DALLAS, Nov. 30, 2011 /PRNewswire/ -- Texas Instruments
Incorporated (TI) (NYSE: TXN), the industry leader in highly
integrated wireless connectivity solutions, today announced a sub-1
GHz radio frequency (RF) value line plug-in-board for TI's MSP430™
microcontroller LaunchPad development kit. The new 430BOOST-CC110L
RF BoosterPack includes ETSI-compliant and FCC-certified modules to
help speed development time, reduce certification costs and
eliminate barriers associated with the RF hardware design process.
The RF BoosterPack and MSP430 LaunchPad offer developers affordable
solutions for cost-sensitive sub-1 GHz RF applications such as
remote controls, toys, home and building automation, and security
systems. The 430BOOST-CC110L is available today for
$19, and the MSP430 LaunchPad is
separately available for $4.30. For
more information, see www.ti.com/rfboosterpack-pr.
"We are excited to bring wireless connectivity to the more than
100,000 MSP430 LaunchPads in the market today, and provide a
simple, cost-effective development platform for those looking
to innovate wireless products with MSP430 microcontrollers," said
Erling Simensen, product marketing
manager, Low-Power RF, TI. "By combining TI's leading
ultra-low-power MSP430 microcontrollers with our sub-1 GHz RF value
line transceivers, we are delivering easy-to-use, affordable and
scalable solutions to wirelessly connect more cost-sensitive
consumer applications."
Additionally, the RF module included on the RF BoosterPack is
separately available as an ETSI-compliant and FCC-certified
production-ready module. The A110LR09A RF module is available from
TI third party developer Anaren, Inc., and can be tested using the
430BOOST-CC110L development tool.
Key features and benefits: TI's sub-1 GHz RF
BoosterPack
- Easily add sub-1 GHz wireless connectivity to MSP430 LaunchPad
(MSP-EXP430G2)
- RF BoosterPack contains two plug-in-boards with RF modules
integrating TI's CC110L sub-1 GHz RF value line transceiver,
passive components and compact PCB antenna
- CD with software and documentation
- Easy to use wireless software stack (AIR BoosterStack from
Anaren) makes it easy for developers to add RF to any system
- Reduce development costs
- Sub-$30 total cost for complete
RF BoosterPack development environment: One 430BOOST-CC110L RF
BoosterPack ($19) and two MSP430
LaunchPads ($4.30 each)
- ETSI-compliant and FCC-certified solution eliminates costly
intentional radiator certification process
- No RF hardware design required, designer can add module as an
embedded PCB component
- Free software development tools for writing, debugging and
compiling code on MSP430 value line devices
- Leverage the products' scalability
- Operation in the 868 and 915 MHz bands
- Programs developed on MSP430 LaunchPad can be migrated to
higher-end MSP430 devices
- Production-ready CC110L-based A110LR09A module available
separately from TI third party developer Anaren, Inc.
Tools, availability and pricing
The 430BOOST-CC110L sub-1 GHz RF value line BoosterPack is
available today from TI and through authorized distributors for
$19. The module included on the
BoosterPack is available as a stand-alone product from Anaren
through their authorized distributors. The MSP430 microcontroller
value line LaunchPad development kit is available today for
$4.30 from TI and authorized
distributors.
Find out more about TI's low-power RF solutions and MSP430
microcontrollers
- TI's RF BoosterPack (430BOOST-CC110L):
www.ti.com/rfboosterpack
- TI's sub-1 GHz RF value line: www.ti.com/rfvalueline
- TI's sub-1 GHz RF performance line:
www.ti.com/rfperformanceline
- TI's MSP430 LaunchPad: www.ti.com/launchpad
- TI's wireless connectivity solutions:
www.ti.com/wirelessconnectivity
- TI E2E™ low-power RF & wireless connectivity community:
www.ti.com/lprf-forum
About TI's wireless connectivity portfolio
TI provides the industry's broadest portfolio of mature wireless
connectivity solutions. With expertise in more than a dozen
technologies, TI ensures customers the best-suited wireless
connectivity for every type of application. TI's product portfolio
is complemented with the support and tools that customers and
developers need to quickly and easily bring wirelessly connected
designs to market. Visit the company's Wireless Connectivity Portal
for an overview of TI-supported technologies, the full product
portfolio, and example use cases.
About Texas Instruments
Texas Instruments semiconductor innovations help 80,000
customers unlock the possibilities of the world as it could be –
smarter, safer, greener, healthier and more fun. Our
commitment to building a better future is ingrained in everything
we do – from the responsible manufacturing of our semiconductors,
to caring for our employees, to giving back inside our communities.
This is just the beginning of our story. Learn more at
www.ti.com.
Trademarks
MSP430 and TI E2E is a trademark of Texas Instruments. All other
trademarks belong to their respective owners.
SOURCE Texas Instruments Incorporated