Qualcomm and TSMC Collaborating on 28nm Process Technology
January 08 2010 - 3:00AM
PR Newswire (US)
-- Cutting-edge Semiconductor Technology Enables Mobile Devices to
Offer Greater Functionality and Lower Power Consumption -- SAN
DIEGO and HSINCHU, TAIWAN, R.O.C., Jan. 8 /PRNewswire-FirstCall/ --
Qualcomm Incorporated (NASDAQ:QCOM), a leading developer and
innovator of advanced wireless technologies, products and services,
today announced that the Company is working closely with foundry
partner Taiwan Semiconductor Manufacturing Company (TWSE: 2330,
NYSE: TSM) on 28 nanometer (nm) process technology. The advanced
process node enables more features to be integrated into smaller
chips with a high level of cost efficiency, accelerating the
expansion of wireless into new market segments. Small form factor
and low power consumption are important features of Qualcomm's next
generation of system-on-a-chip (SoC) solutions, including the
Snapdragon(TM) chipset platform. The two companies are capitalizing
on their long-term relationship as Qualcomm works on migrating
directly from the 45nm to the 28nm node. "TSMC prides itself on its
ability to deliver cutting-edge technology platforms, including the
related design ecosystems. Our 28nm platform supports the
high-performance, low-power products that deliver next-generation
experiences," said Jason Chen, vice president of Worldwide Sales
and Marketing. "We are pleased to be working with Qualcomm, a
market leader in wireless technology, on bringing these new
experiences to reality." "Qualcomm's close collaboration with TSMC
has always been a key part of our ability to deliver significant
advantages to our customers through the industry-leading
integration, power efficiency and cost efficiency of our products -
enabling them to do more with less," said Jim Clifford, senior vice
president and general manager of Qualcomm CDMA Technologies.
"Qualcomm's integrated fabless manufacturing model and migration to
smaller geometries will allow us to continue enabling the best
mobile user experience possible on handsets, smartphones and
smartbook devices." Qualcomm and TSMC worked closely on 65nm and
45nm technologies. They are continuing their relationship into
low-power, low-leakage 28nm designs for high-volume manufacturing.
Delivering up to twice the density of previous manufacturing nodes,
28nm technology allows semiconductors that power mobile devices to
do far more with less power. Qualcomm and TSMC are working on both
high-k metal gate (HKMG) 28HP and silicon oxynitride (SiON) 28LP
technologies. Qualcomm expects to tape out its first commercial
28nm products in mid-2010. Close collaboration with strategic
technology and foundry partners is a key part of Qualcomm's
Integrated Fabless Manufacturing (IFM) business model, which
delivers greater efficiencies and accelerated technology
advancement to the industry. About TSMC TSMC is the world's largest
dedicated semiconductor foundry, providing the industry's leading
process technology and the foundry's largest portfolio of
process-proven libraries, IP, design tools and reference flows. The
Company's total managed capacity in 2009 exceeded 10 million 8-inch
equivalent wafers, including capacity from two advanced 12-inch -
GigaFabs(TM), four eight-inch fabs, one six-inch fab, as well as
TSMC's wholly owned subsidiaries, WaferTech and TSMC (China), and
its joint venture fab, SSMC. TSMC is the first foundry to provide
40nm production capabilities. Its corporate headquarters are in
Hsinchu, Taiwan. For more information about TSMC please visit
http://www.tsmc.com/. About Qualcomm Qualcomm Incorporated
(NASDAQ:QCOM) is a leader in developing and delivering innovative
digital wireless communications products and services based on CDMA
and other advanced technologies. Headquartered in San Diego,
Calif., Qualcomm is included in the S&P 100 Index, the S&P
500 Index and is a 2009 FORTUNE 500 company. For more information,
please visit Qualcomm around the Web: http://www.qualcomm.com/
Blog: http://www.qualcomm.com/blog Twitter:
http://www.twitter.com/qualcomm Facebook:
http://www.facebook.com/Qualcomm Qualcomm is a registered trademark
of Qualcomm Incorporated. CDMA2000 is a registered trademark of the
Telecommunications Industry Association (TIA USA). All other
trademarks are the property of their respective owners. DATASOURCE:
TSMC; Qualcomm Incorporated CONTACT: Kira Golin, Qualcomm CDMA
Technologies, +1-858-651-1554, , or Emily Kilpatrick, Corporate
Communications, +1-858-845-5959, , or Warren Kneeshaw, Investor
Relations, +1-858-658-4813, , all of Qualcomm; or Ferda Mehmet of
A&R Edelman, +1-650-762-2946, Mobile, +1-415-308-7877, for
TSMC; or Michael Kramer of TSMC, +886-3-5636688 ext: 7126216, Web
Site: http://www.tsmc.com/
Copyright