TSMC Achieves 28nm SRAM Yield Breakthrough
August 24 2009 - 4:15AM
PR Newswire (US)
Key process development achievement demonstrates gate-last approach
manufacturing benefits HSINCHU, Taiwan, R.O.C., Aug. 24
/PRNewswire-FirstCall/ -- Taiwan Semiconductor Manufacturing
Company, Ltd. (TWSE: 2330, NYSE: TSM) has become the first foundry
not only to achieve 28nm functional 64Mb SRAM yield, but also to
achieve it across all three 28nm nodes. "Achieving 64Mb SRAM yield
across all three 28nm process nodes is striking. It is particularly
noteworthy because this achievement demonstrates the manufacturing
benefits of the gate-last approach that we developed for the two
TSMC 28nm high-k metal gate processes," explained Dr. Jack Sun,
vice president, Research and Development at TSMC. "This
accomplishment underscores TSMC's process technology capability and
value in 28nm. It shows TSMC is not only able to extend
conventional SiON technology to 28nm, but is also able to deliver
the right 28nm HKMG technology at the same time," explained Dr.
Mark Liu, senior vice president, Advanced Technology Business at
TSMC. The TSMC 28nm development and ramp-up has remained on track
since the announcement made in September of 2008. The 28LP process
is expected to enter risk production at the end of Q1 of 2010,
followed closely by the 28HP risk production at the end of Q2 and
the 28HPL risk production in Q3. The 28nm LP process will serve as
a fast time-to-market and low cost technology ideal for cellular
and mobile applications. The 28nm HP process is expected to support
devices such as CPUs, GPUs, Chipsets, FPGAs, networking, video game
consoles, and mobile computing applications that are performance
demanding. The 28nm HPL process features low power, low leakage,
and medium-high performance. It is aimed to support applications
such as cell phone, smart netbook, wireless communication and
portable consumer electronics that demand low leakage. All 28nm
TSMC processes feature a comprehensive design infrastructure based
on the company's Open Innovation Platform(TM) to extend the power
of the technology to a broad range of differentiating products.
About TSMC TSMC is the world's largest dedicated semiconductor
foundry, providing the industry's leading process technology and
the foundry's largest portfolio of process-proven libraries, IP,
design tools and reference flows. The Company's total managed
capacity in 2008 exceeded 9 million 8-inch equivalent wafers,
including capacity from two advanced 12-inch - GigaFabs(TM), four
eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned
subsidiaries, WaferTech and TSMC (China), and its joint venture
fab, SSMC. TSMC is the first foundry to provide 40nm production
capabilities. Its corporate headquarters are in Hsinchu, Taiwan.
For more information about TSMC please visit http://www.tsmc.com/.
DATASOURCE: TSMC CONTACT: Wendy Matthews, TSMC North America,
+1-408-382-8030, Michael Kramer, Corporate Public Relations,
886-3-5636688, ext., 7126216 Web Site: http://www.tsmc.com/
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