Fujitsu Microelectronics and TSMC to Collaborate on Leading-edge Process Technology
April 30 2009 - 4:00AM
PR Newswire (US)
TOKYO and HSIN-CHU, Taiwan, April 30 /PRNewswire-FirstCall/ --
Fujitsu Microelectronics Limited and Taiwan Semiconductor
Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced
that they will collaborate on leading-edge process technology
production for the manufacturing of Fujitsu Microelectronics'
products. Under an agreement between the companies, Fujitsu
Microelectronics will expand its 40-nanometer generation logic IC
business with production at TSMC's fabs. The collaborative effort
will bring together Fujitsu Microelectronics' IC design
technologies, leading edge imaging and communication intellectual
property (IP), and high-quality technical support to customers,
especially in Japan, with TSMC's foundry-leading process technology
and capability. This advanced technology engagement should enable
both companies to create new business for themselves and for their
prospective customers. The two companies also announced that they
intend to initiate discussions on collaborative development of
high-performance process technologies for 28-nanometer and below
for Fujitsu Microelectronics' product applications. "From the
aspect of its advanced process technologies and large-scale
production capacity, TSMC is the most attractive semiconductor
foundry partner," said Haruki Okada, president of Fujitsu
Microelectronics Limited. "By continuing to create our advantages
in fine-pitch process technologies through this partnership, we can
further grow our ASIC and ASSP (*1) product businesses." "Fujitsu
Microelectronics is clearly a world-class leader in advanced
high-speed and low-power technologies, design engineering, and
differentiated IP. Given TSMC's long-standing commitment to Japan's
semiconductor market, and our on-going investment and dedication to
advanced process technology, our collaboration with Fujitsu
Microelectronics represents a new best-in-class solution for many
system companies," said Dr. Rick Tsai, president & CEO of TSMC.
Notes: *1: ASIC and ASSP ASIC: Application specific IC. Customized
ICs for specific applications (customers). ASSP: Application
specific standard products. IC products for specific applications,
such as image processing and network-related processing. Press
Contacts: Fujitsu Limited Public and Investor Relations Division
Inquiries:
https://www-s.fujitsu.com/global/news/contacts/inquiries/index.html
Taiwan Semiconductor Manufacturing Company, Ltd. Corporate Public
Relations Michael Kramer Phone 886-3-563-6688 Ext. 712-6216 TSMC
Japan Limited Press Center c/o: E&E, Inc. Phone 81-422-30-8800
Fujitsu Microelectronics Customer Inquiries: Management Promotion
Office Fujitsu Microelectronics Limited
https://www-s.fujitsu.com/global/services/microelectronics/contact/form.ht
ml About Fujitsu Microelectronics Limited (FML) Fujitsu
Microelectronics Limited designs and manufactures semiconductors,
providing highly reliable, optimal solutions and support to meet
the varying needs of its customers. Products and services include
ASICs/COT, ASSPs, power management ICs, and flash microcontrollers,
with wide-ranging expertise focusing on imaging, wireless,
automotive and security applications. Fujitsu Microelectronics also
drives power efficiency and environmental initiatives.
Headquartered in Tokyo, Fujitsu Microelectronics Limited was
established as a subsidiary of Fujitsu Limited on March 21, 2008.
Through its global sales and development network, with sites in
Japan and throughout Asia, Europe, and the Americas, Fujitsu
Microelectronics offers semiconductor solutions to the global
marketplace. For more information: http://jp.fujitsu.com/fml/en/
About TSMC TSMC is the world's largest dedicated semiconductor
foundry, providing the industry's leading process technology and
the foundry's largest portfolio of process-proven libraries, IPs,
design tools and reference flows. The Company's total managed
capacity in 2008 exceeded 9 million (8-inch equivalent) wafers,
including capacity from two advanced 12-inch GIGAFABs(TM), four
eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned
subsidiaries, WaferTech and TSMC China, and its joint venture fab,
SSMC. TSMC is the first foundry to provide 40nm production
capabilities. Its corporate headquarters are in Hsinchu, Taiwan.
For more information about TSMC please visit http://www.tsmc.com/.
All company or product names referenced herein are trademarks or
registered trademarks of their respective owners. Information
provided in this press release is accurate at time of publication
and is subject to change without advance notice. DATASOURCE: TSMC
CONTACT: Michael Kramer, Corporate Public Relations of Taiwan
Semiconductor Manufacturing Company, Ltd., 886-3-563-6688, ext.
712-6216; or Press Center of TSMC Japan Limited, c/o: E&E,
Inc., 81-422-30-8800 Web Site: http://jp.fujitsu.com/fml/en
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