SYNA Synaptics Incorporated

(State or other jurisdiction

of incorporation)

(Commission

File Number)

(I.R.S. Employer

Identification No.)

Rule 13p-1 under the Securities Exchange Act (17 CFR 240.13p-1) for the reporting period from January 1 to December 31, 2023.

Rule 13q-1 under the Securities Exchange Act (17 CFR 240.13q-1) for the fiscal year ended ____.

Conflict Minerals Disclosure and Report.

Exhibit.

Exhibits.

Description

Products

Our Astra^TM platform is a scalable portfolio of intelligent edge processors, ranging from highly integrated microprocessor units, or MPUs, to high-performance microcontroller units, or MCUs, architected for an AI-enabled Internet of Things, or IoT. Supported by the Astra platform, the Synaptics SL and SR Series of AI-native System-on-a-Chip, or SoC, integrated circuits deliver a unified experience combining standards-based open software frameworks, rapid prototyping kits, full-featured AI/machine learning, or ML, toolkits, and Synaptics’ best-in-class Wi-Fi and Bluetooth connectivity solutions.

Our ClearPad^® family of products enables the user to interact directly with the display on electronic devices, such as mobile smartphones, tablets, and automobiles. Our ClearPad has distinct advantages, including low-profile form factor; high reliability, durability, and accuracy; and low power consumption. We typically sell our ClearPad solution as a chip, together with customer-specific firmware, to sensor manufacturers, OLED manufacturers or LCD manufacturers, to integrate into their touch-enabled products.

Our ClearView^TM display driver products offer advanced image processing and low power technology for displays on electronic devices, including smartphones and tablets. ClearView products include adaptive image processing that works in concert with proprietary customization options to enable development of efficient and cost-effective high-performance solutions and faster time to market. Our display driver products offer automatic regional control of color balance that optimizes light and dark areas of an image simultaneously, and sunlight readability enhancement capabilities that optimize image quality under various lighting conditions. Our virtual reality bridge and virtual reality display driver integrated circuit, or DDIC, chips enable our customers to move to higher resolution and faster response displays.

Our TouchView^TM solutions include our TDDI products that combine two functions, a touch controller, and a display driver, into a single chip that incorporates all the features of our ClearView and ClearPad products. TouchView products enable thinner form factors to help customers minimize component count and add flexibility to their industrial designs. These products are used in large screen devices, including notebooks and tablets, and are also certified for automotive display applications.

Our Natural ID^® family of capacitive-based fingerprint ID products is designed for use in notebook PCs, PC peripherals, automobiles, and other applications. Thin form factors provide industrial design flexibility, while robust matching algorithms and anti-spoofing technology provide strong security. Our Natural ID family of products spans a range of form factors, colors, and materials suitable for design on the front, back or side of a device.

Our TouchPad^TM family of products, which can take the place of, and exceed the functionality of a mouse, consists of a touch-sensitive pad that senses the position and movement of one or more fingers on its surface through the measurement of capacitance. Our TouchPad provides an accurate, comfortable, and reliable method for screen navigation, cursor movement, and gestures, and provides a platform for interactive input for both the consumer and corporate markets. Our TouchPad solutions allow our OEMs to provide stylish, simple, user-friendly, and intuitive solutions to consumers. Our TouchPad solutions also offer various advanced features, including scrolling, customizable tap zones, tapping and dragging of icons, and device interaction.

Our SecurePad^TM integrates our Natural ID fingerprint sensor directly into the TouchPad area, improving usability and simplifying the supply chain for notebook PC manufacturers.

Our ClickPad^TM introduces a clickable mechanical design to the TouchPad solution, eliminating the need for physical buttons. The button-less design of our ClickPad allows for unique, intuitive industrial design and makes an excellent alternative to conventional input and navigation devices. Our ClickPad is activated by pressing down on the internal tact switch to perform left-button or right-button clicks and provides tactile feedback similar to pressing a physical button. The latest version of ClickPad features ClickEQTM, a mechanical solution that provides uniform click depth to maximize the surface area available for gestures and improves click performance over hinged designs.

Our ForcePad^® is a thinner version of our ClickPad, which introduces a new dimension in control through the addition of variable force sensitivity. ForcePad is designed to provide consistent performance across OEM models through its design intelligence and self-calibration features. By detecting the amount of force applied, ForcePad is engineered to enable more intuitive and precise user interactions in operating system controls and applications. Designed with thin and light notebooks in mind, ForcePad is 40% thinner than a conventional touch pad.

Our Digital Voice Family, or DVF, of SoC products is a comprehensive solution for developing affordable, scalable and green Voice over IP, or VoIP, home and office products. DVF facilitates rapid introduction of embedded features into residential devices such as cordless IP and instant messaging phones. DVF enables development of low-power enterprise IP, analog terminal adapters, or ATAs, and home VoIP phones that offer superb acoustic echo cancellation, high-quality HD voice, multi-line capabilities, and an enhanced user interface. Built on an open platform with multi-ARM processors running on Linux OS, DVF includes IPfonePro^™, an extensive software development kit for IP phones and ATAs.

Our Digital Enhanced Cordless Telecommunications, or DECT, SoC solutions provide integrated digital solutions and include all relevant digital baseband, analog interface and radio frequency functionality. Enhanced with our hardware and software technologies, these chipsets are highly versatile and enable the development of an array of cordless telephony solutions that allow for faster time to market than alternative custom silicon and software offerings. This portfolio supports cordless phones, cordless headsets, remote controls, home DECT-enabled gateways, fixed-mobile convergence solutions and home automation devices.

Our AudioSmart^® products bring forward optimum analog, mixed-signal and digital signal processor, or DSP, technologies for high-fidelity voice and audio processing. Our AudioSmart products include far-field voice technologies that enable accurate voice command recognition from a distance while disregarding other sounds, such as music, in order to activate smart devices such as smart speakers. AudioSmart also includes personal voice and audio solutions for high-performance headsets that enable active noise cancellation.

Our VideoSmart^TM series SoCs include CPUs running at up to 40K Dhrystone Million Instructions per Second, gaming-grade graphics processing units, or GPUs, voice, and neural network processing units, or NPU. These powerful solutions combine a central processing unit, or CPU, NPU, and GPU, into a single software-enriched SoC. They enable smart multimedia devices including set-top boxes, or STB, over-the-top, or OTT, streaming devices, soundbars, surveillance cameras and smart displays.

Our ImagingSmart^TM solutions include a product portfolio that spans four distinct product areas including document and photo imaging controllers, digital video, fax, and modem solutions. ImagingSmart products leverage image processing IP, JPEG encoders and DSP technology to deliver a wide range of fax, modem, digital video and printer solutions for home, mobile and imaging applications.

Our DisplayLink^® products utilize highly efficient video encode/decode algorithms to deliver a semiconductor-based solution which transmits compressed video frames across low bandwidth connections. These solutions are used in PC docking applications, conference room video display systems, and video casting applications.

Our ConnectSmart^TM video interface integrated circuit portfolio offers a full range of high-speed video/audio/data connectivity solutions that are designed for linking CPUs/GPUs and various endpoints for applications including PC docking stations, travel docks, dongles, protocol converters and virtual reality head mounted displays.

Our wireless connectivity solutions include state-of-the-art Wi-Fi, Bluetooth, GPS, GNSS, and ULE to address broad IoT market applications including home automation, multimedia streamers, security sensors, surveillance cameras, wireless speakers, games, drones, printers, wearable and fitness devices, in addition to numerous other applications which require a wireless connection.

Our ultra-low power edge AI platform includes a highly integrated edge AI SoC designed for battery powered wireless devices equipped with audio or camera capabilities for consumer and industrial IoT applications. These solutions are designed for a wide range of power constrained IoT applications used in office buildings, retail, factories, warehouses, robotics, and smart homes and cities.

Other product solutions we offer include Dual Pointing Solutions, and TouchStyk^TM. Our dual pointing solutions offer TouchPad with a pointing stick in a single notebook computer, enabling users to select their interface of choice. TouchStyk is a self-contained pointing stick module that uses capacitive technology similar to that used in our TouchPad.

Due Diligence

Synaptics identified 91 suppliers, whom we believed could provide materials containing the Minerals necessary to the functionality or production of products manufactured by us or contracted by us to be manufactured.

Synaptics sent out a survey, based on the Template, to the suppliers described in No. 1 above requesting them to (a) determine whether they supplied Synaptics with metals or materials containing the Minerals; (b) conduct independent due diligence on their own supply chain; (c) identify all smelters in their supply chain that supply products containing the Minerals to Synaptics; and (d) download, complete and return the Template to Synaptics identifying all smelters and, using RMI resources, determine whether such smelters were certified as conformant smelters by the RMI’s Responsible Minerals Assurance Process (“RMAP”). For any non-conformant smelters identified, Synaptics strongly recommended the supplier remove such non-conformant smelter from the supplier’s supply chain and required the supplier to submit a plan to Synaptics detailing its efforts to remove or replace the non-conformant smelter. In addition, Synaptics’ suppliers were required to establish and document a policy on conflict minerals.

100% of the suppliers identified in No. 1 above completed the steps described in No. 2 above, and 20 suppliers declared that their products did not contain any of the Minerals. Of the 71 suppliers who stated their products may contain the Minerals, approximately 52% stated gold may be in the products supplied to Synaptics; approximately 62% stated tin may be in the products supplied to Synaptics; approximately 22% stated tantalum may be in the products supplied to Synaptics; approximately 31% stated tungsten may be in the products supplied to Synaptics; approximately 4% stated cobalt may be in the products supplied to Synaptics.

All of the suppliers who responded identified all of the smelters used in their supply chain, in accordance with the Template and its instructions. The 71 suppliers sourced conflict minerals from a combined 272 different smelters, of which 18 smelters were non-conformant smelters, as determined by the RMAP.¹

Smelter data presented in this Report is based on the Responsible Minerals Assurance Process list of Conformant Smelters and Refiners as of March 19, 2024.

Synaptics compared the smelters identified by each of our suppliers to the list of smelters identified as conformant smelters by the RMAP. Approximately 98% of the smelters used by our suppliers for tantalum, gold, tin and tungsten appeared on this list and are certified by the RMAP as conformant smelters. Based on the information provided by our suppliers, Synaptics believes that the facilities used to process the Minerals contained in Synaptics’ products include the smelters listed in Exhibit A below.

Our suppliers used 32 different smelters located in 10 different countries for tantalum. These countries include Brazil, China, Estonia, Germany, India, Japan, Kazakhstan, Mexico, Thailand and the United States of America. Of these smelters, 100% are certified conformant smelters as defined by the RMAP.

Our suppliers used 91 different smelters located in 31 different countries for gold. These countries include Andorra, Australia, Austria, Belgium, Brazil, Canada, Chile, China, Colombia, Czechia, France, Germany, India, Indonesia, Italy, Japan, Kazakhstan, Mexico, Netherlands, Philippines, Poland, Republic of Korea, Singapore, South Africa, Spain, Sweden, Switzerland, Taiwan, Turkey, the United States of America, and Uzbekistan. Of these smelters, approximately 98% are certified conformant smelters as defined by the RMAP.

Our suppliers used 67 different smelters located in 17 different countries for tin. These countries include Belgium, Bolivia, Brazil, China, India, Indonesia, Japan, Malaysia, Myanmar, Peru, the Philippines, Poland, Rwanda, Spain, Taiwan, Thailand, and the United States of America. Of these smelters, approximately 99% are certified conformant smelters as defined by the RMAP.

Our suppliers used 32 different smelters located in 9 different countries for tungsten. These countries include Austria, Brazil, China, Germany, Japan, the Philippines, Taiwan, the United States of America, and Vietnam. Of these smelters, approximately 97% are certified conformant smelters as defined by the RMAP.

Our suppliers used 50 different smelters located in 13 different countries for cobalt. These countries include Australia, Belgium, Canada, China, Democratic Republic of the Congo, Finland, Indonesia, Japan, Madagascar, Morocco, Norway, Russian Federation, South Korea, Taiwan, Thailand, and the United Kingdom of Great Britain and Northern Ireland. RMI has begun to assess whether cobalt smelters and refiners are conformant with applicable RMAP protocols; however, the operational impacts of Covid-19 have continued to cause delays with some RMAP assessments. As of May 22, 2024, RMI has reported 46 cobalt smelters and refiners as conformant with applicable RMAP assessment protocols and 19 cobalt smelters and refiners that are active with respect to progressing to compliance with such protocols. Of the 50 smelters that our suppliers used, 39 are certified conformant smelters as defined by RMAP and 5 are active with respect to progressing to conformant status. We continue to encourage the cobalt refiners in our supply chain to participate in the RMAP process.

Synaptics’ reasonable country of origin inquiry and due diligence efforts are based on surveys provided by its suppliers, which report to Synaptics whether its smelters are certified as conformant smelters. Certain of Synaptics’ suppliers were unable to determine the countries of origin of the Minerals it provided to us, therefore, we are unable, at this time, to conclusively determine the countries of origin of all the Minerals used in our products.

Additional Due Diligence and Risk Mitigation

Smelter Name

Smelter Country