Aehr Receives First Order in China for FOX™ Singulated Die Test and Burn-in System for Silicon Photonics Production
August 31 2021 - 7:30AM
Aehr Test Systems (NASDAQ: AEHR), a worldwide
supplier of semiconductor test and reliability qualification
equipment, today announced it has received initial orders totaling
nearly $1.2 million from a new customer in China for its FOX-P™
test and burn-in solution for production test of silicon photonics
devices. This new customer will also be providing contract
manufacturing services to an existing customer of Aehr Test as that
customer ramps production in China as well as other international
markets.
The initial order includes a FOX-NP™ full wafer system and
multiple DiePak Carriers® to be used to meet this customer’s new
product requirements and initial production needs. The system is
configured with two blades which allows for both wafer level as
well as singulated die and module level test and burn-in using
Aehr’s proprietary full wafer WaferPak Contactors or singulated die
and module DiePak Carriers. The system ships within Aehr’s current
fiscal first quarter ending August 31, 2021 with the DiePaks to
follow in the next couple of months.
Gayn Erickson, President and CEO of Aehr Test Systems,
commented, “We are excited to receive our first order in China for
our FOX-P solution, expanding our customer base for silicon
photonics with this new customer that serves international as well
as China markets.
“A key capability that this customer uses on our FOX system and
DiePaks is our ability to make very low current measurements per
device, such that we can directly measure dark currents in the
optical outputs, as well as measure extremely small shifts in the
threshold current per device both before and after burn-in on our
system directly. Dark current is a very small electric
current that flows through photosensitive
devices such as a lasers, LEDs, and photodiode
devices even when no photons are entering the
device.
“Our device specific DiePaks include multiple options for
testing including the ability to precisely provide accurate
voltage, currents, and digital signals as well as monitor
temperature, optical output power, input or output voltages, input
or output currents, input and output power, as well as digital
signatures from a device such as internal registers, temperatures,
and individual device IDs for 100% traceability.
“We continue to be very optimistic about the silicon photonics
and photonics sensors markets and believe they will be significant
growth drivers for Aehr. The rapid growth of integrated optical
devices in data centers and data center interconnect
infrastructure, mobile devices, automotive applications, and now
wearable biosensor markets is driving substantially higher
requirements for initial quality and long-term reliability, and
they are increasing with every new product generation. We believe
these new applications are driving an entirely new level of quality
and reliability expectation for these systems and pose a
significant long-term growth opportunity for Aehr.”
The FOX-XP system, available with multiple WaferPak Contactors
(full wafer test) or multiple DiePak™ Carriers (singulated
die/module test) configurations, is capable of functional test and
burn-in/cycling of integrated devices such as silicon carbide power
devices, silicon photonics as well as other optical devices, 2D and
3D sensors, flash memories, Gallium Nitride (GaN), magnetic
sensors, microcontrollers, and other leading-edge ICs in either
wafer form factor, before they are assembled into single or
multi-die stacked packages, or in singulated die or module form
factor.
About Aehr Test SystemsHeadquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in and testing logic, optical and memory
integrated circuits and has installed over 2,500 systems worldwide.
Increased quality and reliability needs of the Automotive and
Mobility integrated circuit markets are driving additional test
requirements, incremental capacity needs, and new opportunities for
Aehr Test products in package, wafer level, and singulated
die/module level test. Aehr Test has developed and introduced
several innovative products, including the ABTS™ and
FOX-P™ families of test and burn-in systems and FOX
WaferPak™ Aligner, FOX-XP WaferPak Contactor, FOX DiePak®
Carrier and FOX DiePak Loader. The ABTS system is used in
production and qualification testing of packaged parts for both
lower power and higher power logic devices as well as all common
types of memory devices. The FOX-XP and FOX-NP systems are full
wafer contact and singulated die/module test and burn-in systems
used for burn-in and functional test of complex devices, such as
leading-edge memories, digital signal processors, microprocessors,
microcontrollers, systems-on-a-chip, and integrated optical
devices. The FOX-CP system is a new low-cost single-wafer compact
test and reliability verification solution for logic, memory and
photonic devices and the newest addition to the FOX-P product
family. The WaferPak contactor contains a unique full wafer probe
card capable of testing wafers up to 300mm that enables IC
manufacturers to perform test and burn-in of full wafers on Aehr
Test FOX systems. The DiePak Carrier is a reusable, temporary
package that enables IC manufacturers to perform cost-effective
final test and burn-in of both bare die and modules. For more
information, please visit Aehr Test Systems’ website at
www.aehr.com.
Safe Harbor StatementThis press release
contains certain forward-looking statements within the meaning of
Section 27A of the Securities Act of 1933 and Section 21E of the
Securities Exchange Act of 1934. Forward-looking statements
generally relate to future events or Aehr’s future financial or
operating performance. In some cases, you can identify
forward-looking statements because they contain words such as
"may," "will," "should," "expects," "plans," "anticipates,” “going
to,” "could," "intends," "target," "projects," "contemplates,"
"believes," "estimates," "predicts," "potential," or "continue," or
the negative of these words or other similar terms or expressions
that concern Aehr’s expectations, strategy, priorities, plans, or
intentions. Forward-looking statements in this press release
include, but are not limited to, future requirements and orders of
Aehr’s new and existing customers; bookings forecasted for
proprietary WaferPak™ and DiePak consumables; and expectations
related to long-term demand for Aehr’s productions and the
attractiveness of key markets. The forward-looking statements
contained in this press release are also subject to other risks and
uncertainties, including those more fully described in Aehr’s Form
10-K for fiscal 2020, Form 10-Q for the first fiscal quarter of
fiscal 2021 and other reports filed from time to time with the
Securities and Exchange Commission. Aehr disclaims any obligation
to update information contained in any forward-looking statement to
reflect events or circumstances occurring after the date of this
press release.
Contacts: |
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|
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Aehr Test Systems |
MKR Investor Relations Inc. |
Vernon Rogers |
Todd Kehrli or Jim Byers |
EVP of Sales & Marketing |
Analyst/Investor Contact |
(510) 623-9400 x215 |
(323) 468-2300 |
vrogers@aehr.com |
aehr@mkr-group.com |
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