Featuring state of the art
performance including multiple depth sensing and distance
measurement applications for a broad range of fast-growing markets
such as mobile, AR/VR, retail, robotics, and
automation
Based on Tower’s leading-edge pixel-level
stacked wafer BSI technology with enhanced NIR
sensitivity
MIGDAL HAEMEK, Israel, and SHENZEN,
China, December 15, 2020 – Tower Semiconductor
(NASDAQ/TASE: TSEM), the leader in high-value analog semiconductor
foundry solutions, and OPIX, an innovative supplier of 3D
Time-of-Flight (ToF) image sensor solutions, today announced the
successful development of a world class iToF technology platform
for 3D imaging and face recognition, featuring multiple depth
sensing and distance measurement applications for a broad range of
markets, based on Tower’s state of the art, pixel level wafer
stacking BSI technology.
The newly developed technology is implemented in
a high-end image sensor product that is being integrated into a 3D
camera module in partnership with a global industry leader of 3D
cameras and imaging systems for mobile applications. This
three-party collaboration produced a unique sensor product that is
perfectly suited to serve a wide variety of fast-growing markets
such as mobile, AR/VR, retail, robotics, automation, and industrial
inspection.
Utilizing TOWER’s 65nm leading pixel-level
stacked BSI CIS technology fabricated in its Uozu, Japan facility,
as well as Tower’s vast expertise in development of iToF image
sensor technology, provided an outstanding platform for the design
of this cutting-edge performing product, a first in a series of
iToF products.
“We are very excited about our collaboration
with the Opix team of experts who helped bring to the market
this new, world-class iToF technology”, said Dr. Avi Strum, Senior
Vice President and General Manager of the Sensors and Displays
Business Unit, Tower Semiconductor. “This highly advanced
technology comprehensively meets the challenging requirements and
specifications of a small sized iToF imager and demonstrates our
notable capabilities and fervent commitment to provide our
customers with market-leading imaging solutions”.
The first sensor that is currently being
prototyped to customers features a 5µm 3-tap state-of-the-art iToF
pixel incorporating a pixel array with resolution of 640x480
pixels. The BSI technology provides excellent sensitivity at NIR
wavelengths. In addition, the wafer stacking enables very
high modulation frequencies of up to 165 MHz and 30 depth frames
per second which results in industry-leading depth accuracy at
short, mid and long-range distances even in challenging ambient
light conditions by using pulse modulation iToF technique. Advanced
features such as multiple acquisition modes,depth with single and
dual frequency, low-power standby modes and an industry standard
MIPI CSI-2 interface, allow very versatile and flexible operation,
providing a cost effective all-in solution, making this product the
ultimate choice for various 3D imaging applications, especially in
the mobile market.
“At Opix, we worked hard during the past 18
months in order to make this development successful. 3D imaging
becomes ubiquitous in all imaging markets nowadays and as a CEO I
am very proud to see us competing already on spec level with known
solutions of tech giants,” said Dr. Xinyang Wang, CEO at
Opix. “With our 100% focus and dedication to 3D imaging and
support of our partners, we have a strong belief we can play an
important role in the coming years to serve the market with
innovative solutions for the emerging 3D imaging
market.”
For more information about Tower Semiconductor’s CMOS Image
Sensor technology platform, please click here.
For more information about Tower Semiconductor’s process
technology offerings, please click here or inquire
at: info@towersemi.com
For more information about Opix technology and
services, please click here.
About OpixOpix, a fabless IC
company with headquarters in Shenzhen, China, is a young and
innovative company dedicated to state-of-the-art 3D Time-of-Flight
(ToF) CMOS-based digital imaging addressing markets such as
consumer applications like mobile phones, industrial automation and
various emerging markets where 3D imaging plays a disruptive role.
Opix is technically and financially backed up by strong partners
who are world leading figures in CMOS design and 3D sensing
applications.Please visit www.opix-opto.com for more
information.
About Tower Semiconductor
Tower Semiconductor Ltd. (NASDAQ: TSEM, TASE:
TSEM), the leader in high-value analog semiconductor foundry
solutions, provides technology and manufacturing platforms for
integrated circuits (ICs) in growing markets such as consumer,
industrial, automotive, mobile, infrastructure, medical and
aerospace and defense. Tower Semiconductor’s focuses on creating
positive and sustainable impact on the world through long term
partnerships and its advanced and innovative analog technology
offering, comprised of a broad range of customizable process
platforms such as SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS
image sensor, non-imaging sensors, integrated power management (BCD
and 700V), and MEMS. Tower Semiconductor also provides world-class
design enablement for a quick and accurate design cycle as well as
Transfer Optimization and development Process Services (TOPS) to
IDMs and fabless companies. To provide multi-fab sourcing and
extended capacity for its customers, Tower Semiconductor operates
two manufacturing facilities in Israel (150mm and 200mm), two in
the U.S. (200mm) and three facilities in Japan (two 200mm and one
300mm) through TPSCo. For more information, please visit
www.towersemi.com.
Safe Harbor Regarding Forward-Looking
StatementsThis press release includes forward-looking
statements, which are subject to risks and uncertainties. Actual
results may vary from those projected or implied by such
forward-looking statements. A complete discussion of risks and
uncertainties that may affect the accuracy of forward-looking
statements included in this press release or which may otherwise
affect Tower’s business is included under the heading “Risk
Factors” in Tower’s most recent filings on Forms 20-F, F-3, F-4 and
6-K, as were filed with the Securities and Exchange Commission (the
“SEC”) and the Israel Securities Authority. Tower does not intend
to update, and expressly disclaim any obligation to update, the
information contained in this release.
- OPIX Face Recognition Final12152020
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