Fujitsu Microelectronics and TSMC to Collaborate on 28nm Process Technology
August 27 2009 - 12:01AM
PR Newswire (US)
TOKYO and HSIN-CHU, Taiwan, Aug. 27 /PRNewswire-FirstCall/ --
Fujitsu Microelectronics Limited and Taiwan Semiconductor
Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced
that they have agreed to collaborate on 28-nanometer (nm) process
technology targeted for foundry production of Fujitsu
Microelectronics' 28nm logic ICs and to jointly develop an enhanced
28nm high-performance process technology by utilizing TSMC's
advanced technology platform. Previously, both companies announced
that Fujitsu Microelectronics will collaborate with TSMC on 40nm
production. This will extend Fujitsu Microelectronics' 40nm
collaboration with TSMC and covers joint development of an
optimized 28nm high-performance process technology. Initial 28nm
samples are expected to ship toward the end of 2010. This
collaborative effort combines Fujitsu Microelectronics' expertise
and strength in advanced high-speed process and low-power design
technologies with TSMC's expertise and strength in power-efficient
high- performance logic/SoC process and leading-edge technology
platform that is part of the Open Innovation Platform(TM) from
TSMC. Extending the collaboration to 28nm will provide the
opportunity for both companies to capitalize on a competitive and
high-performance 28nm technology based on TSMC's 28nm technology
portfolio that includes high-performance and low-power
applications. The two companies are also discussing possibilities
for collaborating on advanced packaging that could include joint
developments that combine Fujitsu Microelectronics' strengths in
high-performance lead-free and ultra-high-pin count packaging
technologies, with TSMC's strength in chip-package integration and
advanced Cu/ELK interconnect. "We are rapidly progressing in our
previously-announced collaboration with TSMC on 40nm process
technology, with several product designs in progress at present,"
said Haruyoshi Yagi, Corporate Senior Vice President of Fujitsu
Microelectronics Limited. "With this further agreement with TSMC on
28nm high-performance process technology development and
production, we combine both companies' strengths to create greater
value for our customers, and will further drive the growth of
businesses for TSMC and Fujitsu's ASIC and ASSP (*1) core
products." "Fujitsu Microelectronics selected TSMC as a partner
based in part on TSMC's unsurpassed record of developing and
ramping advanced technologies. The agreement today is also a vote
of confidence in TSMC's technology platforms that include design
related considerations such as design kits, design flows, TSMC and
3rd party IP; robust device related documentation, processes
technology excellence and backend assembly and test capabilities,"
said Jason Chen, Vice President, Worldwide Sales and Marketing,
TSMC. Notes: *1: ASIC and ASSP ASIC: Application specific IC.
Customized ICs for specific applications (customers). ASSP:
Application specific standard product. IC products for specific
applications, such as image processing and network-related
processing. Fujitsu Microelectronics Customer Contact: Fujitsu
Microelectronics Limited Business Management Division
Inquiries:https://www-s.fujitsu.com/global/services/microelectronics/conta
ct/form.html About Fujitsu Microelectronics Limited (FML) Fujitsu
Microelectronics Limited designs and manufactures semiconductors,
providing highly reliable, optimal solutions and support to meet
the varying needs of its customers. Products and services include
ASICs/COT, ASSPs, power management ICs, and flash microcontrollers,
with wide-ranging expertise focusing on imaging, wireless,
automotive and security applications. Fujitsu Microelectronics also
drives power efficiency and environmental initiatives.
Headquartered in Tokyo, Fujitsu Microelectronics Limited was
established as a subsidiary of Fujitsu Limited on March 21, 2008.
Through its global sales and development network, with sites in
Japan and throughout Asia, Europe, and the Americas, Fujitsu
Microelectronics offers semiconductor solutions to the global
marketplace. For more information: http://jp.fujitsu.com/fml/en/
About TSMC TSMC is the world's largest dedicated semiconductor
foundry, providing the industry's leading process technology and
the foundry's largest portfolio of process-proven libraries, IPs,
design tools and reference flows. The Company's total managed
capacity in 2008 exceeded 9 million (8-inch equivalent) wafers,
including capacity from two advanced 12-inch GIGAFABs (TM), four
eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned
subsidiaries, WaferTech and TSMC China, and its joint venture fab,
SSMC. TSMC is the first foundry to provide 40nm production
capabilities. Its corporate headquarters are in Hsinchu, Taiwan.
For more information about TSMC please visit http://www.tsmc.com/.
All company or product names referenced herein are trademarks or
registered trademarks of their respective owners. Information
provided in this press release is accurate at time of publication
and is subject to change without advance notice. DATASOURCE: TSMC;
Fujitsu Microelectronics Limited CONTACT: Fujitsu Limited, Public
and Investor Relations Division, Inquiries:
https://www-s.fujitsu.com/global/news/contacts/inquiries/index.html;
or Michael Kramer, Corporate Public Relations, of Taiwan
Semiconductor Manufacturing Company, Ltd., 886-3-563-6688, ext.
712-6216; or TSMC Japan Limited, Press Center, c/o: E&E, Inc.,
81-422-30-8800 Web Site: http://jp.fujitsu.com/fml/en
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