leveraging existing
equipment in these fabs will significantly reduce upfront
investment requirements and optimize utilization.
The two companies will work to satisfy customer demand and
cooperate on design enablement to support the 12 nm process by
enabling electronic design automation and intellectual properties
solutions from ecosystem partners. Production of the 12 nm process
is expected to begin in 2027.
Intel has been investing and innovating in the U.S. and globally
for more than 55 years, with established or planned manufacturing
sites and investments in Oregon, Arizona, New Mexico and Ohio, in
addition to Ireland, Germany, Poland, Israel and Malaysia. IFS has
made significant progress over the past year, building strong
momentum with new customers, including new customers across the
Intel 16, Intel 3 and Intel 18A process technologies, and expanding
its growing foundry ecosystem. IFS expects to continue its progress
this year.
UMC has a more than 40-year history of being a preferred
supplier of foundry services to critical applications including
automotive, industrial, display and communications. Over the past
two decades, UMC has successfully expanded its base across Asia and
has continued to lead innovation across mature nodes and specialty
foundry services. UMC is a significant supplier to the top 400+
semiconductor customers and has extensive expertise and know-how in
supporting customers to reach high yields while maintaining
industry-leading foundry utilization.
Forward-Looking Statements
This communication contains certain forward-looking statements
related to the proposed transactions between Intel and UMC and
certain of their affiliates, including statements regarding the
benefits and the timing of the transactions. Words such as
“expect,” “plan” and “will” and variations of such words and
similar expressions are intended to identify such forward-looking
statements. Such statements are based on management expectations as
of the date of this communication and involve risks and
uncertainties, many of which are beyond the parties’ control, that
could cause actual results to differ materially from those
expressed or implied in such forward-looking statements. Such risks
and uncertainties include, among others, business interruptions
related to the supply chains of Intel and UMC; inability to develop
or sell products successfully under the collaboration between Intel
and UMC; delays, disruptions, challenges or increased costs in
Intel’s or UMC’s construction or manufacturing expansion of fabs,
whether due to events within or outside of Intel’s or UMC’s
control; expected benefits, including financial benefits, of the
transactions may not be realized; litigation or dispute related to
the transactions or otherwise; unanticipated costs may be incurred
or undisclosed liabilities assumed; risks related to diverting
management’s attention from Intel’s or UMC’s ongoing business
operations; UMC’s ability to develop and execute an effective and
profitable go-to-market strategy; potential adverse reactions or
changes to business relationships (including customers and
suppliers) resulting from the announcement of the transaction;
macroeconomic conditions, including the general economic conditions
affecting the semiconductor industry; regulatory restrictions;
impact of competitive products and pricing; hiring and retention of
key employees; international conflict; and other risks detailed in
Intel’s filings with the Securities and Exchange Commission (the
“SEC”), including those discussed in Intel’s most recent Annual
Report on Form 10-K and in any subsequent periodic reports on Form
10-Q and Form 8-K, and in UMC’s most recent Annual Report on Form
20-F and in any subsequent periodic reports on Form 6-K, each of
which is on file with or furnished to the SEC and available at the
SEC’s website at www.sec.gov. SEC filings for Intel are also
available on Intel’s Investor Relations website at www.intc.com.
SEC filings for UMC are also available on UMC’s Investor Relations
website at www.UMC.com. Readers are cautioned not to place undue
reliance on these forward-looking statements, which speak only as
of the date of this communication. Unless otherwise required by
applicable law, Intel and UMC undertake no obligation to update
these forward-looking statements, whether as a result of new
information, future events or otherwise.
About Intel
Intel (Nasdaq: INTC) is an industry leader, creating
world-changing technology that enables global progress and enriches
lives. Inspired by Moore’s Law, we continuously work to advance the
design and manufacturing of semiconductors to help address our
customers’ greatest challenges. By embedding intelligence in the
cloud, network, edge and every kind of computing device, we unleash
the potential of data to transform business and society for the
better. To learn more about Intel’s innovations, go to
newsroom.intel.com and intel.com.
About UMC
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor
foundry company. The company provides high-quality IC fabrication
services, focusing on logic and various specialty technologies to
serve all major sectors of the electronics industry. UMC’s
comprehensive IC processing technologies and manufacturing
solutions include Logic/Mixed-Signal, embedded High-Voltage,
embedded Non-Volatile-Memory, RFSOI, BCD etc. Most of UMC's 12-in
and 8-in fabs with its core R&D are in Taiwan, with additional
ones throughout Asia. UMC has a total of 12 fabs in production with
a combined capacity of more than 880,000 wafers per month (8-in
equivalent), and all of them are certified with IATF 16949
automotive quality standards. UMC is headquartered in Hsinchu,
Taiwan, plus local offices in the United States, Europe, China,
Japan, Korea, and Singapore, with a worldwide total of 20,000
employees. For more information, please visit:
http://www.umc.com.
© Intel Corporation. Intel, the Intel logo and other Intel marks
are trademarks of Intel Corporation or its subsidiaries. Other
names and brands may be claimed as the property of others.
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Michael Anderson Intel Investor Relations 1-916-356-7704
michael.d.anderson@intel.com
Sophie Won Intel Media Relations 1-408-653-0475
sophie.won@intel.com
Jolie Chiu UMC 886-3-578-2258 x31318 jolie_chiu@umc.com
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