TSMC Files Annual Report on Form 20-F for 2019
April 15 2020 - 7:08AM
Business Wire
TSMC (TWSE: 2330, NYSE: TSM), today filed its 2019 annual report
on Form 20-F with the U.S. Securities and Exchange Commission.
The report is available at
https://www.tsmc.com/english/investorRelations/sec_filings.htm.
Hard copies of the report are also available, free of charge, upon
email request to evangeline.sia@citi.com.
ABOUT TSMC
TSMC pioneered the pure-play foundry business model when it was
founded in 1987, and has been the world’s largest dedicated
semiconductor foundry ever since. The Company supports a thriving
ecosystem of global customers and partners with the industry’s
leading process technology and portfolio of design enablement
solutions to unleash innovation for the global semiconductor
industry.
TSMC serves its customers with global capacity of about 13
million 12-inch equivalent wafers per year in 2020, and provides
the broadest range of technologies from 2 micron all the way to
foundry’s most advanced processes, which is 7-nanometer today. TSMC
is the first foundry to provide 7-nanometer production capabilities
and the first to commercialize Extreme Ultraviolet (EUV)
lithography technology in delivering customer products to market in
high volume. TSMC is headquartered in Hsinchu, Taiwan. For more
information about TSMC please visit http://www.tsmc.com.
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version on businesswire.com: https://www.businesswire.com/news/home/20200415005342/en/
TSMC Spokesperson: Wendell Huang Vice President and CFO
Tel: 886-3-505-5901
Media Contacts: Nina Kao Head of PR Department Tel:
886-3-563-6688 ext.7125036 Mobile: 886-988-239-163 E-Mail:
nina_kao@tsmc.com
Hui-Chung Su PR Department Tel: 886-3-563-6688 ext.7125033
Mobile: 886-988-930-039 E-Mail: hcsuq@tsmc.com
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