CommScope(R) Introduces a High-Density, Tool-Less Insulation Displacement Connection Product (TIDC)
June 19 2007 - 3:44PM
PR Newswire (US)
Reliable, High-Density and Fast Cross-Connecting Connector Blocks
for 26-22 Gauge Wire HICKORY, N.C., June 19 /PRNewswire-FirstCall/
-- CommScope, Inc. (NYSE:CTV), a global leader in infrastructure
solutions for communications networks, today announced the
availability of a new high-density, Tool-Less Insulation
Displacement Connection (TIDC). The TIDC product family provides a
low-profile, robust and easy way to wire telecommunications
distribution fields. The reliable three-step connection process
does not require any tools and the accessibility makes operational
testing simple. The high-density design provides up to 50 percent
more connections when compared to other products. The TIDC compact
size is effective particularly where space is limited, such as in
the central office, outside plant or environmental enclosures. "We
are pleased to introduce this user-friendly TIDC product to the
telecommunications market. The new TIDC is representative of how
CommScope continues to research, design and manufacture solutions
that improve performance and reliability," stated Ted Hally,
CommScope executive vice president and general manager, Carrier.
"This new TIDC provides installers with a reliable, three-step
connectorization process that does not require tools or additional
training. The installer simply lifts the toggle, inserts the wire
and presses the toggle closed. Additionally, the TIDC increases the
connection points nearly 50 percent in relation to other products,
which is a positive benefit for network designers," explained
Hally. The CommScope TIDC features a high-density connector that is
ideal for the stringent space requirements typically found in the
central office, mini-huts, remote terminals and electronic
equipment enclosures. The tip and ring holes are color-coded for
easy installation of wires. Wire-wrap terminations are on the base
and can be easily sealed. Both gel-filled and non-gel-filled
versions are available and meet the requirements for outdoor or
controlled environments. Additionally, this design features both
flush mounting and low profile mounting. Openings are designed
within the block for single-pair or multi-pair test probes.
Finally, pass-through holes allow insulation residue to be removed
from the connection point and allow circuits to be daisy chained.
The TIDC product family provides high-density, reliable
interconnection through a well-designed front access that delivers
unobstructed cross- connecting and testing operations. The TIDC is
designed for the central office distributing frame interconnects,
outside plant and building entrance. In addition to TIDC, the
CommScope Carrier group offers various apparatus designed for
switching and transmission applications in telephone central
offices and remote locations. The CommScope Carrier group offers
lab- engineered, integrity cabinet solutions that provide effective
thermal, EMI and environmental protection. The quality of these
integrated cabinet solutions is proven through the global
deployment of over 350,000 cabinets meeting GR-487 requirements. To
learn more, visit CommScope at booth 3857 during NXTComm07, June
19-21, McCormick Center / Chicago. About CommScope CommScope is a
world leader in infrastructure solutions for communication
networks. Through its SYSTIMAX(R) Solutions(TM) and Uniprise(R)
Solutions brands, CommScope is the global leader in structured
cabling systems for business enterprise applications. It is also
the world's largest manufacturer of coaxial cable for Hybrid Fiber
Coaxial applications. Backed by strong research and development,
CommScope combines technical expertise and proprietary technology
with global manufacturing capability to provide customers with
high-performance wired or wireless cabling solutions. This press
release includes forward-looking statements that are based on
information currently available to management, management's
beliefs, as well as on a number of assumptions concerning future
events. Forward-looking statements are not a guarantee of
performance and are subject to a number of uncertainties and other
factors, which could cause the actual results to differ materially
from those currently expected. For a more detailed description of
the factors that could cause such a difference, please see
CommScope's filings with the Securities and Exchange Commission. In
providing forward-looking statements, the company does not intend,
and is not undertaking any obligation or duty, to update these
statements as a result of new information, future events or
otherwise. Visit CommScope at our Web Site:
http://www.commscope.com/ DATASOURCE: CommScope, Inc. CONTACT: Phil
Armstrong, Investor Relations & Corporate Communications of
CommScope, Inc., +1-828-323-4848 Web site:
http://www.commscope.com/
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