FREMONT,
Calif., March 26, 2024 /PRNewswire/ -- Lam
Research Corp. (Nasdaq: LRCX) today introduced the world's first
production-oriented pulsed laser deposition (PLD) tool to enable
next-generation MEMS-based microphones and radio frequency (RF)
filters. Lam's Pulsus™ PLD system delivers aluminum scandium
nitride (AlScN) films with the highest scandium content available.
This paves the way for advanced consumer and automotive devices
with enhanced performance, capability and functionality. Pulsus is
now shipping to select specialty device manufacturers.
This new deposition technique can help
advance device designs and accelerate product roadmaps in the
specialty market.
The addition of Pulsus PLD to the Lam portfolio further expands
Lam's comprehensive range of deposition, etch and single-wafer
clean products focused on specialty technologies and demonstrates
Lam's continuous innovation in this sector.
"Lam leveraged deep expertise in specialty semiconductor
technologies, proven capabilities in deposition, and a strategic
collaboration with CEA-Leti to bring this game-changing solution to
customers on our production-proven 2300® platform," said
Chris Carter, group vice president
and general manager of the Customer Support Business Group at Lam
Research. "This new deposition technique can help advance device
designs and accelerate product roadmaps in the specialty
market."
Cutting-Edge Films Drive High Performance Devices
RF
filters play a critical role in 5G, WiFi 6 and WiFi 6E performance
by increasing the number of bands a network can handle while also
improving each user's experience. MEMS microphones are valued for a
high signal-to-noise ratio that allows them to capture even muffled
sounds accurately — essential for voice control features and noise
cancellation in 5G-enabled devices.
Pulsus uses breakthrough technology to deposit high-quality
films that optimize RF filters and MEMS microphones. The higher the
scandium level in the film, the better the performance of the
devices. Pulsus delivers films composed of at least 40% scandium —
the highest concentration available today. These films feature low
dielectric loss and twice the piezo coefficient of current
sputtered films, optimizing electrical conversion to drive enhanced
sensitivity in RF filters and better performance in MEMS
microphones. Further, improved piezoelectric qualities make it
feasible to replace lead zirconate titanate (PZT) with lead-free
AlScN.
In Pulsus' PLD process, an intense laser pulse is used to strike
a target material. The target is vaporized, creating a stable,
dense plasma plume that is deposited in thin layers onto a wafer.
This process is vital for achieving high-quality, uniform films
with precise control over thickness and stress. Pulsus represents
the first time lasers have been used for thin film deposition in
high-volume manufacturing.
Pulsus Provides Unique Benefits for Specialty
Technologies
"Demand for manufacturing equipment used to
make MEMS devices grew to over $940M
in 2023 and could keep growing as chipmakers find new ways to
improve device performance. The superior film quality of Pulsus
holds tremendous value for 5G applications that require strong
piezoelectric performance," said John
West, deputy director of manufacturing and global supply
chain at Yole Group. "Pulsus is an innovative solution to help
optimize specialty devices now and advance technology roadmaps for
varied applications to come."
The PLD capabilities of Pulsus, supported by Lam's 2300 platform
design, ensure exceptional film uniformity and quality at a
fraction of the cost per wafer versus conventional deposition
methods. This efficiency can help chipmakers boost manufacturing
yields and accelerate their product roadmaps.
In addition to AlScN, Pulsus can deposit a wide range of
complex, multi-element materials that cannot be applied by other
methods. Lam is exploring new materials to meet the demands of the
specialty technology market for applications such as AR/VR and
quantum computing.
"The Pulsus PLD system is unique in its ability to deposit
numerous materials, including AlScN, with outstanding thin film
properties," said Sothachett Van, head of investment and supplier
partnership group, CEA-Leti. "We are excited to see this
technology mature into a high-volume manufacturing solution for
piezoelectric MEMS devices."
Learn more at www.lamresearch.com.
Media Resources
- Visit the Lam Newsroom to access related images.
- Read the Lam blog.
- Learn more about the Pulsus PLD system.
About Lam Research
Lam Research Corporation is a
global supplier of innovative wafer fabrication equipment and
services to the semiconductor industry. Lam's equipment and
services allow customers to build smaller and better performing
devices. In fact, today, nearly every advanced chip is built with
Lam technology. We combine superior systems engineering, technology
leadership, and a strong values-based culture, with an unwavering
commitment to our customers. Lam Research (Nasdaq: LRCX) is a
FORTUNE 500® company headquartered in Fremont, Calif., with operations around the
globe. Learn more at www.lamresearch.com.
Caution Regarding Forward-Looking
Statements
Statements made in this press release that
are not of historical fact are forward-looking statements and are
subject to the safe harbor provisions of the Private Securities
Litigation Reform Act of 1995. Such forward-looking statements
relate to but are not limited to: market and industry expectations
and the performance of the Pulsus system. Some factors that may
affect these forward-looking statements include: trade regulations,
export controls, trade disputes, and other geopolitical tensions
may inhibit our ability to sell our products; business, political
and/or regulatory conditions in the consumer electronics industry,
the semiconductor industry and the overall economy may deteriorate
or change; the actions of our customers and competitors may be
inconsistent with our expectations; supply chain cost increases and
other inflationary pressures have impacted and are expected to
continue to impact our profitability; supply chain disruptions have
limited and are expected to continue to limit our ability to meet
demand for our products; and natural and human-caused disasters,
disease outbreaks, war, terrorism, political or governmental unrest
or instability, or other events beyond our control may impact our
operations and revenue in affected areas; as well as the other
risks and uncertainties that are described in the documents filed
or furnished by us with the Securities and Exchange Commission,
including specifically the Risk Factors described in our annual
report on Form 10-K for the fiscal year ended June 25, 2023 and quarterly report on Form 10-Q
for the fiscal quarter ended December 24,
2023. These uncertainties and changes could materially
affect the forward-looking statements and cause actual results to
vary from expectations in a material way. The Company undertakes no
obligation to update the information or statements made in this
press release.
Company Contacts:
Allison L. Parker
Media Relations
(510) 572-9324
publicrelations@lamresearch.com
Ram Ganesh
Investor Relations
(510) 572-1615
investor.relations@lamresearch.com
Source: Lam Research Corporation, (Nasdaq: LRCX)
View original content to download
multimedia:https://www.prnewswire.com/news-releases/lam-research-introduces-breakthrough-deposition-technique-to-enable-next-generation-mems-for-5g-and-beyond-302099379.html
SOURCE Lam Research Corporation