DENSO and USJC Announce Mass Production Shipment of Automotive IGBT, Targeting Expanding Electric Vehicle Market
May 10 2023 - 3:41AM
Business Wire
DENSO CORPORATION (DENSO), a leading mobility supplier, and
United Semiconductor Japan Co., Ltd. (“USJC”), a subsidiary of
global semiconductor foundry United Microelectronics Corporation
(NYSE: UMC; TWSE: 2303) (“UMC”), today announced a joint
collaboration to produce insulated gate bipolar transistors*
(IGBT), which have entered mass production at the 300mm fab of
USJC. A first shipment ceremony was held today to mark this
important milestone. It comes just one year after the companies
announced a strategic partnership for this critical power
semiconductor used in electric vehicles.
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From left, DENSO President Koji Arima,
UMC Co-President Jason Wang (Photo: Business Wire)
As adoption of electric vehicles accelerates, automakers are
seeking to boost powertrain efficiency while also increasing
cost-effectiveness of electrified vehicles. The jointly invested
line at USJC supports the production of a new generation of IGBT
developed by DENSO, which offers 20% reduction in power losses
compared with earlier generation devices. Production is expected to
reach 10,000 wafers per month by 2025.
The ceremony was held today at USJC’s fab in Mie Prefecture,
Japan. Attendees included DENSO President Koji Arima, UMC
Co-President Jason Wang, Director-General of the Commerce and
Information Policy Bureau at Japan’s Ministry of Economy, Trade and
Industry (METI) Satoshi Nohara, Governor of Mie Prefecture
Katsuyuki Ichimi, and Mayor of Kuwana City Narutaka Ito.
“Today, we are thrilled to welcome a memorable shipping ceremony
that symbolizes the partnership between DENSO, UMC and USJC. We are
from different cultures such as semiconductor industry and
automobile industry. However, we have worked steadily with mutual
respect which is a source of our strong competitiveness. DENSO,
together with our trusted partners, will continue to further
accelerate electrification through the production of competitive
semiconductors in order to preserve the global environment and
create a society full of smiles," said Koji Arima, President of
DENSO.
“USJC is proud to be the first semiconductor foundry in Japan to
manufacture IGBT on 300mm wafers, offering customers greater
production efficiency than the standard fabrication on 200mm
wafers. Thanks to our dedicated teams and support from DENSO, we
were able to complete trial production and reliability testing
without delay and honor the mass production date as agreed with the
customer,” said Michiari Kawano, President of USJC.
“It is an honor to be a strategic partner of DENSO, a leading
automotive solution provider to global automakers. This
collaboration fully demonstrates UMC’s manufacturing capability and
our collaborative approach to ensure the success of our foundry
customers,” said Jason Wang, Co-President of UMC. “The
electrification and automation of cars will continue to drive up
semiconductor content, particularly for chips manufactured using
specialty foundry processes on 28nm and above nodes. As a specialty
technology leader, UMC is well positioned to play a bigger role in
the automotive value chain and enabling our partners to capture
opportunities and win market share in this rapidly evolving
industry.”
* Insulated gate bipolar transistor (IGBT) is a core device that
acts as a switch in inverters to convert DC current from batteries
to AC current to drive and control electric vehicle motors. Battery
and plug-in electric cars require significantly more IGBT units
than conventional ICE cars.
About DENSO CORPORATION
Globally headquartered in Kariya, Japan, DENSO is a $47.9
billion leading mobility supplier that develops advanced technology
and components for nearly every vehicle make and model on the road
today. With manufacturing at its core, DENSO invests in around 200
facilities worldwide to provide opportunities for rewarding careers
and to produce cutting-edge electrification, powertrain, thermal
and mobility electronics products, among others, that change how
the world moves. In developing such solutions, the company’s
165,000 global employees are paving the way to a mobility future
that improves lives, eliminates traffic accidents, and preserves
the environment. DENSO spent around 9.0 percent of its global
consolidated sales on research and development in the fiscal year
ending March 31, 2023. For more information about DENSO’s
operations worldwide, visit https://www.denso.com/global.
About UMC
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor
foundry company. The company provides high quality IC fabrication
services, focusing on logic and various specialty technologies to
serve all major sectors of the electronics industry. UMC’s
comprehensive IC processing technologies and manufacturing
solutions include Logic/Mixed-Signal, embedded High-Voltage,
embedded Non-Volatile-Memory, RFSOI and BCD etc. Most of UMC's
12-in & 8-in fabs with its core R&D are located in Taiwan,
with additional ones throughout Asia. UMC has total 12 fabs in
production with combined capacity of approximately 850,000 wafers
per month (8-in equivalent), and all of them are certified with
IATF 16949 automotive quality standard. UMC is headquartered in
Hsinchu, Taiwan, plus local offices in United States, Europe,
China, Japan, Korea & Singapore, with worldwide total 20,000
employees. For more information, please visit:
https://www.umc.com.
Note from UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are
forward-looking within the meaning of the U.S. Federal Securities
laws, including statements about introduction of new services and
technologies, future outsourcing, competition, wafer capacity,
business relationships and market conditions. Investors are
cautioned that actual events and results could differ materially
from these statements as a result of a variety of factors,
including conditions in the overall semiconductor market and
economy; acceptance and demand for products from UMC; and
technological and development risks. Further information regarding
these and other risks is included in UMC’s filings with the U.S.
Securities and Exchange Commission. UMC does not undertake any
obligation to update any forward-looking statement as a result of
new information, future events or otherwise, except as required
under applicable law.
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Media DENSO Corporation Public
Relations Division +81-566-55-9752 denso-pr@jp.denso.com
USJC Corporate and Operation Planning Div. Business Planning
Dept. +81-45-620-2072 usjc-pr@dl.usjpc.com
UMC Corporate Communications Michelle Yun 886-3-578-2258 x16951
michelle_yun@umc.com
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