Xperi and Tower Semiconductor Announce New License for 3D Stacked Image Sensor Technology
June 10 2020 - 7:00AM
Business Wire
Invensas direct
and hybrid bonding technologies licensed by Tower Semiconductor to
further enhance its outstanding pixel performance and significant
competitive advantages
New technology
license will support manufacturing of time of flight and advanced
sensors for consumer electronics, machine vision, autonomous
vehicles and smart devices
Xperi Holding
Corporation (NASDAQ: XPER) (“Xperi”) and Tower Semiconductor
(NASDAQ/TASE: TSEM) (“Tower”), a global leader in high-value analog
semiconductor foundry solutions, today announced Tower’s license of
Invensas ZiBond® and DBI® 3D semiconductor interconnect
technologies. This technology complements Tower’s manufacturing of
its state of the art stacked wafer BSI sensor platforms for time of
flight (ToF), industrial global shutter and other CMOS image
sensors on 300mm and 200mm wafers. In addition, Tower Semiconductor
will explore the use of Invensas enabling 3D integration
technologies for a broader range of applications, including
memories and MEMS devices.
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“With our fast portfolio expansion, Xperi’s leadership in direct
and hybrid bonding technologies enables us to support the rapidly
evolving requirements of our customer base as they develop
next-generation applications,” said Dr. Avi Strum, Senior Vice
President and General Manager of the Sensors Business Unit, Tower
Semiconductor. “3D stacking architectures and integration are core
to our strategy of providing the highest value, proven analog
semiconductor solutions, including event-driven and time of flight
sensors for mobile, automotive, industrial and high-end photography
applications.”
With the recently released full design kit for hybrid bonding,
Tower’s customers can now design their products on two different
wafers, an imager wafer and a mixed-signal CMOS wafer, that are
then stacked together with electrical connections on a pixel level,
from 10um pitch for applications such as Direct ToF (dToF) and
event-driven sensors, down to 2.5um and even below for applications
such as mobile ToF for face recognition applications. This
separation into two wafers allows very high speed circuitry on the
CMOS side, with very high sensitivity pixels, due to backside
illumination, and extremely low dark current, below 1 electron/sec
per square micron at 60 degrees Celsius, on the imager side.
Tower’s unique platform also allows the use of different Epi
thicknesses for near infrared sensitivity enhancement.
“Tower Semiconductor continues to strengthen its position as a
leading and trusted analog foundry partner of customers around the
world,” said Craig Mitchell, President of Invensas, a wholly owned
subsidiary of Xperi. “Our ZiBond and DBI technologies support the
manufacturing of a wide range of devices. We are excited to partner
with Tower Semiconductor to deploy our foundational 3D integration
technologies into a range of new sensors, in particular time of
flight sensors, which we anticipate will be increasingly utilized
in automotive, mobile and industrial applications. This partnership
continues the strong momentum Xperi has enjoyed as manufacturers
worldwide position themselves to address an evolving range of
industry needs.”
Industry momentum is building around 3D semiconductors that are
smaller, thinner and higher performance to enable a new wave of
applications for automotive, industrial, Internet of Things, edge
computing and consumer device markets. Invensas has achieved
fundamental advances in the semiconductor packaging and
interconnect technologies required to create 3D stacked chips that
satisfy demanding size and performance requirements. Invensas
ZiBond direct bonding technology and DBI hybrid technology are
ideal for high-throughput, low cost-of-ownership fabrication
processes.
About Xperi
Xperi Holding Corporation (Nasdaq: XPER) invents, develops, and
delivers technologies that enable extraordinary experiences. Xperi
technologies, delivered via its brands (including DTS, HD Radio,
IMAX Enhanced, Invensas, and TiVo) and by its startup, Perceive,
make entertainment more entertaining, and smart devices smarter.
Xperi technologies are integrated into billions of consumer
devices, media platforms, and semiconductors worldwide, driving
increased value for partners, customers and consumers. For more
information, please call 408-321-6000 or visit www.xperi.com.
About Tower Semiconductor
Tower Semiconductor Ltd. (NASDAQ: TSEM, TASE: TSEM), the leader
in high-value analog semiconductor foundry solutions, provides
technology and manufacturing platforms for integrated circuits
(ICs) in growing markets such as consumer, industrial, automotive,
mobile, infrastructure, medical and aerospace and defense. Tower
Semiconductor focuses on creating positive and sustainable impact
on the world through long term partnerships and its advanced and
innovative analog technology offering, comprised of a broad range
of customizable process platforms such as SiGe, BiCMOS,
mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors,
integrated power management (BCD and 700V), and MEMS. Tower
Semiconductor also provides world-class design enablement for a
quick and accurate design cycle as well as Transfer Optimization
and development Process Services (TOPS) to IDMs and fabless
companies. To provide multi-fab sourcing and extended capacity for
its customers, Tower Semiconductor operates two manufacturing
facilities in Israel (150mm and 200mm), two in the U.S. (200mm) and
three facilities in Japan (two 200mm and one 300mm) through TPSCo.
For more information, please visit: www.towersemi.com
XPER-I
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version on businesswire.com: https://www.businesswire.com/news/home/20200610005258/en/
Xperi Media Contact: Laura Maurer | +1 617-945-1915 |
xperi@launchsquad.com Xperi Investor Contact: Geri Weinfeld
| +1 818-436-1231 | geri.weinfeld@xperi.com
Tower Semiconductor Company Contact: Orit Shahar |
+972-74-7377440 | oritsha@towersemi.com Tower Semiconductor
Investor Relations Contact: Noit Levy | +972-4-604-7066 |
noitle@towersemi.com
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