ACM Research Launches 18-Chamber Single-Wafer Cleaning Tool for Advanced Memory Devices
June 26 2020 - 8:00AM
ACM Research, Inc. (NASDAQ: ACMR), a leading supplier of wafer
cleaning technologies for advanced semiconductor devices, today
introduced its Ultra C VI single wafer tool, the newest addition to
its line of Ultra C cleaning systems. The Ultra C VI targets
high-throughput cleaning of dynamic random-access memory (DRAM) and
3D NAND Flash devices to support increased production scale.
Building on ACM’s proven multi-chamber technology, the new tool
features 18 chambers, representing a 50-percent expansion on the
throughput and 12 chambers included in the Ultra C V system with
the same tool width and only a slightly larger in length to allow
for integration into existing production lines.
“Although memory devices are increasing in complexity, they
still have the same high throughput requirements,” said ACM’s
President and Chief Executive Officer Dr. David Wang. “Additional
cleaning chambers enable memory device makers to support extra
processing steps and more sophisticated drying technology, while
maintaining or reducing production cycle time. We see an 18-chamber
configuration as the sweet spot for this application. Compared to
systems with higher chamber counts, the Ultra C VI provides a
better balance for wafer-per-hour requirements and
factory-automation matching.”
The Ultra C VI performs single-wafer cleaning for advanced DRAM
devices of 1y nm and beyond, as well as advanced 3D NAND devices
with 128 stacked layers and above. It can be used for a variety of
front-end-of-line (FEOL) and back-end-of-line (BEOL) processes
depending on the application and the chemistries involved, such as
BEOL polymer removal, tungsten- or copper-loop post-cleans,
pre-deposition cleans, post-etch and post-chemical mechanical
planarization (CMP) cleaning, deep-trench/via cleans, and RCA
standard cleans.
Multiple chemical combinations can be used during cleaning,
including standard clean (SC1, SC2), hydrofluoric acid (HF),
ozonated deionized water (DI-O3), diluted sulfuric peroxide mixture
(DSP, DSP+), solvent cleaner, or other process chemicals. Up to two
chemicals can be reclaimed and reused, which helps reduce the cost
of consumables and overall cost of ownership. The Ultra C VI can
accommodate optional physical assistant cleaning methods, such as
dual-fluid N2 spray cleaning or ACM’s proprietary SAPS and TEBO
megasonic cleaning technologies. It also offers an isopropyl
alcohol (IPA) drying function that can be applied to patterned
wafers with high aspect ratios. Moreover, as it fits within the
same width as ACM’s existing tools, the tool helps improve fab
utilization and further contributes to lower cost of ownership.
ACM plans to deliver the Ultra C VI tool to a leading memory
manufacturer for evaluation and qualification early in the third
quarter of 2020.
To learn more about the complete line of ACM cleaning solutions,
including the new Ultra C VI system, please visit ACM in Booth
E5223 at SEMICON China, being held June 27-29, 2020, at Shanghai
New International Expo Center; or contact the ACM representative
for your region listed below.
About ACM Research, Inc.ACM develops,
manufactures and sells semiconductor process equipment for single
wafer or batch wet cleaning, electroplating, stress-free polishing
and thermal process are critical to advanced semiconductor device
manufacturing, as well as wafer-level packaging. The company is
committed to delivering customized, high performance,
cost-effective process solutions that semiconductor manufacturers
can use in numerous manufacturing steps to improve productivity and
product yield.
The ACM logo, SAPS, TEBO and ULTRA C are trademarks of ACM
Research, Inc. For convenience, these trademarks appear in this
release without ™ symbols, but that practice does not mean that ACM
will not assert, to the fullest extent under applicable law, its
rights to the trademarks.
Media
Contact:Eric LawsonKiterocket+1
480.276.9572elawson@kiterocket.com |
Company Contact:
U.S.A.Sallyann HenryACM Research, Inc.+1 510.445.3700 |
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ChinaXi WangACM Research (Shanghai), Inc.+86 21 50808868 |
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Korea YY KimACM Research (Korea), Inc.+821041415171 |
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TaiwanArthur Hsu+886 910663885 |
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SingaporeAdrian Ong+65 8813-1107 |
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