Teledyne to showcase comprehensive portfolio of industrial and scientific imaging technology at Vision 2021
September 28 2021 - 2:00AM
Teledyne, a part of Teledyne Technologies [NYSE: TDY], and a global
leader in machine vision technology, will exhibit their newest
technologies at Vision 2021 taking place October 5-7, 2021 in
Stuttgart, Germany.
Teledyne will display the world’s most
comprehensive, vertically integrated portfolio of industrial and
scientific imaging technology including the latest from newly
acquired Teledyne FLIR.
Visit the Teledyne booth and explore the unmatched
capabilities and products from Teledyne’s DALSA, e2v, FLIR, and
Lumenera business units. Your one source for
unlimited vision will be on display at Stand 8
B10.
Teledyne will participate in the
Industrial Vision Days with keynote and technology presentations
taking place Wednesday, October 6, 2021:
- At 9:20 AM join Teledyne DALSA’s
Matthias Sonder delivering his presentation
entitled “Clarity at High Speed”
- At 4:20 PM be sure to attend Teledyne e2v’s
Sergio Morillas speaking about “Highly
reliable 3D imaging for challenging applications with
Time-of-Flight”
New products introduced by Teledyne
companies include:
- Linea HS 16K Multifield features charge-domain
CMOS TDI sensor technology with 16k x (64+128+64) TDI arrays and a
5x5μm pixel size. It is the industry’s first TDI camera capable of
capturing up to three images simultaneously in a single scan.
- Sapera™ Vision Software offers field-proven
image acquisition, control, image processing and artificial
intelligence functions to design, develop and deploy
high-performance machine vision applications. In this new release,
the AI tool AstrocyteTM allows learning at runtime for
increased flexibility and performance on deployed systems.
- Topaz CMOS Sensors. New 2MP
and 1.5MP CMOS sensors feature a low noise global shutter
pixel.
- FLIR Lossless Compression:
Break through GigE Bandwidth barriers with Teledyne FLIR’s new
Lossless Compression feature which delivers up to 70% higher FPS
with 100% data integrity.
- Preview a concept Teledyne FLIR camera providing both
SWIR and visible light imaging in a single camera using
Sony’s new SenSWIR technology.
- Quartet Embedded Solution for Nvidia TX2 for easy integration
of multiple cameras including AI capability.
- Achieve flawless 10GigE high speed performance with a new
pre-integrated bundle of the Oryx camera with the Myricom NIC.
Expected release date: Q4 2021.
Click here for an overview
of featured products and demonstrations for Vision 2021.
About Teledyne
Teledyne’s Vision Solutions group form an
unrivaled collective of imaging expertise across the spectrum.
Individually, each company offers best-in-class solutions.
Together, they combine to leverage each other’s strengths and
provide the widest imaging technology portfolio in the world. From
aerospace through industrial inspection, scientific research,
spectroscopy, radiography and radiotherapy, and advanced MEMS and
semiconductor solutions, Teledyne offers worldwide customer support
and the technical expertise to handle the toughest tasks. Their
vision solutions are built to deliver to their customers a unique
and competitive advantage.
A photo accompanying this announcement is available at
https://www.globenewswire.com/NewsRoom/AttachmentNg/f0354ddd-e085-4a22-9b8e-d620205323bc
For media enquiries, please contact:
Jessica.Broom@teledyne.com | + 44 (0)1245 453607
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