TSMC Announces Process Technologies for Integrated LED Drivers
December 15 2009 - 3:30AM
PR Newswire (US)
Integration Features Lowers Overall Systems Component Counts
HSINCHU, Taiwan, R.O.C., Dec. 15 /PRNewswire-FirstCall/ -- Taiwan
Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM)
today unveiled modular BCD (Bipolar, CMOS DMOS) process
technologies targeting high voltage integrated LED driver devices.
The new BCD technologies feature a voltage spectrum running from 12
to 60 volts to support multiple LED applications including LCD flat
panel display backlighting, LED displays, general lighting and
automotive lighting. The technology portfolio spans process nodes
from 0.6-micron to 0.18-micron with a number of digital core
modular options for varying digital control circuit gate densities.
The CyberShuttle(TM) prototyping service supports the 0.25-micron
and 0.18-micron processes for preliminary function verification.
The new processes provide a number of integration features that
reduce a system's component counts. The robust high voltage DMOS
capability provides MOSFET switch integration to reduce the bill of
materials (BOM). The integrated component options include high
voltage bipolar transistors, high voltage, high precision
capacitors, high resistance poly and Zener diodes to reduce
external passive component count and significantly reduce circuit
board area. The DMOS process supports foundry's leading Rdson
performance (i.e.; 72 mohm per mm2 at BV>80 volts for a specific
60V NLDMOS) and its high current driving capability optimizes
device sizes that enhance power efficiency. A robust safe operating
area (SOA) makes it ideal for both power switch and driver design.
Fine detailed characterization also provides a useful reference to
optimize the design budget for optimum chip size. On the CMOS side,
a 5-volt capability supports analog Pulse Width Modulation (PWM)
controller design elements and the 2.5-volt and 1.8-volt logic
cores are optional modules for higher-level digital integration. In
addition, logic compatible one-time programmable (OTP) and
multi-time programmable (MTP) memory options are available for
enhanced digital programming design. "The new BCD technologies for
LED drivers are very leading edge in driving device integration.
The associated PDKs feature highly accurate SPICE models that
really enhance the potential for easy single chip design," points
out George Liu, Director, Industrial Business Development. "In
addition, mismatching models help optimize current mismatching
performance in multi-channel LED driver designs." About TSMC TSMC
is the world's largest dedicated semiconductor foundry, providing
the industry's leading process technology and the foundry's largest
portfolio of process-proven libraries, IP, design tools and
reference flows. The Company's total managed capacity in 2008
exceeded 9 million 8-inch equivalent wafers, including capacity
from two advanced 12-inch -GigaFabs(TM), four eight-inch fabs, one
six-inch fab, as well as TSMC's wholly owned subsidiaries,
WaferTech and TSMC (China), and its joint venture fab, SSMC. TSMC
is the first foundry to provide 40nm production capabilities. Its
corporate headquarters are in Hsinchu, Taiwan. For more information
about TSMC please visit http://www.tsmc.com/. DATASOURCE: TSMC
CONTACT: Ferda Mehmet, A&R Edelman, +1-650-762-2946, mobile,
+1-415-308-7877; Michael Kramer, Corporate Public Relations, TSMC,
886-3-5636688 ext: 7126216 Web Site: http://www.tsmc.com/
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