Soitec extends partnership with UMC to provide leading engineered substrates for industry’s first 3D IC solution for RF-SOI
June 13 2024 - 2:00AM
Soitec extends partnership with UMC to provide leading engineered
substrates for industry’s first 3D IC solution for RF-SOI
Soitec extends partnership with UMC to
provide leading engineered substrates for industry’s first 3D IC
solution for RF-SOI
- Soitec
and UMC have successfully partnered for over 11 years delivering
leading RF-SOI solutions
- The partnership is now
being extended to upcoming 3D IC solutions for 5G and future
wireless systems operating in millimetre-wave frequencies and
beyond
Bernin (France), June 13, 2024
— Soitec (Euronext Paris), a world leader in designing and
manufacturing innovative semiconductor materials, today announced
the expansion of its partnership with UMC, a leading global
semiconductor foundry company, to bring to the market the
industry’s first 3D IC solution for Radio Frequency
Silicon-on-Insulator (RF-SOI) technology for the 5G era.
UMC’s 3D IC solution for RF-SOI technology
addresses the challenge of incorporating more RF front-end modules
– critical smartphone components that transmit and receive data –
into a single device by vertically stacking dies and utilizing
wafer-to-wafer bonding technology. It reduces die size by more than
45%, enabling customers to integrate more RF components to address
the greater bandwidth requirements of 5G.
Soitec RF-SOI substrates play a vital role in
providing the mechanical and electrical performance needed to
ensure large volume manufacturing of UMC’s solution with no
degradation of radio frequency performance.
Building on a collaborative relationship that
dates back to 2013, Soitec and UMC are proud to highlight their
latest partnership in RF-SOI technology, delivering key innovations
that drive the performance and efficiency of 5G applications
worldwide.
“We are very proud of our longstanding
partnership with UMC, which now extends to the industry‘s first 3D
IC for RF-SOI. The combined experience and expertise of UMC and
Soitec places us in a strong position to drive innovation to meet
the future challenges of energy- and volume-efficient RF Front
Ends. By extending the domain of RF-SOI solutions to 3D
integration, future smartphones will accommodate new frequency
bands envisioned for the 5G-Advance and 6G era, while making room
for new features to come. At the same time, future XR and other IoT
devices will benefit from compact RF Front-Ends, delivering
enhanced data rates while ensuring energy consumption efficiency,”
said Jean-Marc Le Meil, Executive Vice President of the Mobile
Communications Division of Soitec.
“Soitec has been a key partner for UMC in
driving advances in wireless communications over the years with
their state-of-the-art engineered substrates. Leveraging our strong
partnership with Soitec, UMC’s innovative 3D IC solution for RF-SOI
has generated significant interest from customers as they seek to
integrate more RF components in 5G-enabled wireless devices without
compromising on form factor or performance. Going forward, we are
excited to collaborate further with Soitec to target the 5G mmWave
market and beyond,” said Raj Verma, Associate Vice President of
Technology Development at UMC.
About Soitec
Soitec (Euronext - Tech 40 Paris), a world
leader in innovative semiconductor materials, has for more than 30
years developed cutting-edge products that combine technological
performance and energy efficiency. From its global headquarters in
France, Soitec is expanding internationally with its unique
solutions. The company occupies a key position in the semiconductor
value chain, serving three strategic markets: mobile
communications, automotive and industry, and smart devices. Soitec
draws on the talent and diversity of its 2,300 employees, of 50
different nationalities, across its sites in Europe, the United
States and Asia. More than 4,100 patents have been registered by
Soitec.Soitec, SmartSiC™ and Smart Cut™ are registered trademarks
of Soitec.For more information: https://www.soitec.com/en/
ContactMedia relations:
media@soitec.comInvestors relations: investors@soitec.com
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