Aehr Test Systems to Announce First Quarter Fiscal 2023 Financial Results on October 6, 2022
September 20 2022 - 4:05PM
Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of
semiconductor test and reliability qualification equipment, today
announced that it will report financial results for its first
quarter of fiscal 2023 ended August 31, 2022 on Thursday, October
6, 2022 following the close of the market. The Company will host a
conference call and webcast at 5:00 p.m. Eastern time to discuss
the results.
What: |
Aehr Test
Systems first quarter fiscal 2023 financial results conference
call. |
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|
When: |
Thursday, October 6, at 5:00 p.m. Eastern Time (2:00 p.m.
PT). |
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|
Dial in
Number: |
To access the live call, dial +1 877-270-2148 (US and Canada)
or +1 412-902-6510 (International) and ask to join the Aehr Test
Systems earnings call. |
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|
Webcast: |
To access the live webcast, please visit the investor relations
section at www.aehr.com. |
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Call
Replay: |
A phone replay of the call will be available approximately two
hours following the end of the call and will remain available for
one week. To access the call replay, dial +1 877-344-7529 (US and
Canada) or +1 412-317-0088 (International) and enter replay
passcode 8724719. |
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About Aehr Test SystemsHeadquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in semiconductor devices in wafer level,
singulated die, and package part form, and has installed over 2,500
systems worldwide. Increased quality and reliability needs of the
Automotive and Mobility integrated circuit markets are driving
additional test requirements, incremental capacity needs, and new
opportunities for Aehr Test products in package, wafer level, and
singulated die/module level test. Aehr Test has developed and
introduced several innovative products, including the
ABTS™ and FOX-P™ families of test and
burn-in systems and FOX WaferPak™ Aligner, FOX WaferPak
Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The ABTS
system is used in production and qualification testing of packaged
parts for both lower power and higher power logic devices as well
as all common types of memory devices. The FOX-XP and FOX-NP
systems are full wafer contact and singulated die/module test and
burn-in systems used for burn-in and functional test of complex
devices, such as leading-edge silicon carbide-based power
semiconductors, memories, digital signal processors,
microprocessors, microcontrollers, systems-on-a-chip, and
integrated optical devices. The FOX-CP system is a new low-cost
single-wafer compact test and reliability verification solution for
logic, memory and photonic devices and the newest addition to the
FOX-P product family. The WaferPak Contactor contains a unique full
wafer probe card capable of testing wafers up to 300mm that enables
IC manufacturers to perform test and burn-in of full wafers on Aehr
Test FOX systems. The DiePak Carrier is a reusable, temporary
package that enables IC manufacturers to perform cost-effective
final test and burn-in of both bare die and modules. For more
information, please visit Aehr Test Systems’ website at
www.aehr.com.
Contacts: |
|
Aehr Test Systems |
MKR Investor Relations Inc. |
Ken Spink |
Todd Kehrli or Jim Byers |
Chief Financial Officer |
Analyst/Investor Contact |
(510) 623-9400 x309 |
(323) 468-2300 |
|
aehr@mkr-group.com |
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