TSMC Launches Unified Interconnect Modeling Format for Advanced Process Technologies
May 27 2009 - 3:03PM
PR Newswire (US)
New iRCX Format Ensure Data Accuracy and Enables Extensive EDA
Support of Interconnect Modeling Related Applications in TSMC 65nm
and 40nm HSINCHU, Taiwan, May 27 /PRNewswire-FirstCall/ -- Taiwan
Semiconductor Manufacturing Company, Ltd.
(TSE:2330TSE:NYSE:TSE:TSM) today unveiled iRCX, an interoperable
electronic design automation (EDA) data format, for TSMC 65
nanometer (nm) and 40nm technologies. iRCX format unifies
interconnect modeling data delivery, ensures data integrity and
interpretation. EDA tools which support iRCX format will be able to
receive accurate interconnect modeling data from the iRCX files
developed and supported by TSMC. Interconnect related EDA
applications, including place & route, RC extraction,
electromigration analysis, power integrity analysis, and
electromagnetic simulation are to benefit from iRCX. iRCX is the
first of several interoperable EDA interface formats co-developed
between TSMC and its design tool partners as part of the TSMC Open
Innovation Platform(TM) (OIP). Interconnect modeling data is
getting more important as chip designs in advanced technologies
require detailed views of the parasitic effects for accurate
evaluation of chip performance and power consumption. TSMC
collaborates extensively with EDA ecosystem partners in the iRCX
initiative, defines the unified format based on TSMC process
requirements, works with EDA partners to implement the new format
support in the tools, and closes the loop by qualifying tool
accuracy against actual silicon measurements, eliminating data
inconsistency, reducing customer tool evaluation time and improving
design accuracy. The qualification result is to be found in TSMC
EDA qualification program on TSMC-Online, the company's customer
portal. Multiple EDA companies are participating in the
qualification program. "TSMC is the first foundry to collaborate
with multiple EDA vendors to create and qualify an interoperable
interconnect modeling format that optimizes data delivery and
interpretation between interconnect extraction, modeling and
analysis tools and advanced process technologies," said Shauh-Teh
Juang, senior director, Design Infrastructure Marketing at TSMC.
"iRCX is part of the TSMC Open Innovation Platform that includes
the Active Accuracy Assurance Initiative. This new unified EDA data
format provides designers the ability to select qualified EDA tools
to match their design needs, improve compliance with TSMC
processes, and ensure design accuracy for first time silicon
success." About TSMC Active Accuracy Assurance Initiative (AAA)
TSMC's AAA initiative is a broad-based program that encompasses all
design ecosystem components. It provides accurate standards for all
TSMC partners, EDA vendors, IP providers, library developers, and
Design Center Alliance (DCA) members. The standards apply to tools,
building blocks, and technologies, including TSMC Reference Flow
9.0, design for manufacturing (DFM) tools, process design kits
(PDK), design support and backend services. About TSMC Open
Innovation Platform The TSMC Open Innovation Platform promotes
timeliness-driven innovation amongst the semiconductor design
community, its ecosystem partners and TSMC's IP, design
implementation and DFM capabilities, process technology and backend
services. The Open Innovation Platform(TM) includes a set of
ecosystem interfaces and collaborative components initiated and
supported by TSMC that efficiently empowers innovation throughout
the supply chain and enables the creation and sharing of newly
created revenue and profitability. TSMC's AAA initiative is a
critical part of the Open Innovation Platform(TM), providing the
accuracy and quality required by ecosystem interfaces and
collaborative components. About TSMC TSMC is the world's largest
dedicated semiconductor foundry, providing the industry's leading
process technology and the foundry's largest portfolio of
process-proven libraries, IP, design tools and reference flows. The
Company's total managed capacity in 2008 exceeded 9 million 8-inch
equivalent wafers, including capacity from two advanced 12-inch -
GigaFabs(TM), four eight-inch fabs, one six-inch fab, as well as
TSMC's wholly owned subsidiaries, WaferTech and TSMC (China), and
its joint venture fab, SSMC. TSMC is the first foundry to provide
40nm production capabilities. Its corporate headquarters are in
Hsinchu, Taiwan. For more information about TSMC please visit
http://www.tsmc.com/. DATASOURCE: Taiwan Semiconductor
Manufacturing Company, Ltd. CONTACT: Wendy Matthews of Taiwan
Semiconductor Manufacturing Company, Ltd., +1-408-382-8030, Web
Site: http://www.tsmc.com/
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