Dow Electronic Materials Presents Innovations for Circuit Density and Reliability At Electronic Circuits World Convention
November 07 2011 - 9:00PM
Business Wire
Dow Electronic Materials, a business of The Dow Chemical Company
(NYSE:DOW), will present four technical papers at Electronic
Circuits World Convention (ECWC) on November 10th, 2011 at Taipei
Nangang Exhibition Center in Taipei, Taiwan. Dow Electronic
Materials will share innovations that will enable the Printed
Circuit Board (PCB) industry to meet tomorrow’s demands for
enhanced circuit density, reliability, and cost effectiveness at
ECWC as well as TPCA, Productronica, HKPCA shows.
The presentations introduce innovative solutions to customers’
technology requirements in four important areas of PCB fabrication.
The details are as below:
- Title : New Copper Electroplating
Technology for Through Hole Filling
- Summary: Describes new Dow copper
electroplating technology for through hole filling that can improve
PCB reliability, electrical and thermal conductivity, while
reducing process costs.
- Time : November 10th 10:10 am ; R502 ;
ECWC Session 7 : Metallization Technology
- Title : Advanced Semi-Additive Process
(SAP) Metallization Technology
- Summary: How Dow’s SAP metallization
technology enhances the coverage and adhesion of electroless copper
deposits on sequential build dielectric materials, thus improving
the reliability of semiconductor package substrates.
- Time: November 10th 1:30 pm ; R502 ;
ECWC Session 12 : Metallization Technology
- Title : High Speed Direct Current
(HSDC) Copper Electroplating Technology
- Summary: Dow’s HSDC electroplating
technology addresses the challenges of increasing production
throughput while maintaining product reliability and widening
process capability.
- Time: November 10th 3:30 pm ; R502 ;
ECWC Session 12 : Metallization Technology
- Title : Gold Potassium Cyanide
Alternative : Study of Gold Malononitrile in Immersion Gold
- Summary: An evaluation of the use of a
Gold Potassium Cyanide alternative gold salt in Dow’s new immersion
gold process, demonstrating the capability of providing high
quality electroless nickel immersion gold (ENIG) coatings which
satisfy established solderability, reliability and corrosion
resistance performance targets.
- Time: November 10th 5:10 pm ; R503 ;
ECWC Session 13 : Metal Finish
“Dow Electronic Materials is pleased to share these innovations
at ECWC to contribute in meeting the demand for miniaturization and
multi-functionality for electronic devices, as well as establishing
new milestones for the PCB industry,” said Helen Zhang, Global
General Manager, Interconnect Technologies for Dow Electronic
Materials. “With our industry expertise, speed to the market,
global footprint and local talent, we are committed to innovating
with customers to create a connected world.”
Dow Electronic Materials will showcase its innovations at the
following shows this year:
- TPCA Show: Booth K421, Taipei Nanggang
Exhibition Center, Taiwan, November 9-11;
- Productronica Show: Stand 305, Hall B1,
Messe Munich, Germany, November 15-18;
- HKPCA Show: Booth Q23, Hall 1, Shenzhen
Exhibition & Convention Center, China, November 30 - December
2.
®™ Trademark of The Dow Chemical Company (“Dow”) or an
affiliated company of Dow.
About Dow
Dow (NYSE: Dow) combines the power of science and technology
with the "Human Element" to passionately innovate what is essential
to human progress. The Company connects chemistry and innovation
with the principles of sustainability to help address many of the
world's most challenging problems such as the need for clean water,
renewable energy generation and conservation, and increasing
agricultural productivity. Dow's diversified industry-leading
portfolio of specialty chemical, advanced materials, agrosciences
and plastics businesses delivers a broad range of technology-based
products and solutions to customers in approximately
160 countries and in high growth sectors such as electronics,
water, energy, coatings and agriculture. In 2010, Dow had annual
sales of $53.7 billion and employed approximately
50,000 people worldwide. The Company's more than 5,000
products are manufactured at 188 sites in 35 countries
across the globe. References to "Dow" or the "Company" mean The Dow
Chemical Company and its consolidated subsidiaries unless otherwise
expressly noted. More information about Dow can be found at
www.dow.com.
About Dow Electronic Materials
Dow Electronic Materials, a global supplier of materials and
technologies to the electronics industry, brings innovative
leadership to the semiconductor, interconnect, finishing,
photovoltaic, display, LED and optics markets. From advanced
technology centers worldwide, teams of talented Dow research
scientists and application experts work closely with customers,
providing solutions, products and technical service necessary for
next-generation electronics. These partnerships energize Dow’s
power to invent. Its key end-use applications include a broad range
of consumer electronics from personal computers, to television
monitors, cellular phones, global positioning systems, automobile
safety systems, and avionics.
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