STMicroelectronics Collaborates with Qualcomm Technologies on Unique Sensor Solutions for Next-Gen Mobile, Connected PC, I...
November 10 2020 - 9:00AM
STMicroelectronics Collaborates with
Qualcomm Technologies on Unique Sensor Solutions for Next-Gen
Mobile, Connected PC, IoT, and Wearable
Applications
Geneva, November 10, 2020 – STMicroelectronics (NYSE:
STM), a global semiconductor leader serving customers
across the spectrum of electronics applications, is extending its
leadership in sensor technologies by developing innovative software
solutions using technology from Qualcomm Technologies, Inc. through
the Qualcomm® Platform Solutions Ecosystem program.
In this program, ST is contributing pre-validated software to
OEMs for its MEMS and other sensing devices to deliver advanced
features to the next generation of smartphones, connected PCs, IoT,
and wearables. Most recently, Qualcomm Technologies has
pre-selected ST’s latest high-accuracy, low-power, motion-tracking
IC with intelligent sensor software, along with ST’s most accurate
pressure sensor, for use in its latest advanced 5G mobile reference
platforms.
The motion-tracking sensor, the new iNEMO LSM6DST is a 6-axis
Inertial Measurement Unit (IMU) that integrates a 3-axis digital
accelerometer and a 3-axis gyroscope into a compact and efficient
System-in-Package. With the industry’s lowest power consumption –
0.55mA in high-performance mode and as little as 4mA in
Accelerometer-only mode -- the LSM6DST enables always-on
high-accuracy motion tracking with minimal impact on power
consumption. In concert with ST’s low-noise (0.65Pa), high-accuracy
(±0.5hPa), and industry-first I3C-enabled LPS22HH pressure sensor,
the pair provides highly accurate location tracking while meeting
the most restrictive power budgets.
For imaging applications, the LSM6DST fully supports EIS and OIS
(Electronic and Optical Image Stabilization) applications as the
module includes a dedicated configurable signal processing path for
OIS and auxiliary SPI, configurable for both the gyroscope and
accelerometer and, in turn, the Auxiliary SPI and primary interface
(SPI / I²C & MIPI I3CSM) can configure the OIS.
Benefiting from ST’s robust and mature low-power ThELMA1 process
technology, the LSM6DST supports and simplifies integration in
low-power circuit designs and offers I²C, MIPI I3C® or SPI
from the sensing element to the application. It also contains a
9-kbyte FIFO to allow dynamic data batching and 16 finite state
machines that recognize programmed data sequences from the sensor
and further reduce system-level power consumption.
“ST has long recognized the importance of sensors in Qualcomm
Technologies’ solutions and has been a strong collaborator for many
years. They have demonstrated leadership in sensors with new
interfaces such as MIPI I3C along with the ability to squeeze the
power budget on its devices while maintaining or increasing sensor
accuracy,” said Manvinder Singh, Vice President, Product
Management, Qualcomm Technologies, Inc. “We are pleased to have ST
join our Qualcomm Platform Solutions Ecosystem program to integrate
and optimize their advanced sensor algorithms on the always-on,
low-power island of our Qualcomm® Snapdragon™ Mobile Platforms.
Collaboration with strategic vendors such as ST is critical to
enabling the fast adoption of 5G technologies in different
verticals.”. “Having worked closely with Qualcomm Technologies for
many years, we’ve been able to assure sensor performance that meets
the demanding requirements of next-generation mobile and wearable
devices and software solutions that can be used with the
Qualcomm® Sensor Execution Environment. These include
advanced features -- such as hinge- or fold-angle detection for
smartphones and Mobile PCs -- and enable the seamless integration
and faster time-to-market of these features that customers across
the globe require,” said Andrea Onetti, Group VP and General
Manager, MEMS Sensor Division, STMicroelectronics. “Combining the
industry’s lowest-power high-accuracy IMU with our high-precision,
robust, and extremely stable-over-time-and-temperature pressure
sensor, can enable the best possible location accuracy to meet e911
and eCall requirements.”
Qualcomm and Snapdragon are trademarks or
registered trademarks of Qualcomm Incorporated.
Qualcomm Snapdragon and Qualcomm Sensor Execution
Environment are products of Qualcomm Technologies, Inc. and/or its
subsidiaries. Qualcomm Platform Solutions Ecosystem program is a
program of Qualcomm Technologies, Inc. and/or its subsidiaries.
About STMicroelectronicsAt ST, we are 46,000
creators and makers of semiconductor technologies mastering the
semiconductor supply chain with state-of-the-art manufacturing
facilities. An independent device manufacturer, we work with our
100,000 customers and thousands of partners to design and build
products, solutions, and ecosystems that address their challenges
and opportunities, and the need to support a more sustainable
world. Our technologies enable smarter mobility, more efficient
power and energy management, and the wide-scale deployment of the
Internet of Things and 5G technology. Further information can be
found at www.st.com.
For Press Information Contact: Michael
Markowitz Director Technical Media Relations STMicroelectronics
Tel: +1 781 591 0354 Email: michael.markowitz@st.com
1 ThELMA (Thick Epitaxial Layer for Micro-gyroscopes and
Accelerometers) is ST’s proprietary surface micromachining process
that combines variably thick and thin poly-silicon layers for
structures and interconnection, enabling the integration of
accelerometer and gyroscope mechanical elements in a single
chip.
- T4291D -- Nov 10 2020 -- ST Qualcomm sensor cooperation_FINAL
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