SHENZHEN, China, Feb. 25,
2025 /PRNewswire/ -- Building on the innovation
of ultra-compact 7.2mm x 7.2mm eMMC, Longsys (SZ.301308) now
presents its latest advancement ideal for wearable storage use
cases—the ultra-thin 0.6mm (max) ePOP4x, which enables a more
streamlined and efficient device layout.
Ultra-thin Package, High-integration Design
With a maximum thickness of just 0.6mm, it is nearly 25% thinner
than its predecessor (0.8mm), making it one of the slimmest ePOP
products available on the market. Compared to conventional storage
solutions, ePOP4x utilizes cutting-edge packaging technology and a
highly integrated design.
The ePOP4x integrates eMMC and LPDDR4x into a single package,
offering mainstream capacities of 32GB+16Gb and 64GB+16Gb. This
Flash + DRAM combo, paired with a high-performance controller that
supports LDPC error correction, meets the diverse storage and
memory demands of wearable devices.
A package on package (PoP) design allows the chip to be directly
mounted onto the SoC, significantly reducing the PCB footprint and
providing a highly efficient embedded storage solution for
space-constrained wearables.
In-house Firmware, Proprietary Packaging &
Testing
Longsys' ePOP4x is powered by in-house firmware, delivering fast
boot times, ultra-low power consumption, and optimized SoC
compatibility for enhanced performance and battery life.
Additionally, the ePOP4x offers customizable versions tailored to
specific customer requirements, ensuring greater flexibility and
precise storage solutions for various applications.
Backed by its own advanced packaging and testing (OSAT)
facilities in Suzhou, Longsys provides cutting-edge packaging
technology and specialized production lines for storage products.
This dedicated manufacturing approach ensures stable supply,
improves production efficiency, and enables highly customized
solutions that meet the diverse needs of wearable device
manufacturers.
Through the Product Technology Manufacturing (PTM) business
model, Longsys seamlessly integrates proprietary storage chips,
firmware, hardware, and advanced packaging technologies, delivering
storage solutions with a foundry-like model that accelerates
product development and market deployment.
From Ultra-compact eMMC to Ultra-thin ePOP4x
From standardized storage to customized innovations, Longsys
continues to push the boundaries of wearable storage—from the 7.2mm
ultra-compact eMMC to the 0.6mm ultra-thin ePOP4x. These
advancements equip wearable devices with thinner,
higher-performance, and more efficient storage solutions.
Every incremental technological breakthrough has the potential
to drive transformative innovation in wearable devices. Moving
forward, Longsys remains committed to exploring the frontiers of
storage technology, continuously challenging physical limits to
provide optimized storage solutions for next-generation
wearables.
About Longsys
Founded in 1999, Longsys (301308.SZ) is a globally leading
branded semiconductor memory enterprise, integrating R&D,
design, packaging and testing, manufacturing, and sales services.
Longsys upholds the corporate vision of "Everything for memory."
With memory technology innovation at its core, Longsys provides
high-end, flexible, and efficient full-stack customized services to
global customers. For more information please
visit https://www.longsys.com/, and follow Longsys
on LinkedIn, Facebook and Twitter.
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