ACM Research Strengthens its Fan-Out Panel Level Packaging Portfolio with Launch of Ultra ECP ap-p Tool
August 07 2024 - 6:00AM
ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of
wafer processing solutions for semiconductor and advanced
wafer-level packaging applications, today announced its new Panel
Electrochemical Plating (Ultra ECP ap-p) tool designed for fan-out
panel-level packaging (FOPLP). This new tool employs a horizontal
plating approach achieving exceptional uniformity and precision
across the entire panel.
“As demands for low latency, high bandwidth and
cost-efficiency in semiconductor chips intensify, advanced
packaging technologies like FOPLP are becoming increasingly
critical,” said Dr. David Wang, ACM’s President and Chief Executive
Officer. “We believe FOPLP, with its capability to facilitate
high-density, high bandwidth chip-to-chip connections, offers
substantial growth prospects. We believe the Ultra ECP ap-p tool is
amongst the first to employ horizontal plating for panel
applications, drawing upon ACM’s deep-rooted expertise in wafer
plating and copper processes. We believe the tool will strengthen
the market, enabling advanced packaging with sub-micron features on
large panels, which are especially applicable to GPUs and
high-density high bandwidth memory (HBM).”
The Ultra ECP ap-p tool supports 515mm x 510mm
panel sizes, with an option to expand to 600mm x 600mm. It is
compatible with both organic and glass substrates and includes
capabilities for copper (Cu) via filling, Cu pillar, nickel (Ni),
tin-silver (SnAg) plating, and solder bumping. It accommodates
high-density fan-out (HDFO) products requiring Cu, Ni, SnAg and
gold plating.
ACM’s proprietary technology optimizes the
management of electrical fields, ensuring consistent and uniform
plating across the panel. The horizontal configuration of the tool
reduces the risk of cross-contamination between baths, enhancing
control and cleanliness, crucial for producing large panels with
sub-micron redistribution layers (RDLs) and micro-pillars.
The Ultra ECP ap-p tool incorporates advanced
automation features that enhance efficiency and quality control
throughout the manufacturing process. This automation not only
mirrors traditional wafer processing steps but also adapts them for
larger and heavier panels, including critical operations like panel
flipping for correct orientation and face-down plating.
Forward-Looking Statements
Certain statements contained in this press release are not
historical facts and may be forward-looking statements within the
meaning of the Private Securities Litigation Reform Act of 1995.
Words such as “plans,” “expects,” “believes,” “anticipates,”
“designed,” and similar words are intended to identify
forward-looking statements. Forward-looking statements are based on
ACM management’s current expectations and beliefs, and involve a
number of risks and uncertainties that are difficult to predict and
that could cause actual results to differ materially from those
stated or implied by the forward-looking statements. A description
of certain of these risks, uncertainties and other matters can be
found in filings ACM makes with the U.S. Securities and Exchange
Commission, all of which are available at www.sec.gov. Because
forward-looking statements involve risks and uncertainties, actual
results and events may differ materially from results and events
currently expected by ACM. Readers are cautioned not to place undue
reliance on these forward-looking statements, which speak only as
of the date hereof. ACM undertakes no obligation to publicly
update these forward-looking statements to reflect events or
circumstances that occur after the date hereof or to reflect any
change in its expectations with regard to these forward-looking
statements or the occurrence of unanticipated events.
About ACM Research, Inc.ACM develops,
manufactures and sells semiconductor process equipment for
single-wafer or batch wet cleaning, electroplating, stress-free
polishing, vertical furnace processes, Track and PECVD, which are
critical to advanced semiconductor device manufacturing and
wafer-level packaging. ACM is committed to delivering customized,
high-performance, cost-effective process solutions that
semiconductor manufacturers can use in numerous manufacturing steps
to improve productivity and product yield. For more information,
visit www.acmrcsh.com.
© ACM Research, Inc. The ACM Research logo is trademark of ACM
Research, Inc. For convenience, these trademarks appear in this
press release without ™ symbols, but that practice does not mean
ACM will not assert, to the fullest extent under applicable law,
its rights to such trademarks. All other trademarks are the
property of their respective owners.
Media
Contact: |
Company
Contacts: |
Shannon Blood |
USA |
Kiterocket |
Robert Metter |
+1 208.216.9180 |
+1 503.367.9753 |
sblood@kiterocket.com |
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China |
|
Xi Wang |
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ACM Research (Shanghai),
Inc. |
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+86 21 50808868 |
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Korea |
|
YY Kim |
|
ACM Research (Korea),
Inc. |
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+82 1041415171 |
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Taiwan |
|
David Chang |
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+886 921999884 |
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Singapore |
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Adrian Ong |
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+65 8813-1107 |
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